Motorola

About: Motorola is a company organization based out in Schaumburg, Illinois, United States. It is known for research contribution in the topics: Signal & Communications system. The organization has 27298 authors who have published 38274 publications receiving 968710 citations. The organization is also known as: Motorola, Inc. & Galvin Manufacturing Corporation.

Security analysis in role-based access control

Abstract: The administration of large role-based access control (RBAC) systems is a challenging problem. In order to administer such systems, decentralization of administration tasks by the use of delegation is an effective approach. While the use of delegation greatly enhances flexibility and scalability, it may reduce the control that an organization has over its resources, thereby diminishing a major advantage RBAC has over discretionary access control (DAC). We propose to use security analysis techniques to maintain desirable security properties while delegating administrative privileges. We give a precise definition of a family of security analysis problems in RBAC, which is more general than safety analysis that is studied in the literature. We show that two classes of problems in the family can be reduced to similar analysis in the RT[L∩] role-based trust-management language, thereby establishing an interesting relationship between RBAC and the RT framework. The reduction gives efficient algorithms for answering most kinds of queries in these two classes and establishes the complexity bounds for the intractable cases.

Pad array carrier IC device using flexible tape

Abstract: An electronic pad array carrier IC device for mounting on a printed circuit board (PCB) or flex circuit substrate has a thin, flexible "tape" substrate having a plurality of traces The substrate may be a polyimide or other material that can withstand relatively large lateral mechanical displacement An integrated circuit die is mounted in proximity with or on the substrate and electrical connections between the integrated circuit chip and the traces are made by any conventional means The substrate traces are provided at their outer ends with solder balls or pads for making connections to the PCB A package body covers the die, which body may be optionally used to stand off the package a set distance from the PCB so that the solder balls will form the proper concave structure Alternatively, a carrier structure may be provided around the periphery of the substrate to add rigidity during handling, testing and mounting, but which may also provide the stand-off function The thin, flexible substrate can absorb a relatively large lateral or even vertical mechanical displacement over a rather large package area that may accommodate as few as 20 or as many 500 or more connections The substrate may be optionally transparent or translucent to permit inspection of the bonds after mounting to the PCB The PCB or flex circuit may also be transparent or translucent for bond inspection purposes The solder pads or balls may be joined to a via through the substrate at least partially filled with electrically conductive material to permit back side testing of the carrier before or after mounting of the package to the PCB Additionally, a heat sink structure may be directly bonded to the die in the pad array carrier IC device

Sensor controlled user interface for portable communication device

Abstract: A portable communication device ( 100 ) that has a processing section ( 208 ) to control operation of the portable communication device ( 100 ) in response to an input signal (TS_INPUT) and a user interface having a touch sensitive input device ( 128 ) for generating the input signal (TS_INPUT), also has a sensor ( 134 ). The sensor ( 134 ) disables the touch sensitive input device ( 128 ) from generating the input signal (TS_INPUT) when the portable communication device ( 100 ) is positioned in close proximity to a user and, thereby, preventing inadvertent actuations while the user holds the portable communication device ( 100 ) against his or her head to facilitate communication.

First-Principles Study of Boron Diffusion in Silicon

Abstract: In this Letter we investigate boron diffusion as a function of the Fermi-level position in crystalline silicon using ab initio calculations. Based on our results, a new mechanism for B diffusion mediated by Si self-interstitials is proposed. Rather than kick out of B into a mobile channel, we find a direct diffusion mechanism for the boron-interstitial pair for all Fermi-level positions. Our activation energy of $3.5--3.8$ eV, migration barrier of $0.4--0.7$ eV, and diffusion-length exponent of $\ensuremath{-}0.6$ to $\ensuremath{-}0.2$ eV are in excellent agreement with experiment.

Transaction system and method therefor

Abstract: A peer device (132) is arranged and programmed for handling a transaction at a point of sale provided by a merchant, and a personal presence identifier (122) is carried by a user and coupled to the peer device by a short-range two-way wireless link. The peer device and the personal presence identifier are arranged and programmed to establish a two-way personal area network (22) with one another when the personal presence identifier is within wireless transmission range of the peer device. The personal presence identifier and the peer device are also arranged and programmed to exchange needs specifications (70) and capability specicifications (72) with one another after establishing the two-way personal area network.