Panasonic

About: Panasonic is a company organization based out in Kadoma, Ôsaka, Japan. It is known for research contribution in the topics: Signal & Layer (electronics). The organization has 49129 authors who have published 71118 publications receiving 942756 citations. The organization is also known as: Panasonikku Kabushiki-gaisha & Panasonic.

Information recording medium and method for producing the same

Abstract: An information recording medium ensuring high recording and erase function and excellent archival characteristic at a high linear velocity and over a wide range of linear velocities is provided. Such a medium is obtained by constructing a recording layer which has a composition that can generate phase change as a whole, of a first through an M-th constituent layers (wherein M is an integer of 2 or greater) which are stacked in a thickness direction, such that elemental compositions of contiguous an m-th constituent layer and a (m+1)th constituent layer are different from each other (wherein m is an integer and satisfies 1≦m≦M) assuming that the constituent layer located at an m-th position from a laser light incident side is the m-th constituent layer. In this information recording medium, at least one m-th constituent layer constituting the recording layer preferably includes at least one element selected from Te, Bi, Sb, Ge, In, Ga, Al, Sn, Pb, Se and Si.

Non-3gpp to 3gpp network handover optimizations

Abstract: The invention relates to a method for a handover of a mobile node from a non-3GPP to a 3GPP network, and of a mobile node, which is located in a non-3GPP/ 3GPP network. The handover is improved by discovering an appropriate MME and registering the mobile node at the discovered MME, in advance . This includes to first determine the location of the mobile node in the non-3GPP network, so as to be able to detect an MME in the vicinity of the mobile node's location. The 3GPP contexts are then transmitted to the new MME before the handover is performed. Moreover, the invention teaches to change the Serving-Gateway in the 3GPP network before performing a handover, thereby accelerating the handover. When a handover gets likely, the mobile node's location is determined and a new Serving-Gateway is selected. The data path is changed to go via the new Serving-Gateway.

Semiconductor wafer package, method and apparatus for connecting testing IC terminals of semiconductor wafer and probe terminals, testing method of a semiconductor integrated circuit, probe card and its manufacturing method

Abstract: A retainer board, holding a semiconductor wafer having a plurality of integrated circuit terminals for testing a semiconductor chip, is provided in confronting relation to a probe sheet having a plurality of probe terminals electrically connected to their corresponding integrated circuit terminals. An insulating substrate, having wiring electrically connected to the plural probe terminals, is provided on the probe sheet in opposed relation to the retainer board. An elastic member is interposed between the probe sheet and the insulating substrate. The retainer board and the probe sheet are brought into so closer relationship that each integrated circuit terminal of the semiconductor wafer held by the retainer board is electrically connected to its corresponding probe terminal of the probe sheet.

Information recording medium, and method and apparatus for managing defect thereof

Abstract: An information recording medium includes a disk information area; a user area including a plurality of sectors; and a spare area including at least one sector which, when at least one of the plurality of sectors included in the user area is a defective sector, is usable instead of the at least one defective sector. The spare area is located radially inward from the user area. A physical sector number of a sector to which a logical sector number “0” is assigned, among the plurality of sectors included in the user area and the at least one sector included in the spare area, is recorded in the disk information area.

Effect of Heat Treatment after Cold Working on the Phase Transformation in TiNi Alloy

Abstract: Etude par calorimetrie differentielle a balayage des transformations de phases entre trois types: type CsCl, rhomboedrique et monoclinique dans les alliages Ti-49,7-50,2 et 50,6% at. Ni entre 633 et 933 K. Les transformations sont classees en trois types dependant de la temperature de traitement. Influence de la teneur en nickel