Parker Hannifin

About: Parker Hannifin is a company organization based out in Cleveland, Ohio, United States. It is known for research contribution in the topics: Ball valve & Valve guide. The organization has 1937 authors who have published 1953 publications receiving 25505 citations. The organization is also known as: Parker & Parker Appliance Company.

Medication infusion pump

Abstract: An extracorporeal medication infusion device provides a precise infusion rate of a liquid medication into a human or animal body. The infusion device includes a permanent portion which has a case, a battery, a programmable electronic controller, and an electromagnetic solenoid core and solenoid coil for providing an actuation force. The infusion device also includes a disposable portion which includes a reservoir filled with a liquid medication that is to be dispensed and a pump for pumping the medication from the reservoir into the user's body. The pump includes a pump chamber and a piston connected to an electromagnetic armature for altering the volume of the pump chamber in response to the actuation force.

Fundamental Frequency Switching Strategies of a Seven-Level Hybrid Cascaded H-Bridge Multilevel Inverter

Abstract: This paper presents a cascaded H-bridge multilevel inverter that can be implemented using only a single dc power source and capacitors. Standard cascaded multilevel inverters require n dc sources for 2n + 1 levels. Without requiring transformers, the scheme proposed here allows the use of a single dc power source (e.g., a battery or a fuel cell stack) with the remaining n-1 dc sources being capacitors, which is referred to as hybrid cascaded H-bridge multilevel inverter (HCMLI) in this paper. It is shown that the inverter can simultaneously maintain the dc voltage level of the capacitors and choose a fundamental frequency switching pattern to produce a nearly sinusoidal output. HCMLI using only a single dc source for each phase is promising for high-power motor drive applications as it significantly decreases the number of required dc power supplies, provides high-quality output power due to its high number of output levels, and results in high conversion efficiency and low thermal stress as it uses a fundamental frequency switching scheme. This paper mainly discusses control of seven-level HCMLI with fundamental frequency switching control and how its modulation index range can be extended using triplen harmonic compensation.

Dual wall safety tube

Abstract: A dual wall safety tube assembly comprises an inner, seamless, stainless steel tube of extended length and an outer, welded stainless steel tube of the same length, in which the inner tube is connected as a process line without any junctions except for end couplings and the outer tube is similarly connected as a monitoring or inerting conduit. The assembly may include further options of electric heating cable, plastic jacketing and thermal insulation of fiberglass or similar material.

Disposable, pre-calibrated, pre-validated sensors for use in bio-processing applications

Abstract: Disposable, pre-sterilised, and pre-califorated, pre- validated conductivity sensors are provided. These sensors are designed to store sensor-specific information, such as calibration and production information, in a non-volatile memory chip on the sensor. The sensors are calibrated using 0,100 molar potassium chloride (KCl) solutions at 25 degrees Celsius. These sensors may be utilize with in-line systems, closed fluid circuits, bioprocessing systems, or systems which require an aseptic environment while avoiding or reducing cleaning procedures and quality assurance variances.

Conformal thermal interface material for electronic components

Abstract: A thermally-conductive interface for conductively cooling a heat-generating electronic component having an associated thermal dissipation member such as a heat sink. The interface is formed as a self-supporting layer of a thermally-conductive material which is form-stable at normal room temperature in a first phase and substantially conformable in a second phase to the interface surfaces of the electronic component and thermal dissipation member. The material has a transition temperature from the first phase to the second phase which is within the operating temperature range of the electronic component.