Institution
NEC
Company•Tokyo, Japan•
About: NEC is a company organization based out in Tokyo, Japan. It is known for research contribution in the topics: Signal & Layer (electronics). The organization has 33269 authors who have published 57670 publications receiving 835952 citations. The organization is also known as: NEC Corporation & NEC Electronics Corporation.
Topics: Signal, Layer (electronics), Terminal (electronics), Base station, Transmission (telecommunications)
Papers published on a yearly basis
Papers
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01 Jan 2005TL;DR: The authors proposed a semi-automatic method that uses particular cooccurrence patterns of evaluated subjects, focused attributes and value expressions to accelerate the process of extracting evaluative expressions from web documents.
Abstract: Automatic extraction of human opinions from Web documents has been receiving increasing interest. To automate the process of opinion extraction, having a collection of evaluative expressions such as “something is confortable” would be useful. However, it can be costly to manually create an exhaustive list of such expressions for many domains, because they tend to be domain-dependent. Motivated by this, we explored ways to accelerate the process of collecting evaluative expressions by applying a text mining technique. This paper proposes a semi-automatic method that uses particular cooccurrence patterns of evaluated subjects, focused attributes and value expressions.
105 citations
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NEC1
TL;DR: An asynchronous transfer mode switching system including a core switch section (CS102) in an output buffer-type configuration which has an ATM switching function between high-rate input and output ports, an input buffer module section (IXB20) which multiplexes plural low-rate output line to the high rate input port of the core switch Section.
Abstract: An asynchronous transfer mode switching system including a core switch section (CS102) in an output buffer-type configuration which has an ATM switching function between high-rate input and output ports, an input buffer module section (IXB20) which multiplexes plural low-rate input line to the high-rate input port of the core switch section, and an output buffer module section (OXB30) which separates the output of a high-rate output port of the CS into plural low-rate output lines. The IBX enables queuing for each output line and each service class. The OXB enables queuing for output line and service class accommodated by itself. When the buffer occupancy exceeds a threshold value, the OXB originates a cell inhibiting signal to the CS. When the queue length for each output port exceeds a threshold value, the CS originates the cell inhibiting signal to all IXBs. The IXB controls to stop a cell transmission according to the cell inhibiting signal. An execution throughput is increased by suppressing occurrence of congestion inside an ATM exchange. The evenness of throughput is guaranteed between virtual channels using the same output line.
105 citations
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NEC1
TL;DR: In this paper, a phase-locked loop with first and second frequency demultipliers, and a plurality of phase/frequency detectors is presented, and the phase of the second signal is adjusted to be synchronized with the first signal.
Abstract: A phase-locked loop according to the present invention includes first and second frequency demultipliers, and a plurality of phase/frequency detectors. The first and second frequency demultipliers divide frequency of first and second signals by a predetermined number. Each of the plurality of phase/frequency detectors compares two signals supplied from the first and second frequency demultipliers. In accordance with a comparison result of the plurality of phase/frequency detectors, phase of the second signal is adjusted to be synchronized with the first signal.
105 citations
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NEC1
TL;DR: In this article, a process of forming bumps on respective electrodes (118a to 118v) of a semiconductor chip (SC21) comprises the steps of a) preparing a bonding apparatus equipped with a bonding tool (114) three-dimensionalally movable, b) forming a small ball at the leading end of a bonding wire passing through the bonding tool, c) causing the tool to press the small ball against the upper surface of one of the electrodes for bonding thereto, d) moving the tool in a direction leaving from the upper surfaces of the electrode by a distance
Abstract: A process of forming bumps on respective electrodes (118a to 118v) of a semiconductor chip (SC21) comprises the steps of a) preparing a bonding apparatus equipped with a bonding tool (114) three-dimensionally movable, b) forming a small ball at the leading end of a bonding wire passing through the bonding tool, c) causing the bonding tool to press the small ball against the upper surface of one of the electrodes for bonding thereto, d) moving the bonding tool in a direction leaving from the upper surface of the electrode by a distance, e) moving the bonding tool in a horizontal direction (X21 or Y21) substantially parallel to the upper surface of the electrode so that the bonding wire is cut from the small ball with the leading end of the bonding tool, and f) repeating the steps b) to e) for producing bumps on the respective upper surfaces of the other electrodes, in which the horizontal direction is different depending upon the location of the electrode.
105 citations
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NEC1
TL;DR: In this article, a scanning tunneling microscope (STM) was used to tailor graphite surface from one to several layers in depth using water-adsorbed graphite surfaces.
105 citations
Authors
Showing all 33297 results
Name | H-index | Papers | Citations |
---|---|---|---|
Pulickel M. Ajayan | 176 | 1223 | 136241 |
Xiaodong Wang | 135 | 1573 | 117552 |
S. Shankar Sastry | 122 | 858 | 86155 |
Sumio Iijima | 106 | 633 | 101834 |
Thomas W. Ebbesen | 99 | 305 | 70789 |
Kishor S. Trivedi | 95 | 698 | 36816 |
Sharad Malik | 95 | 615 | 37258 |
Shigeo Ohno | 91 | 303 | 28104 |
Adrian Perrig | 89 | 374 | 53367 |
Jan M. Rabaey | 81 | 525 | 36523 |
C. Lee Giles | 80 | 536 | 25636 |
Edward A. Lee | 78 | 462 | 34620 |
Otto Zhou | 74 | 322 | 18968 |
Katsumi Kaneko | 74 | 581 | 28619 |
Guido Groeseneken | 73 | 1074 | 26977 |