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Institution

NEC

CompanyTokyo, Japan
About: NEC is a company organization based out in Tokyo, Japan. It is known for research contribution in the topics: Signal & Layer (electronics). The organization has 33269 authors who have published 57670 publications receiving 835952 citations. The organization is also known as: NEC Corporation & NEC Electronics Corporation.


Papers
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Journal ArticleDOI
01 Jan 2005
TL;DR: The authors proposed a semi-automatic method that uses particular cooccurrence patterns of evaluated subjects, focused attributes and value expressions to accelerate the process of extracting evaluative expressions from web documents.
Abstract: Automatic extraction of human opinions from Web documents has been receiving increasing interest. To automate the process of opinion extraction, having a collection of evaluative expressions such as “something is confortable” would be useful. However, it can be costly to manually create an exhaustive list of such expressions for many domains, because they tend to be domain-dependent. Motivated by this, we explored ways to accelerate the process of collecting evaluative expressions by applying a text mining technique. This paper proposes a semi-automatic method that uses particular cooccurrence patterns of evaluated subjects, focused attributes and value expressions.

105 citations

Patent
Masayuki Shinohara1
22 Oct 1997
TL;DR: An asynchronous transfer mode switching system including a core switch section (CS102) in an output buffer-type configuration which has an ATM switching function between high-rate input and output ports, an input buffer module section (IXB20) which multiplexes plural low-rate output line to the high rate input port of the core switch Section.
Abstract: An asynchronous transfer mode switching system including a core switch section (CS102) in an output buffer-type configuration which has an ATM switching function between high-rate input and output ports, an input buffer module section (IXB20) which multiplexes plural low-rate input line to the high-rate input port of the core switch section, and an output buffer module section (OXB30) which separates the output of a high-rate output port of the CS into plural low-rate output lines. The IBX enables queuing for each output line and each service class. The OXB enables queuing for output line and service class accommodated by itself. When the buffer occupancy exceeds a threshold value, the OXB originates a cell inhibiting signal to the CS. When the queue length for each output port exceeds a threshold value, the CS originates the cell inhibiting signal to all IXBs. The IXB controls to stop a cell transmission according to the cell inhibiting signal. An execution throughput is increased by suppressing occurrence of congestion inside an ATM exchange. The evenness of throughput is guaranteed between virtual channels using the same output line.

105 citations

Patent
Takashi Fujii1
31 Jul 1992
TL;DR: In this paper, a phase-locked loop with first and second frequency demultipliers, and a plurality of phase/frequency detectors is presented, and the phase of the second signal is adjusted to be synchronized with the first signal.
Abstract: A phase-locked loop according to the present invention includes first and second frequency demultipliers, and a plurality of phase/frequency detectors. The first and second frequency demultipliers divide frequency of first and second signals by a predetermined number. Each of the plurality of phase/frequency detectors compares two signals supplied from the first and second frequency demultipliers. In accordance with a comparison result of the plurality of phase/frequency detectors, phase of the second signal is adjusted to be synchronized with the first signal.

105 citations

Patent
Tadao Yasuzato1, Keizo Sakurai1
06 Jun 1990
TL;DR: In this article, a process of forming bumps on respective electrodes (118a to 118v) of a semiconductor chip (SC21) comprises the steps of a) preparing a bonding apparatus equipped with a bonding tool (114) three-dimensionalally movable, b) forming a small ball at the leading end of a bonding wire passing through the bonding tool, c) causing the tool to press the small ball against the upper surface of one of the electrodes for bonding thereto, d) moving the tool in a direction leaving from the upper surfaces of the electrode by a distance
Abstract: A process of forming bumps on respective electrodes (118a to 118v) of a semiconductor chip (SC21) comprises the steps of a) preparing a bonding apparatus equipped with a bonding tool (114) three-dimensionally movable, b) forming a small ball at the leading end of a bonding wire passing through the bonding tool, c) causing the bonding tool to press the small ball against the upper surface of one of the electrodes for bonding thereto, d) moving the bonding tool in a direction leaving from the upper surface of the electrode by a distance, e) moving the bonding tool in a horizontal direction (X21 or Y21) substantially parallel to the upper surface of the electrode so that the bonding wire is cut from the small ball with the leading end of the bonding tool, and f) repeating the steps b) to e) for producing bumps on the respective upper surfaces of the other electrodes, in which the horizontal direction is different depending upon the location of the electrode.

105 citations

Journal ArticleDOI
Hidefumi Hiura1
TL;DR: In this article, a scanning tunneling microscope (STM) was used to tailor graphite surface from one to several layers in depth using water-adsorbed graphite surfaces.

105 citations


Authors

Showing all 33297 results

NameH-indexPapersCitations
Pulickel M. Ajayan1761223136241
Xiaodong Wang1351573117552
S. Shankar Sastry12285886155
Sumio Iijima106633101834
Thomas W. Ebbesen9930570789
Kishor S. Trivedi9569836816
Sharad Malik9561537258
Shigeo Ohno9130328104
Adrian Perrig8937453367
Jan M. Rabaey8152536523
C. Lee Giles8053625636
Edward A. Lee7846234620
Otto Zhou7432218968
Katsumi Kaneko7458128619
Guido Groeseneken73107426977
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Performance
Metrics
No. of papers from the Institution in previous years
YearPapers
20238
202220
2021234
2020518
2019952
20181,088