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Institution

NEC

CompanyTokyo, Japan
About: NEC is a company organization based out in Tokyo, Japan. It is known for research contribution in the topics: Signal & Layer (electronics). The organization has 33269 authors who have published 57670 publications receiving 835952 citations. The organization is also known as: NEC Corporation & NEC Electronics Corporation.


Papers
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Patent
Kikuo Oura1, Kenzo Fujii1
20 Apr 2000
TL;DR: In this paper, the metal layer is formed on the rough surface of the resin layer, which is a rough surface formed by a single material, and the metal is then laminated directly on the surface without intervention of an adhesive layer between the resins and the materials.
Abstract: A resin structure includes a resin layer and a metal layer. The resin layer is formed of a single material. The metal layer is laminated directly on the resin layer without intervention of an adhesive layer between the resin layer and the metal layer. A surface of the resin layer, on which the metal layer is laminated, has a surface roughness of a value in a range of 0.1 microns to 10 microns, as a rough surface. The metal layer is formed on the rough surface of the resin layer.

102 citations

Patent
Keiichiro Kata1, Shuichi Matsuda1
25 Sep 1995
TL;DR: In this article, an adhesive layer is formed on a surface of a semiconductor wafer having a number of integrated circuits, and an opening is formed at regions of the adhesive layer corresponding to the electrode pads.
Abstract: In a method of manufacturing a semiconductor device comprising a semiconductor chip and a carrier film which includes an insulating film and wiring patterns formed on one of main surfaces of the insulating film, an adhesive layer is formed on a surface of a semiconductor wafer having a number of integrated circuits. Each of the integrated circuits has electrode pads for external connection on the foregoing surface of the semiconductor wafer. Subsequently, openings are formed at regions of the adhesive layer corresponding to the electrode pads, and then, the semiconductor wafer is cut per integrated circuit so as to obtain the semiconductor chips. Thereafter, the electrode pads of the semiconductor chip and the wiring patterns of the carrier film are connected to each other through the corresponding openings of the adhesive layer, respectively. Then, the semiconductor chip and the carrier film are bonded together via the adhesive layer interposed therebetween. It may be arranged that the adhesive layer is formed on the carrier film rather than on the semiconductor chip.

102 citations

Patent
28 Aug 2002
TL;DR: The stream proxy server of the present invention includes a network information acquisition unit, a transport layer protocol control unit capable of transmitting and receiving data by using a plurality of transport layer protocols having a flow control function and different band sharing characteristics as discussed by the authors.
Abstract: The stream proxy server of the present invention includes a network information acquisition unit, a transport layer protocol control unit capable of transmitting and receiving data by using a plurality of transport layer protocols having a flow control function and different band sharing characteristics, a reception rate control unit for reading data at a rate determined by the transport layer protocol control unit, and a prefetch control unit for determining a rate of contents acquisition from an origin server and a transport layer protocol to be used based on information obtained from the network information acquisition unit and a buffer margin, and notifying the reception rate control unit of the determined rate and notifying the transport layer protocol control unit of the transport layer protocol to be used.

102 citations

Patent
Fumio Nakano1
30 Jan 1991
TL;DR: In this paper, a voice pattern which is extracted from a voice supplied through a microphone is compared with reference voice patterns to pick up one of them which corresponds to a certain voice command to control an external machine, and a similarity between the voice pattern and the reference voice pattern is calculated.
Abstract: In a method for controlling an external machine by a voice command, a voice pattern which is extracted from a voice supplied through a microphone is compared with reference voice patterns to pick up one of them which corresponds to a certain voice command to control an external machine, and a similarity between the voice pattern and the reference voice pattern is calculated. Then, a control signal is supplied to the external machine after a waiting time passes. The waiting time is determined dependent on the similarity such that the waiting time is relatively long when the similarity is low and is determined relatively short when the similarity is high, so that an operator has a sufficient time to judge whether the voice command is the desired one.

102 citations

Patent
Yoshikazu Watanabe1
24 Oct 2011
TL;DR: A communication control system includes a control server for controlling a process rule held in a forwarding node and an address resolution unit for forwarding the packet received from a source communication device which is a source of the packet to another device, performing interlayer address resolution for the destination communication device or the communication device as discussed by the authors.
Abstract: A communication control system includes a control server for controlling a process rule held in a forwarding node. The control server includes a network information storage unit for storing a logical network identifier which is an identifier of a logical network defined by setting of the forwarding node, and a correspondence relation between a device connected to the forwarding node and the logical network; and an address resolution unit for, upon receiving from the forwarding node an address resolution request for a destination communication device which is a destination of the packet or a communication device for forwarding the packet received from a source communication device which is a source of the packet to another device, performing interlayer address resolution for the destination communication device or the communication device, and setting the logical network identifier of the logical network to which the source communication device belongs.

102 citations


Authors

Showing all 33297 results

NameH-indexPapersCitations
Pulickel M. Ajayan1761223136241
Xiaodong Wang1351573117552
S. Shankar Sastry12285886155
Sumio Iijima106633101834
Thomas W. Ebbesen9930570789
Kishor S. Trivedi9569836816
Sharad Malik9561537258
Shigeo Ohno9130328104
Adrian Perrig8937453367
Jan M. Rabaey8152536523
C. Lee Giles8053625636
Edward A. Lee7846234620
Otto Zhou7432218968
Katsumi Kaneko7458128619
Guido Groeseneken73107426977
Network Information
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Performance
Metrics
No. of papers from the Institution in previous years
YearPapers
20238
202220
2021234
2020518
2019952
20181,088