NEC

About: NEC is a company organization based out in Tokyo, Japan. It is known for research contribution in the topics: Signal & Layer (electronics). The organization has 33269 authors who have published 57670 publications receiving 835952 citations. The organization is also known as: NEC Corporation & NEC Electronics Corporation.

Switching system with time-stamped packet distribution input stage and packet sequencing output stage

Abstract: In a fast packet switching system, packet distributers are associated respectively with input ports for receiving successive packets therefrom and attaching a timeslot number to each of the received packets, and uniformly distributing the packets to output terminals of each distributer. Packet switches are provided corresponding in number to the output terminals of each packet distributer. Each packet switch has input terminals corresponding in number to the packet distributers and output terminals corresponding in number to the output ports. The input terminals of each packet switch are coupled to respective output terminals of the distributers for switching a packet from one of its input terminals to one of its output terminals in accordance with a destination address contained in the packet. Packet sequencers are associated respectively with the output ports. Each packet sequencer has input terminals coupled to respective output terminals of the packet switches for examining the timeslot numbers attached to packets from its input terminals and delivering the packets to the associated output port in accordance with the examined timeslot numbers.

Creating audio-centric, image-centric, and integrated audio-visual summaries

Abstract: Systems and methods create high quality audio-centric, image-centric, and integrated audio-visual summaries by seamlessly integrating image, audio, and text features extracted from input video. Integrated summarization may be employed when strict synchronization of audio and image content is not required. Video programming which requires synchronization of the audio content and the image content may be summarized using either an audio-centric or an image-centric approach. Both a machine learning-based approach and an alternative, heuristics-based approach are disclosed. Numerous probabilistic methods may be employed with the machine learning-based learning approach, such as naive Bayes, decision tree, neural networks, and maximum entropy. To create an integrated audio-visual summary using the alternative, heuristics-based approach, a maximum-bipartite-matching approach is disclosed by way of example.

Service searching system

Abstract: A service searching system for searching a service in a distributed system comprises a wireless server device and a wireless terminal device. The wireless server device is connected to a network and implements a master search service. On the other hand, the wireless terminal device implements a slave search service, and is capable of communicating with the server by wireless and utilizing the master search service. Besides, the wireless terminal device comprises a storage means that caches service objects obtained through the master search service. In addition, in searching the slave search service for a service, the wireless terminal device begins by searching the service objects cached in the storage means. In the case where the service is not detected, the wireless terminal device searches the master search service. The service objects are cached by being related to priority data. Thereby, there is provided a service searching system comprising a wireless terminal device, which is intended to search for a service in a distributed system in which a range of services are distributed in a network, wherein it is possible to cut down a service-searching time and costs, and further, it is possible to cut down communication interruptions by noise etc. in the wireless communication section compared to the conventional one.

Semiconductor device with plate heat sink free from cracks due to thermal stress and process for assembling it with package

Abstract: A compound semiconductor pellet for a high electron mobility transistor is bonded to a metal plate heat sink of gold, and the metal plate heat sink is soldered to a package, wherein the metal plate heat sink is subjected to an orientation under application of heat before the soldering so as to cure warp of the compound semiconductor pellet, thereby decreasing the thermal stress due to the heat during the soldering.

Resin structure in which manufacturing cost is cheap and sufficient adhesive strength can be obtained and method of manufacturing it

Abstract: A resin structure includes a resin layer and a metal layer. The resin layer is formed of a single material. The metal layer is laminated directly on the resin layer without intervention of an adhesive layer between the resin layer and the metal layer. A surface of the resin layer, on which the metal layer is laminated, has a surface roughness of a value in a range of 0.1 microns to 10 microns, as a rough surface. The metal layer is formed on the rough surface of the resin layer.