Panasonic

About: Panasonic is a company organization based out in Kadoma, Ôsaka, Japan. It is known for research contribution in the topics: Signal & Layer (electronics). The organization has 49129 authors who have published 71118 publications receiving 942756 citations. The organization is also known as: Panasonikku Kabushiki-gaisha & Panasonic.

Information distribution system

Abstract: A program distribution system, capable of decreasing the load of distributing programs and capable of managing transfer and installation of programs at distribution destinations by the distribution source, is disclosed. Computer software distributed to a PC 116 includes a program for transfer, historical information of program transfer, a program for installation and an application program(s). The transfer program adds both information on a terminal to be a destination of transfer and information on a media used for the transfer to the historical information, and it transfers to a PC 172 the whole software including itself. The installation program transmits the historical information to a distribution management device 103 via a network 151 and an external connection device 104 . The distribution management device 103 receives the historical information and makes a response to the PC 172 whether or not installation of the software therein is permitted. The installation program performs processing for installation upon receipt of a response of permission.

Semiconductor device and production method therefor

Abstract: A first insulation film (2) as a thermal oxide film up to 20 nm thick is formed by oxidizing the top portion of an SiC substrate (1) at temperatures of at least 800°C and up to 1400°C and in an oxygen atmosphere of up to 1.4×102 Pa. After annealing, a first cap layer (3) as a nitride film about 5 nm thick is formed thereon by a CVD method. A second insulation film (4) as a deposited oxide film about 130 nm thick is formed thereon by a CVD method. A second cap layer (5) as a nitride film about 10 nm thick is formed thereon. A semiconductor device low in loss and high in reliability is thus obtained by forming a gate insulation film (6) consisting of the first insulation layer (2) to the second cap layer (5).

Base station device and communication method

Abstract: In order to reduce interference between cells through hopping and use frequencies in a good propagation situation, a scheduler section 102 carries out scheduling for determining to which user data should be sent using CQI from each communication terminal apparatus, selects a user signal to be sent in the next frame and determines in which subcarrier block the data should be sent. An MCS decision section 103 selects a modulation scheme and coding method from the CQI of the selected user signal. A subcarrier block selection section 110 selects a subcarrier block instructed by the scheduler section 102 for each user signal. For the respective subcarrier blocks, FH sequence selection sections 111-1 to 111-n select hopping patterns. A subcarrier mapping section 112 maps the user signal and control data to subcarriers according to the selected hopping pattern.

Pay television system

Abstract: This invention, relating to a unidirectional television system such as satellite television broadcasting system, is intended to transmit and receive the charging information corresponding to the content of the program being transmitted in the digital form at certain time intervals, and account the amount by a charging amount accounting means built in the receiver from said information and the time of receiving the television program, write the charge data proportional to the amount in a memory, read out the charge data in the memory when necessary, and display it on a display means

A capillary for a wire bonding apparatus and a method for forming an electric connection bump using the capillary

Abstract: The capillary for ball bonding for forming a bump on the electrode pad of a semiconductor device includes a pressing member having a bore therein for supplying a metal wire, and a leveling member. The pressing member presses the ball-like end of the metal wire against the electrode pad in order to secure the ball-like end to the electrode pad under pressure. The leveling member makes the bump formed on the electrode pad to a predetermined height. According to the method of forming a bump using the capillary, first, a ball is formed at the end of the metal wire supplied from the bore. A first portion of the bump is formed by moving the capillary downwards and by securing the ball-like end to the electrode pad under pressure by the pressing member. A second portion of the bump is formed on the first portion by supplying the metal wire while the capillary is moved. When the capillary is moved downwards, a portion of the metal wire constituting the second portion is cut from the remaining portion of the metal wire in the bore by an edge of the pressing member, and simultaneously the bump is leveled by the leveling member.