Panasonic

About: Panasonic is a company organization based out in Kadoma, Ôsaka, Japan. It is known for research contribution in the topics: Signal & Layer (electronics). The organization has 49129 authors who have published 71118 publications receiving 942756 citations. The organization is also known as: Panasonikku Kabushiki-gaisha & Panasonic.

Semiconductor device and method of manufacturing the same

Abstract: In the manufacture of semiconductor devices, cracking of a resin member caused during cutting and defects in the external appearance are prevented

Authentication relay apparatus, authentication relay system, integrated circuit, and authentication relay method

Abstract: It is an object to provide an authentication relay apparatus, authentication relay system, and authentication relay method which enables registration of a slave apparatus to a network, even when communication ranges between a master apparatus and a slave apparatus to be registered are restricted and both or one of the registration messages is not reached. A representative registration apparatus 100 includes: a master and slave apparatus supporting control section 101 which generates, according to a registration message received from a master apparatus or a slave apparatus, a registration message to be transmitted to the master apparatus or the slave apparatus; a communication range switching section 104 for switching a transmission range of a message to be transmitted; and a communication range determining section 107 which determines, according to a destination of a registration message generated by the master and slave apparatus supporting control section 101, a transmission range of the registration message thus generated, so as to provide instructions to the communication range switching section 104.

Multithreaded processor for processing multiple instruction streams independently of each other by flexibly controlling throughput in each instruction stream

Abstract: A multithreaded processor for executing multiple instruction streams is provided. This multithreaded processor includes: a plurality of functional units for executing instructions; a plurality of instruction decode units, corresponding to the multiple instruction streams on a one-to-one basis, for respectively decoding an instruction, and producing an instruction issue request for designating to which functional unit the decoded instruction should be issued and requesting for the issuance of the decoded instruction to the designated functional unit; a holding unit for holding the priority level of each instruction stream; and a control unit for deciding which decoded instruction should be issued to a functional unit designated by two or more instruction issue requests at the same time, in accordance with the priority levels held by the holding unit.

Optical disk for high resolution and three-dimensional video recording, optical disk reproduction apparatus and optical disk recording apparatus

Abstract: The present invention has an objective of providing an optical disk having a high resolution picture and a system for reproducing data on the optical disk, which are compatible with a conventional system for reproducing an ordinary resolution picture. A high resolution signal is divided into a main signal and a sub signal by picture division means and MPEG-encoded. The main signal and the sub signal are divided into frames each having 1 GOP or more. The resultant first interleave block 54 and second interleave block 55 are recorded alternately on an optical disk. A high resolution reproduction apparatus reproduced both the first and second interleave blocks, so that a high resolution picture is obtained. A non-high resolution reproduction apparatus reproduces only the first or second interleave block, so that an ordinary resolution picture.

Three-dimensionally stacked lsi

Abstract: Disclosed is a three-dimensionally stacked LSI having a plurality of integrated-circuit layers stacked together, each of which is equipped with a plurality of circuit elements (2, 10, 16). Each of the circuit elements are equipped with a power terminal (4) of its own, which is connected through interlayer via-hole wiring (22) to the power wiring of the uppermost integrated-circuit layer. The power wiring of the uppermost integrated-circuit layer is formed of a metal exhibiting a low electrical resistance, for example, Al, whereas the metal wirings of the other layers, which are exposed to high temperatures when forming the upper layers, are formed of W.