NEC

About: NEC is a company organization based out in Tokyo, Japan. It is known for research contribution in the topics: Signal & Layer (electronics). The organization has 33269 authors who have published 57670 publications receiving 835952 citations. The organization is also known as: NEC Corporation & NEC Electronics Corporation.

Plasma deposition of low-dielectric-constant fluorinated amorphous carbon

Abstract: Fluorinated amorphous carbon thin films (a-C:F) for use as low-dielectric-constant interlayer dielectrics are deposited by helicon-wave plasma enhanced chemical vapor deposition. To improve their thermal stability, the feasibility of adjusting the fluorine-to-carbon (F/C) ratio by changing the deposition pressure was investigated. Decreasing the pressure increased the dissociation of a source fluorocarbon material in the plasma and decreased the F/C ratio of the deposited film. Both the thermal stability and the dielectric constant of the a-C:F films were increased as the F/C ratio was decreased. Thus, there is a tradeoff relationship between a low dielectric constant and high thermal stability and the tradeoff could be optimized by the pressure during deposition. The mechanism of the pressure dependency of the dielectric constant of a-C:F films was investigated by quantifying the contribution of each polarization and found that a decrease in the dielectric constant of a-C:F films can be attributed to dec...

Apparatus and method for communication

Abstract: A communication apparatus and a communication method realizing highly amusing features and merchantability. A face image of the sender of a text message changes according to the contents of the message, especially symbols, marks and the like which indicate an emotional state in the message. Thereby, an image suitable for each symbol, mark or the like which indicates an emotional state in the text message is selectively displayed on a screen. Thus, the user of a communication apparatus can immediately understand sender's feeling without reading all the text message.

Parallel Implementation of Dispersive Tsunami Wave Modeling with a Nesting Algorithm for the 2011 Tohoku Tsunami

Abstract: Because of improvements in offshore tsunami observation technology, dispersion phenomena during tsunami propagation have often been observed in recent tsunamis, for example the 2004 Indian Ocean and 2011 Tohoku tsunamis. The dispersive propagation of tsunamis can be simulated by use of the Boussinesq model, but the model demands many computational resources. However, rapid progress has been made in parallel computing technology. In this study, we investigated a parallelized approach for dispersive tsunami wave modeling. Our new parallel software solves the nonlinear Boussinesq dispersive equations in spherical coordinates. A variable nested algorithm was used to increase spatial resolution in the target region. The software can also be used to predict tsunami inundation on land. We used the dispersive tsunami model to simulate the 2011 Tohoku earthquake on the Supercomputer K. Good agreement was apparent between the dispersive wave model results and the tsunami waveforms observed offshore. The finest bathymetric grid interval was 2/9 arcsec (approx. 5 m) along longitude and latitude lines. Use of this grid simulated tsunami soliton fission near the Sendai coast. Incorporating the three-dimensional shape of buildings and structures led to improved modeling of tsunami inundation.

Semiconductor device and manufacturing method of the same

Abstract: Semiconductor device 3 comprises semiconductor chip 11, Au ball bumps 21 formed on pad electrodes 12 with a stud bump method, and thermoplastic adhesive layer 22 provided on the surface of semiconductor chip 11 on which pad electrodes 12 are formed, in which the tops of Au ball bumps 21 project from the surface of adhesive layer 22. Reliable bonding can be realized by forming the bumps for electrical connection and the adhesive resin having an adhesion function on the semiconductor chip. In addition, the present invention provides a method of bonding a copper foil to a semiconductor wafer to form a wiring pattern, a multi chip module in which electrical connection is established by bumps bonded to each other through an adhesive layer, and the like.

Resonator antenna and communication apparatus

Abstract: A resonator antenna includes a first conductor pattern as a first conductor, a second conductor pattern as a second conductor, a plurality of first openings, a plurality of interconnects, and a power feed line. The first conductor pattern has, for example, a sheet shape. The second conductor pattern has, for example, a sheet shape, and at least a portion thereof (which, however, may be nearly the entirety thereof) faces the first conductor pattern. A plurality of first openings is provided in the first conductor pattern. The interconnect is provided in each of a plurality of first openings, and one end thereof is connected to the first conductor pattern. The power feed line is connected to the first conductor pattern. Unit cells including the first opening and the interconnect are repeatedly, for example, periodically disposed.