Panasonic

About: Panasonic is a company organization based out in Kadoma, Ôsaka, Japan. It is known for research contribution in the topics: Signal & Layer (electronics). The organization has 49129 authors who have published 71118 publications receiving 942756 citations. The organization is also known as: Panasonikku Kabushiki-gaisha & Panasonic.

Transmit power control for physical random access channels

Abstract: The invention relates to methods for adjusting the transmit power utilized by a mobile terminal for uplink transmissions, and to methods for adjusting the transmit power used by a mobile terminal for one or more RACH procedures. The invention is also providing apparatus and system for performing these methods, and computer readable media the instructions of which cause the apparatus and system to perform the methods described herein. In order to allow for adjusting the transmit power of uplink transmissions on uplink component carriers, the invention suggests introducing a power scaling for uplink PRACH transmissions performing RACH procedures on an uplink component carrier. The power scaling is proposed on the basis of a prioritization among multiple uplink transmissions or on the basis of the uplink component carriers on which RACH procedures are performed.

Electrically reprogrammable nonvolatile memory device

Abstract: An electrically plastic device comprising an amorphous silicon semiconductor layer including movable dopant formed between a pair of electrodes and; at least one gate electrode formed on said amorphous silicon semiconductor layer through an insulation layer or a high resistance layer; whereby the operation of said gate electrode controls the dopant distribution of said amorphous semiconductor layer, thereby varying the electrical conductivity thereof.

Semiconductor device and method for fabricating the same

Abstract: A semiconductor chip is mounted on a first surface of a substrate, the substrate having wiring formed on the first surface, so that a circuit formation surface of the semiconductor chip faces the first surface of the substrate and that electrodes provided on the circuit formation surface are connected with the wiring. A sealing resin layer is then formed on the first surface of the substrate to cover the semiconductor chip. The sealing resin layer and the semiconductor chip are ground starting from a surface opposite to the circuit formation surface to thin the semiconductor chip.

Vehicle information recording system

Abstract: A vehicle information recording system 100 includes a picture acquiring unit 101a placed in a vehicle that takes a picture of surroundings and generates picture data showing the picture, a vehicle data receiving unit 107 placed in the vehicle that receives other vehicle data concerning another vehicle shown in the picture acquired by the picture acquiring unit 101a, an acquired information sending unit 103 placed in the vehicle that sends data including the picture data and the other vehicle data outside of the vehicle, a receiving unit 104 placed outside of the vehicle that receives the data sent by the acquired information sending unit 103, an encoding unit 105 placed outside of the vehicle that encodes the other vehicle data among the data received by the receiving unit 104 and adds the encoded data to the picture data as related data, and a recording unit 106 placed outside of the vehicle that records the picture data to which the other vehicle data is added by the encoding unit 105.

Organic electroluminescence device

Abstract: An organic EL device includes a metal layer which is provided with a nano-order-sized unevenness on one surface and plural organic layers which include a light emitting layer provided on the one surface side of the metal layer, and a height of each unevenness at respective interfaces in the organic layer is made smaller than an unevenness provided on the metal layer According to the above configuration, the unevenness on one surface of the metal layer changes a surface plasmon to a propagation light and a light loss can be suppressed, and moreover, each unevenness of respective interfaces of the respective organic layers is made smaller than the unevenness on the surface of the metal layer, so that a short circuit inside the device can be suppressed