Institution
NEC
Company•Tokyo, Japan•
About: NEC is a company organization based out in Tokyo, Japan. It is known for research contribution in the topics: Signal & Layer (electronics). The organization has 33269 authors who have published 57670 publications receiving 835952 citations. The organization is also known as: NEC Corporation & NEC Electronics Corporation.
Topics: Signal, Layer (electronics), Terminal (electronics), Base station, Transmission (telecommunications)
Papers published on a yearly basis
Papers
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NEC1
TL;DR: In this article, a virtual machine configuration system, comprising a virtualizer for, in a virtualization environment in which a plurality of physical resources connected mutually through a network circuit has been arranged on a computer system sectioned into a pluralityof partitions, dynamically changing a physical resource configuration and a VM configuration while simultaneously controlling a configuration of the physical resources of the partition and a virtual resources allotted to virtual machines without exerting an influence over an application service operating on the virtual machine.
Abstract: A virtual machine configuration system, comprising a virtualizer for, in a virtualization environment in which a plurality of physical resources connected mutually through a network circuit has been arranged on a computer system sectioned into a plurality of partitions, dynamically changing a physical resource configuration and a virtual machine configuration while simultaneously controlling a configuration of the physical resources of the partition and a configuration of virtual resources allotted to virtual machines without exerting an influence over an application service operating on the virtual machine.
99 citations
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NEC1
TL;DR: In this paper, a silicon oxide film is formed on a silicon substrate with a diffusion layer, and a contact hole is formed in the contact hole by a BPSG film.
Abstract: A silicon oxide film is formed on a silicon substrate with a diffusion layer, and a contact hole is formed in the silicon oxide film. A protective film made of an oxide film and a nitride film is formed over the whole surface of the substrate, and the contact hole is buried with a BPSG film. Another silicon oxide film is deposited over the substrate and an interconnection trench is formed in this silicon oxide film. After the BPSG film is removed, a TiN/Ti film is formed over the whole surface of the substrate. A Cu film is grown by MO-CVD, and thereafter the Cu film and TiN/Ti film on the surface of the substrate are partially removed by CMP. A highly reliable contact plug and a trench burying higher level interconnection are formed even where contacts are margin-less or where alignment errors are present.
99 citations
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NEC1
TL;DR: In this article, a USB device controller is applied to a peripheral device that performs data communications with a host by using a transmission endpoint and a reception endpoint via a USB interface, which contributes to downsizing of the circuit scale.
Abstract: A USB device controller is applied to a peripheral device that performs data communications with a host by using a transmission endpoint and a reception endpoint via a USB interface. Herein, a USB endpoint controller performs data transmission and data reception by using the reduced number of memories, which contribute to downsizing of the circuit scale of the USB device controller. The USB endpoint controller contains a transmission control block, a reception control block and a buffer switch control block as well as the memories. The buffer switch control block controls allocation of the memories to a transmission endpoint and a reception endpoint respectively in response to a type of a token issued from the host. In response to an OUT token, the data transmission is performed on the transmission endpoint that actualizes a double buffer configuration while the reception endpoint is also available in data reception by a single buffer configuration. In response to an IN token, the data reception is performed on the reception endpoint that actualizes a double buffer configuration while the transmission endpoint is also available in data transmission by a single buffer configuration. Because of the actualization of the double buffer configuration, it is possible to perform high-speed processing in communications of data, particularly transaction data based on the updated standard of USB 2.0.
99 citations
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NEC1
TL;DR: In this article, the bandgap energy of an In/InP multiquantum well structure, selectively grown by MOVPE, was controlled along the waveguide direction by controlling the mask stripe width.
Abstract: The bandgap energy of an In/InP multiquantum well structure, selectively grown by MOVPE, was controlled along the waveguide direction by controlling the mask stripe width. A butt-jointless DFB-LD/modulator light source was fabricated by using this technique.
99 citations
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NEC1
TL;DR: In this paper, a plurality of memory logic modules are arranged in a two-dimensional array, and at least one logic element is provided in each of the plurality of logic modules.
Abstract: In order to achieve rapid reconfiguration of logic elements in a programmable logic device, a plurality of memory logic modules are arranged in a two-dimensional array. At least one logic element is provided in each of the plurality of memory logic modules. The logic element is provided with a configuration memory into which configuration data can be written to specify logic functions of the logic element. A memory element is provided in each of the plurality of memory logic modules. The memory element stores a plurality of configuration data with respect to the logic element, and one of the plurality of configuration data is written into the configuration memory of the logic element to configure or reconfigure the logic element.
99 citations
Authors
Showing all 33297 results
Name | H-index | Papers | Citations |
---|---|---|---|
Pulickel M. Ajayan | 176 | 1223 | 136241 |
Xiaodong Wang | 135 | 1573 | 117552 |
S. Shankar Sastry | 122 | 858 | 86155 |
Sumio Iijima | 106 | 633 | 101834 |
Thomas W. Ebbesen | 99 | 305 | 70789 |
Kishor S. Trivedi | 95 | 698 | 36816 |
Sharad Malik | 95 | 615 | 37258 |
Shigeo Ohno | 91 | 303 | 28104 |
Adrian Perrig | 89 | 374 | 53367 |
Jan M. Rabaey | 81 | 525 | 36523 |
C. Lee Giles | 80 | 536 | 25636 |
Edward A. Lee | 78 | 462 | 34620 |
Otto Zhou | 74 | 322 | 18968 |
Katsumi Kaneko | 74 | 581 | 28619 |
Guido Groeseneken | 73 | 1074 | 26977 |