Panasonic

About: Panasonic is a company organization based out in Kadoma, Ôsaka, Japan. It is known for research contribution in the topics: Signal & Layer (electronics). The organization has 49129 authors who have published 71118 publications receiving 942756 citations. The organization is also known as: Panasonikku Kabushiki-gaisha & Panasonic.

Surface light source panel

Abstract: The present invention provides a surface light source panel having superior brightness and uniformity of light. According to the present invention, diffused reflection sections are formed onto a transparent resin substrate by the printing of ink. Since the density of the diffused reflection sections and the area ratio thereof with respect to the transparent resin substrate, and also the containing ratio of additives in the ink are specified, the surface light source panel displays superior brightness and uniformity of light even when the substrate is a single plate which has ben laminated in a conventional panel. Moreover, although the surface light source panel of the present invention is provided with a light source at one end thereof, since the portion of the largest area ratio of the diffused reflection sections is arranged at a position deflected to the side of a reflecting part at the other end of the panel, the brightness and uniformity of the light can be more secured.

Home network gateway apparatus and home network device

Abstract: A home network gateway apparatus controls information of home network devices connected to an IEEE 1394 bus in a unified manner in a household. When a device is connected to the home network, the home network gateway apparatus of the present invention acquires information of each device and posts the information on a built-in WWW server in a list menu format. The user can remotely control home network devices individually from an apparatus on another network via the list menu.

Semiconductor unit package, semiconductor unit packaging method, and encapsulant for use in semiconductor unit packaging

Abstract: An improved semiconductor unit package is disclosed. This package is implemented by a semiconductor device having an electrode pad, a substrate having a terminal electrode, a bump electrode formed on the electrode pad, a conductive adhesion layer with flexibility, and an encapsulating layer formed by curing a composition the viscosity and thixotropy index of which are below 100 Pa·s and below 1.1, respectively. Such a composition essentially consists of (A) a resin binder that contains, for example, a polyepoxide, an acid anhydride, and a rheology modifier and (B) a filler. The rheology modifier is one capable of impeding interaction between a free acid contained in the acid anhydride and a polar group at the surface of the filler. An encapsulant with improved flowability is used, so that the encapsulant readily flows and spreads to fill a gap between the semiconductor device and the substrate with no air bubbles. This achieves semiconductor unit packages with high reliability and productivity.

Color converting apparatus for performing a three-dimensional color conversion of a colored picture in a color space with a small capacity of memory

Abstract: A color converting apparatus is provided with a table memory for storing pieces of color converting data defined in an output color space at color converting addresses, and a signal receiving section for receiving three signals designating an input color in a lightness-color difference space. The color converting addresses are placed at lattice points of cubic blocks formed by partitioning the lightness-color difference space in a lightness direction and first and second color difference directions. Each of the cubic blocks has the lattice points Pa, Pb, Pc and Pd at its lower plane and the lattice points Pe, Pf, Pg and Ph at its upper plane. Each of the cubic blocks is partitioned into a first triangular prism having the lattice points Pa, Pb, Pc, Pe, Pf and Pg and a second triangular prism having the lattice points Pa, Pd, Pc, Pe, Ph and Pg. A particular triangular prism in which the input color is included is specified, and six pieces of color converting data Da, Db (or Dd), Dc, De, Df (or Dh) and Dg addressed at the lattice points Pa, Pb (or Pd), Pc, Pe (or Ph), Pf of the particular triangular prism are read out from the table memory, and an output color which corresponds to the input color and is defined in the output space is interpolated with the color converting data read out.

Solid state imaging device

Abstract: PROBLEM TO BE SOLVED: To provide a solid state imaging device in which the occurrence of distortion due to an imaging element extending along the surface of a substrate is suppressed even when the imaging element is bonded to the surface of a substrate having insufficient flatness, and an influence of distortion on the electric characteristics or the like is lessened SOLUTION: The solid state imaging device comprises a substrate 2, a frame-like rib 3 arranged on the substrate to form an inner space, a plurality of wiring members 9 electrically led out of the inner space of a housing 1 formed by the substrate and the rib, an imaging element 5 bonded to a wiring board in the inner space, a translucent plate 7 bonded to the upper end face of the rib, and a thin metal wire 10 for connecting the electrode of the imaging element and each wiring member A plurality of hemispheric protrusions 2a are formed in a region of the substrate facing the imaging element which is bonded to the substrate with an adhesive 6 while being supported by the protrusions COPYRIGHT: (C)2005,JPO&NCIPI