Institution
NEC
Company•Tokyo, Japan•
About: NEC is a company organization based out in Tokyo, Japan. It is known for research contribution in the topics: Signal & Layer (electronics). The organization has 33269 authors who have published 57670 publications receiving 835952 citations. The organization is also known as: NEC Corporation & NEC Electronics Corporation.
Topics: Signal, Layer (electronics), Terminal (electronics), Transmission (telecommunications), Electrode
Papers published on a yearly basis
Papers
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TL;DR: In this paper, two common methods of oxidation, gas-phase oxidation by heat treatment in oxygen gas and liquid phase oxidation using nitric acid, were applied to single-wall carbon nanotubes (SWNT).
150 citations
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TL;DR: In this article, single-wall carbon nanotubes (SWCNTs) with high yield were produced in quantity of tens of grams a day under the arc conditions of 40∼60 A d.c. and helium pressure of 500 or 700 T rr.
150 citations
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NEC1
TL;DR: In this paper, a semiconductor device has: a plurality of first power supply wires formed in a first wiring layer, a plurality in a second wiring layer and vias connecting between the first and the second wiring layers.
Abstract: A semiconductor device has: a plurality of first power supply wires formed in a first wiring layer; a plurality of second power supply wires formed in a second wiring layer; and a plurality of vias connecting between the first wiring layer and the second wiring layer. The plurality of second power supply wires overlap the plurality of first power supply wires at a plurality of intersections. The plurality of vias are arranged regularly at a part of the plurality of intersections.
150 citations
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NEC1
TL;DR: In this article, a mounting assembly of an integrated circuit device is described, which includes a set of through holes formed in a mounting substrate at positions opposed to the pads of the device, and solders for connecting the pads with the through holes.
Abstract: A mounting assembly of an integrated circuit device includes an integrated circuit device having pads on its lower side, through holes formed in a mounting substrate at positions opposed to the pads of the integrated circuit device, and solders for connecting the pads of the integrated circuit device with the through holes. An electrode is provided on the inside wall of each through hole, and the mounting substrate includes therein wirings connected to the electrodes. The solder is filled into the through holes to such an extent that the solder filled in the through holes can be visually checked from the lower side of the substrate.
150 citations
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NEC1
TL;DR: In this article, a parabolic reflector was used to reflect the radio waves from the primary radiator to shield against unnecessary radiation radio waves among the radiations from the radio device and reflected by the parabolic reflected reflector.
Abstract: An antenna device includes: a radio device for radio wave transmission; a primary radiator that has a function to radiates radio waves generated by the radio device; a parabolic reflector that reflects the radio waves radiated from the primary radiator; a shroud that shields against unnecessary radiation radio waves among the radio waves radiated from the primary radiator and reflected by the parabolic reflector; and an antenna mounting mechanism that fits the parabolic reflector to an antenna attachment pole. The shroud is arranged so as to cover at least a right and left of the parabolic reflector, the radio device and the primary radiator are arranged inside the shroud, and the antenna mounting mechanism fits the parabolic reflector to the antenna attachment pole so that the antenna attachment pole is located at a lateral center position of the parabolic reflector.
150 citations
Authors
Showing all 33297 results
Name | H-index | Papers | Citations |
---|---|---|---|
Pulickel M. Ajayan | 176 | 1223 | 136241 |
Xiaodong Wang | 135 | 1573 | 117552 |
S. Shankar Sastry | 122 | 858 | 86155 |
Sumio Iijima | 106 | 633 | 101834 |
Thomas W. Ebbesen | 99 | 305 | 70789 |
Kishor S. Trivedi | 95 | 698 | 36816 |
Sharad Malik | 95 | 615 | 37258 |
Shigeo Ohno | 91 | 303 | 28104 |
Adrian Perrig | 89 | 374 | 53367 |
Jan M. Rabaey | 81 | 525 | 36523 |
C. Lee Giles | 80 | 536 | 25636 |
Edward A. Lee | 78 | 462 | 34620 |
Otto Zhou | 74 | 322 | 18968 |
Katsumi Kaneko | 74 | 581 | 28619 |
Guido Groeseneken | 73 | 1074 | 26977 |