Institution
Motorola
Company•Schaumburg, Illinois, United States•
About: Motorola is a company organization based out in Schaumburg, Illinois, United States. It is known for research contribution in the topics: Signal & Communications system. The organization has 27298 authors who have published 38274 publications receiving 968710 citations. The organization is also known as: Motorola, Inc. & Galvin Manufacturing Corporation.
Papers published on a yearly basis
Papers
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TL;DR: In this article, it was shown that Fermi-pinning at the polysilicon/metal-oxide interface causes high threshold voltages in MOSFET devices.
Abstract: We report here that Fermi pinning at the polysilicon/metal-oxide interface causes high threshold voltages in MOSFET devices. In Part I, we investigated the different gatestack regions and determined that the polysilicon/metal oxide interface plays a key role on the threshold voltages. Now in Part II, the effects of the interfacial bonding are examined by experiments with submonolayer atomic-layer deposition (ALD) metal oxides and atomistic simulation. Results indicate that pinning occurs due to the interfacial Si-Hf and Si-O-Al bonds for HfO/sub 2/ and Al/sub 2/O/sub 3/, respectively. Oxygen vacancies at polysilicon/HfO/sub 2/ interfaces also lead to Fermi pinning. This fundamental characteristic affects the observed polysilicon depletion.
194 citations
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23 Nov 2010TL;DR: In this paper, the authors present the devices and methods of a communication device including initiating an initial communication via a modem in response to a data pull communication event or a data push communication event, and determining by the controller a measured network condition associated with transmitting the initial communication as well as determining the power consumption of the initial communications based on the measured network conditions processed by monitoring the modem.
Abstract: Disclosed are devices and methods of a communication device including initiating an initial communication via a modem in response to a data pull communication event or a data push communication event and determining by the controller a measured network condition associated with transmitting the initial communication as well as determining by the controller the power consumption of the initial communication based on a measured network condition value processed by monitoring the modem. Methods of a communication device further include comparing the power consumption value with a predetermined power consumption value stored in the memory related to a predetermined acceptable measured network condition value for this type of communication event, and terminating by the controller, the communication when the power consumption value exceeds the predetermined power consumption value based upon the acceptable measured network condition value for this type of communication event.
194 citations
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23 Aug 1996TL;DR: In this article, a two-way voice transceiver was used between a host database (118) and a portable electronic device (10) to transmit and receive data between the host database and the virtual image display (20).
Abstract: A portable electronic device (10) including a virtual image display (20) positioned within a housing (11) or a remote unit (30), capable of providing an image of information contained on a smart card (18) as well as transactions processed in response to data transmitted by a two-way voice transceiver (24) between a host database (118) and the portable electronic device (10). A sensor (19) constructed to have the smart card (18) positioned adjacent thereto in data sensing juxtaposition and electronics (22) connected to the sensor (19) for processing data between the host database (118) and the portable electronic device (10), and for reading and writing data to the smart card (18). The two-way voice communications transceiver (24) for transmitting and receiving data between the portable electronic device (10) and the host database (118), and the virtual image display (20) for supplying image data.
194 citations
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29 Apr 1981TL;DR: In this paper, an in situ self-diagnostic automotive alternator battery charging system is disclosed, which consists of a battery, voltage regulator, and an alternator driven by a vehicle engine.
Abstract: An in situ self-diagnostic automotive alternator battery charging system is disclosed. Included are: a battery; voltage regulator sensing battery voltage and generating an excitation signal; and an alternator driven by a vehicle engine provide a rectified electrical signal to charge the battery in response to the excitation signal. Electronic circuit status detectors, variously coupled to the battery, voltage regulator and alternator, maintain a first logic state when a corresponding signal characteristic is within a predetermined range and a second logic state when the corresponding characteristic is outside the predetermined range. Combinatorial logic means respond to a logic state sequence from the detectors to identify predetermined sequences of the logic states resulting in the identification of faults in the charging system. The logic means also provides a warning to the operator of detection of a fault and a display of the location of the fault as occurring in one of the major components of the charging system.
194 citations
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02 Sep 1994TL;DR: In this paper, a semiconductor die is mounted over a power supply surface (24, 52, 62), and signal bonding pads are wire bonded to corresponding leads (38) of a leadframe.
Abstract: A semiconductor die (14) is mounted over a power supply surface (24, 52, 62). Signal bonding pads (18) on the die are wire bonded to corresponding leads (38) of a leadframe. Power supply bonding pads (20, 21) on the die are wire bonded to the power supply surface. A package body (22, 42, 56) surrounds the semiconductor die, the wire bonds (32, 34, 40, 40'), and the power supply surface. The power supply pad terminals are accessible from the bottom of the package body of the device through a plurality of conductive apertures (28, 56) disposed in the lower half of the package body. Power supply solder bumps (12, 58) are connected to the power supply surface inside the package body through the conductive apertures. The leads are used provide input and out signals for the device around the periphery of the device, while the solder bumps are disposed in an array format on the package body.
194 citations
Authors
Showing all 27298 results
Name | H-index | Papers | Citations |
---|---|---|---|
Georgios B. Giannakis | 137 | 1321 | 73517 |
Yonggang Huang | 136 | 797 | 69290 |
Chenming Hu | 119 | 1296 | 57264 |
Theodore S. Rappaport | 112 | 490 | 68853 |
Chang Ming Li | 97 | 896 | 42888 |
John Kim | 90 | 406 | 41986 |
James W. Hicks | 89 | 406 | 51636 |
David Blaauw | 87 | 750 | 29855 |
Mark Harman | 83 | 506 | 29118 |
Philippe Renaud | 77 | 773 | 26868 |
Aggelos K. Katsaggelos | 76 | 946 | 26196 |
Min Zhao | 71 | 547 | 24549 |
Weidong Shi | 70 | 528 | 16368 |
David Pearce | 70 | 342 | 25680 |
Douglas L. Jones | 70 | 512 | 21596 |