Institution
NEC
Company•Tokyo, Japan•
About: NEC is a company organization based out in Tokyo, Japan. It is known for research contribution in the topics: Signal & Layer (electronics). The organization has 33269 authors who have published 57670 publications receiving 835952 citations. The organization is also known as: NEC Corporation & NEC Electronics Corporation.
Topics: Signal, Layer (electronics), Terminal (electronics), Base station, Transmission (telecommunications)
Papers published on a yearly basis
Papers
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NEC1
TL;DR: In this paper, a server load balancing system for distributing a content delivery to a client among a plurality of content servers, comprises a destination server determining policy setting unit for setting selection criteria for determining a content server for delivering the content for every content characteristic and a server determining unit for determining the content server according to the selection criteria corresponding to the characteristic of the requested content.
Abstract: A server load balancing system for distributing a content delivery to a client among a plurality of content servers, comprises a destination server determining policy setting unit for setting selection criteria for determining a content server for delivering the content for every content characteristic and a destination server determining unit for determining the content server for delivering the content requested from the client, according to the selection criteria corresponding to the characteristic of the requested content.
104 citations
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NEC1
TL;DR: In this article, an optically-addressed liquid crystal light valve comprises a transparent insulating substrate having either one-dimensional or two-dimensional arrays of optical switching elements thereon which can perform switching with an incident light, another opposing transparent substrate having transparent electrodes and a liquid crystal sandwiched therebetween.
Abstract: An optically-addressed liquid crystal light valve comprises a transparent insulating substrate having either one-dimensional or two-dimensional arrays of optical switching elements thereon which can perform switching with an incident light, another opposing transparent substrate having transparent electrodes and a liquid crystal sandwiched therebetween. Each of the light switching elements comprises a photo-detector circuit and a thin-film-transistor (TFT) drive circuit. The photo-detector circuit comprises a serially connected photodiode and a passive element such as capacitor or resistor. The TFT drive circuit receives as input the voltage produced from the photo-detector circuit, while the output voltage from the TFT drive circuit is applied to one pixel electrode for the liquid crystal.
104 citations
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NEC1
TL;DR: In this paper, a semiconductor integrated circuit (100) that may determine whether or not a power supply voltage has dropped to a level that data integrity in a RAM portion (15) may be lost has been disclosed.
Abstract: A semiconductor integrated circuit (100) that may determine whether or not a power supply voltage has dropped to a level that data integrity in a RAM portion (15) may be lost has been disclosed. Semiconductor integrated circuit (100) may include a power on clear (POC) circuit (1), a low voltage detecting circuit (2), a RAM data destruction preventing block (3), a RAM portion (15), and a combination circuit (4). POC circuit (1) may detect when a power supply potential is below a predetermined voltage and provide a reset signal to RAM data destruction preventing block (3). RAM data destruction preventing block (3) may prevent access to memory cells (20) in RAM portion (15) in response to the reset signal. Low voltage detecting circuit (1) may determine if the power supply potential may have dropped below a data holding voltage. In this way, data may only be rewritten to RAM portion (15) after a reset operation if data integrity may be lost.
104 citations
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NEC1
TL;DR: In this paper, a semiconductor device is defined as one or more semiconductor chips each of which is flip-chip bonded at a first surface thereof to the substrate, at least one chip component mounted on the substrate and in the proximity of the semiconductor chip, insulating underfill resin which covers the chip components and which fills at least part of a portion between the first surface of each of the chip chips and the substrate; and a lid member which is bonded to a second surface of percolated substrate, via conductive adhesive resin.
Abstract: A semiconductor device having one or more semiconductor chips and chip components and a manufacturing method. In the semiconductor device, electrical short of the chip components and the like can be effectively avoided, and break away of the chip components from a substrate can be avoided. The semiconductor device comprises: one or more semiconductor chips each of which is flip chip bonded at a first surface thereof to the substrate; at least one chip components mounted on the substrate and in the proximity of the semiconductor chips; insulating underfill resin which covers the chip components and which fills at least part of a portion between the first surface of each of the semiconductor chips and the substrate; and a lid member which is bonded to a second surface of each of the semiconductor devices opposite to the first surface, via conductive adhesive resin.
104 citations
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NEC1
TL;DR: A wavelength tunable laser with an SOA and external double micro-ring resonator, which is fabricated with silicon photonic-wire waveguides, is demonstrated, and is the first wavelength Tunable laser fabricated with Silicon photonic technology.
Abstract: A wavelength tunable laser with an SOA and external double micro-ring resonator, which is fabricated with silicon photonic-wire waveguides, is demonstrated. To date, it is the first wavelength tunable laser fabricated with silicon photonic technology. The device is ultra compact, and its external resonator footprint is 700 x 450 microm, which is about 1/25 that of conventional tunable lasers fabricated with SiON waveguides. The silicon resonator shows a wide tuning range covering the C or L bands for DWDM optical communication. We obtained a maximum tuning span of 38 nm at a tuning power consumption of 26 mW, which is about 1/8 that of SiON-type resonators.
104 citations
Authors
Showing all 33297 results
Name | H-index | Papers | Citations |
---|---|---|---|
Pulickel M. Ajayan | 176 | 1223 | 136241 |
Xiaodong Wang | 135 | 1573 | 117552 |
S. Shankar Sastry | 122 | 858 | 86155 |
Sumio Iijima | 106 | 633 | 101834 |
Thomas W. Ebbesen | 99 | 305 | 70789 |
Kishor S. Trivedi | 95 | 698 | 36816 |
Sharad Malik | 95 | 615 | 37258 |
Shigeo Ohno | 91 | 303 | 28104 |
Adrian Perrig | 89 | 374 | 53367 |
Jan M. Rabaey | 81 | 525 | 36523 |
C. Lee Giles | 80 | 536 | 25636 |
Edward A. Lee | 78 | 462 | 34620 |
Otto Zhou | 74 | 322 | 18968 |
Katsumi Kaneko | 74 | 581 | 28619 |
Guido Groeseneken | 73 | 1074 | 26977 |