Motorola

About: Motorola is a company organization based out in Schaumburg, Illinois, United States. It is known for research contribution in the topics: Signal & Communications system. The organization has 27298 authors who have published 38274 publications receiving 968710 citations. The organization is also known as: Motorola, Inc. & Galvin Manufacturing Corporation.

Method for communicating data in a wireless communication system

Abstract: The disclosed system is capable of allocating plural subchannels based on user data priority. In one embodiment, a subscriber determines the throughput it would like and fragments a data packet in that number of service data units, and requests that number of subchannel allocations from a serving base station. Upon receipt of the access request(s), including any priority indicators, the system determines from the access request(s) whether to allocate the subchannel(s) to the subscriber. Further access requests are received periodically and scheduled, and when a higher priority message is received, completion of a lower priority message is deferred and the higher priority request allocated. Thus, an improved access procedure is provided accommodating varying throughput rates with a more robust transfer because of the packet fragmentation and multiple-subchannel transfer.

Food storage apparatus and methods and systems for monitoring a food item

Abstract: A food storage apparatus comprises a container (140) for containing a food item, and a cover (142) for covering an opening of the container (140). A first electrical component (144) is associated with the container (140). A second electrical component (146) is associated with the cover (142). The first electrical component (144) communicates with the second electrical component (146) to monitor the food item.

Method for forming a lightly-doped drain (LDD) structure in a semiconductor device

Abstract: A process is disclosed for the formation of an LDD structure in an MOS transistor having a reduced mask count and providing high integrity source/drain junctions. In accordance with one embodiment of the invention an MOS transistor is formed having a gate dielectric overlying an active region of the substrate. A transistor gate is formed in a central portion of the active region and an oxidation layer is formed over the active region and the transistor gate. A lightly-doped source/drain region is formed which is self aligned to the transistor gate. A conformal layer of an oxygen reactive material is formed overlying the transistor gate and the active region. The oxygen reactive material is anisotropically etched in a oxygen plasma reactive ion etch to form a sidewall spacer on the edge the transistor gate. The oxygen reactive ion etch does not penetrate the oxidation layer overlying the active region. A heavily-doped source/drain region is formed which is self aligned to the edge of the sidewall spacer. The sidewall spacer is then removed completing the LDD structure.

Method and system for interference averaging in a wireless communication system

Abstract: A family of methods for interference averaging in multicarrier systems, such as orthogonal frequency division multiplexing (OFDM) systems. The methods can provide interference averaging in situations where an interfering co-channel is either partially or fully loaded. For partially loaded systems, subcarrier puncturing, frequency domain repetition, time domain repetition, and hybrid time-frequency repetition schemes are provided. For systems using adaptive modulation/coding rates, lower rates and transmit power can be selected in order to perform interference averaging in time-spread and frequency-spread OFDM schemes. In systems with downlink power control, frequency domain mixing can be used to perform interference averaging.

Micro-electromechanical system device

Abstract: A Micro-Electromechanical Systems (MEMS) device (100) having conductively filled vias (141). A MEMS component (124) is formed on a substrate (110). The substrate has conductively filled vias (140) extending therethrough. The MEMS component (124) is electrically coupled to the conductively filled vias (140). The MEMS component (124) is covered by a protective cap (150). An electrical interconnect (130) is formed on a bottom surface of the substrate (110) for transmission of electrical signals to the MEMS component (124), rather than using wirebonds.