NEC

About: NEC is a company organization based out in Tokyo, Japan. It is known for research contribution in the topics: Signal & Layer (electronics). The organization has 33269 authors who have published 57670 publications receiving 835952 citations. The organization is also known as: NEC Corporation & NEC Electronics Corporation.

Method for vapor deposition of a metal compound film

Abstract: A method for forming a metal compound film includes alternate irradiation of an organometal compound and oxygen or nitrogen radicals to deposit monoatomic layers of the metal compound. The organometal compound includes zirconium, hafnium, lanthanide compounds. The resultant film includes little residual carbon and has excellent film characteristic with respect to leakage current.

Semiconductor memory device

Abstract: A semiconductor memory device of present invention has a memory cell, a sense amplifier which amplifies data of the memory cell, first IO line connected to the sense amplifier, and second IO line which is connected to first IO line through a switch, wherein the second IO line is arranged on the memory cell.

Chip and multi-chip semiconductor device using the chip, and method for manufacturing same

Abstract: The chip for the multi-chip semiconductor device having the markings for alignment formed on the front surface and/or the back surface of the chip only by the processing from the front surface of the chip (photolithography, etch) and the method for manufacturing same are presented, without adding any dedicated process step to the formation process for the marking for alignment. In the chip for the multi-chip semiconductor device having two or more electroconductive through plug in one chip for the multi-chip semiconductor device, one or more electroconductive through plugs are employed for the marking for alignment, and the chip is configured to allow identification of the marking for alignment on the front surface and/or the back surface of the chip for the multi-chip semiconductor device. Then, an insulating film is provided on the front surface and/or the back surface of the electrically conducting through plug.

A New Load-Pull Characterization Method for Microwave Power Transistors

Abstract: A novel method for microwave power transistor load-pull characterization is presented. The method provides an equivalent load-pull measurement technique without using an output impedance tuner. In this method, both input and output ports of a test transistor are simultaneously driven by external signals at the same specified frequency. Results of its application to a medium-power GaAs FET are given.

Learning Sequence Encoders for Temporal Knowledge Graph Completion

Abstract: Research on link prediction in knowledge graphs has mainly focused on static multi-relational data In this work we consider temporal knowledge graphs where relations between entities may only hold for a time interval or a specific point in time In line with previous work on static knowledge graphs, we propose to address this problem by learning latent entity and relation type representations To incorporate temporal information, we utilize recurrent neural networks to learn time-aware representations of relation types which can be used in conjunction with existing latent factorization methods The proposed approach is shown to be robust to common challenges in real-world KGs: the sparsity and heterogeneity of temporal expressions Experiments show the benefits of our approach on four temporal KGs The data sets are available under a permissive BSD-3 license