Panasonic

About: Panasonic is a company organization based out in Kadoma, Ôsaka, Japan. It is known for research contribution in the topics: Signal & Layer (electronics). The organization has 49129 authors who have published 71118 publications receiving 942756 citations. The organization is also known as: Panasonikku Kabushiki-gaisha & Panasonic.

Semiconductor memory card

Abstract: A plurality of audio object (AOB) files and a plurality of picture object (POB) files are stored Default Playlist Information and sets of Playlist Information each show an order in which AOBs stored in the plurality of AOB files are to be reproduced The DPLGI includes DPLI_POB_SRPs that specify at least one POB to be displayed during the playback period of AOBs indicated by the playback order given in the Default Playlist Information The TKGI includes TKI_POB_SRPs that specify at least one POB to be displayed only during the playback period of a particular AOB out of the AOBs indicated by the playback order given in the Default Playlist Information

Electroless plating bath used for forming a wiring of a semiconductor device, and method of forming a wiring of a semiconductor device

Abstract: A contact hole and a wiring groove are formed in an insulating layer formed on a semiconductor substrate. A silver layer is formed inside of the contact hole and the wiring groove and on the insulating layer with the use of an electroless plating bath comprising: silver nitrate containing silver ions; tartaric acid serving as a reducing agent of the silver ions; ethylenediamine serving as a complexing agent of the silver ions; and metallic ions of tetramethylammoniumhydroxide serving as a pH control agent. Then, the silver layer on the insulating layer is removed by a chemical and mechanical polishing method such that an embedded wiring is formed in each of the contact hole and the wiring groove.

Led luminaire with light control means

Abstract: An LED luminaire is formed such that a plurality of LED chips are disposed three-dimensionally on an MID (molded interconnection device) substrate in a rectangular plate shape, by mounting three LED chips on bottom face of respective dents provided lengthwise and crosswise in one surface of the MID substrate, the LED chips including at least two types mutually diffferent in luminous color, desirably three types of red, blue and green colors. Any optional light distribution characteristic is made thereby easily obtainable depending on a configuration of the substrate, luminaire module can be thinned, and such delicate color difference as white color and day-light color of luminescent lamps is enabled by mixing the luminous colors of the respective LED chips.

Design of high speed MOS multiplier and divider using redundant binary representation

Abstract: A high speed multiplier and divider for MOS LSI based on a new algorithm is presented. When we implement the multiplier and the divider in LSI, the features such as high speed operation, small number of transistors and easy layout are the most important factors. A computational algorithm using a redundant binary representation has several excellent features such as high speed addition operations. We improved the algorithm and the method of implementation, and designed an advanced multiplier and divider with the above mentioned features. We expect mat our multiplier and divider are excellent compared with multipliers using the Booth algorithm and the Wallace tree, and with divider using the SRT method, respectively.

Differential transmission line connector

Abstract: A differential transmission line connector with little unwanted radiation noise is provided. A connector connects a differential transmission pattern for multiple transmission of a group of three differential signals and a differential transmission cable. The differential transmission pattern is provided with three signal lines, and the differential transmission cable also is provided with three signal lines. In a plane that is perpendicular to the longitudinal direction of the differential transmission pattern and the differential transmission cable, the signal lines are positioned at the apexes of an equilateral triangle. The connector is provided with three signal lines that connect, at identical lengths, the signal lines of the differential transmission pattern and the signal lines of the differential transmission cable, between a predetermined first plane of the planes that perpendicularly intersect the longitudinal direction of the differential transmission pattern and a predetermined second plane of the planes that perpendicularly intersect the longitudinal direction of the differential transmission cable.