Institution
Qualcomm
Company•Farnborough, United Kingdom•
About: Qualcomm is a company organization based out in Farnborough, United Kingdom. It is known for research contribution in the topics: Wireless & Signal. The organization has 19408 authors who have published 38405 publications receiving 804693 citations. The organization is also known as: Qualcomm Incorporated & Qualcomm, Inc..
Papers published on a yearly basis
Papers
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16 Jun 2008TL;DR: In this paper, a method and system for electronic access security uses touches and movements on a touch sensitive surface to determine graphical passcode that are used in a manner similar to passwords.
Abstract: A method and system for electronic access security uses touches and movements on a touch sensitive surface to determine graphical passcode that are used in a manner similar to passwords. Graphical passcodes comprise various combinations of swipes, taps or drags on a touchscreen surface as defined by a user. A user's selected graphical passcode is stored in memory for comparison to subsequent entries of graphical passcode in order to authenticate the users. An envelope may be generated to define a range of acceptable pressure, speed, coordinate positions or other parameters, as a function of time or position, required for passcode authentication. The envelope may be stored in a computer memory and is used to authenticate a user by determine whether an entered graphical passcode falls within the envelope.
160 citations
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27 Sep 2013TL;DR: In this paper, a wireless power receiver includes a first inductive element configured to receive wireless charging power from a transmitter and a position detector configured to determine a lateral position of the receiver relative to the transmitter based on characteristics of the first and second inductive elements.
Abstract: This disclosure provides systems, methods and apparatus for wireless power transfer and particularly wireless power transfer to remote systems such as electric vehicles. In one aspect, a wireless power receiver includes a first inductive element configured to receive wireless charging power from a transmitter. The wireless power receiver further includes a second inductive element, laterally separated from the first, configured to receive wireless charging power from the transmitter. The wireless power receiver further includes a position detector configured to determine a lateral position of the receiver relative to the transmitter based on characteristics of the first and second inductive elements.
160 citations
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11 Feb 2019TL;DR: In this paper, the authors extend the principle of equivariance to symmetry transformations to local gauge transformations, which enables the development of a very general class of convolutional neural networks on manifolds that depend only on the intrinsic geometry, including many popular methods from equivariant and geometric deep learning.
Abstract: The principle of equivariance to symmetry transformations enables a theoretically grounded approach to neural network architecture design. Equivariant networks have shown excellent performance and data efficiency on vision and medical imaging problems that exhibit symmetries. Here we show how this principle can be extended beyond global symmetries to local gauge transformations. This enables the development of a very general class of convolutional neural networks on manifolds that depend only on the intrinsic geometry, and which includes many popular methods from equivariant and geometric deep learning. We implement gauge equivariant CNNs for signals defined on the surface of the icosahedron, which provides a reasonable approximation of the sphere. By choosing to work with this very regular manifold, we are able to implement the gauge equivariant convolution using a single conv2d call, making it a highly scalable and practical alternative to Spherical CNNs. Using this method, we demonstrate substantial improvements over previous methods on the task of segmenting omnidirectional images and global climate patterns.
160 citations
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08 May 2009TL;DR: In this paper, a first electrode and a sacrificial layer are sequentially formed on a substrate, and then first openings for forming supports inside are formed in the first electrodes and the sacrificial layers.
Abstract: A first electrode and a sacrificial layer are sequentially formed on a substrate, and then first openings for forming supports inside are formed in the first electrode and the sacrificial layer. The supports are formed in the first openings, and then a second electrode is formed on the sacrificial layer and the supports, thus forming a micro electro mechanical system structure. Afterward, an adhesive is used to adhere and fix a protection structure to the substrate for forming a chamber to enclose the micro electro mechanical system structure, and at least one second opening is preserved on sidewalls of the chamber. A release etch process is subsequently employed to remove the sacrificial layer through the second opening in order to form cavities in an optical interference reflection structure. Finally, the second opening is closed to seal the optical interference reflection structure between the substrate and the protection structure.
160 citations
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TL;DR: In this article, the power-law relationship between strain rate and stress was observed at most of the temperatures at which pure tin, Sn-3.5Ag and Sn-5Sb electronic solder alloys, have been studied at various temperatures between ambient and 473 K (homologous temperature 0.58 to 0.85).
Abstract: Creep deformation characteristics of pure tin, and Sn-3.5Ag and Sn-5Sb electronic solder alloys, have been studied at various temperatures between ambient and 473 K (homologous temperature 0.58 to 0.85). Power-law relationships between strain rate and stress were observed at most of the temperatures. The stress exponent (n=7.6, 5.0, and 5.0) and activation energy (Q
c
=60.3, 60.7, and 44.7 kJ/mol) values were obtained in the case of tin, Sn-3.5Ag, and Sn-5Sb respectively. Based on n and Q
c
values, it is suggested that the rate controlling creep-deformation mechanism is dislocation climb controlled by lattice diffusion in pure tin and Sn-3.5Ag alloy, and viscous glide controlled by pipe diffusion in Sn-5Sb alloy. The results on Sn-3.5Ag bulk material are compared with the initial results on solder bump arrays.
160 citations
Authors
Showing all 19413 results
Name | H-index | Papers | Citations |
---|---|---|---|
Jian Yang | 142 | 1818 | 111166 |
Xiaodong Wang | 135 | 1573 | 117552 |
Jeffrey G. Andrews | 110 | 562 | 63334 |
Martin Vetterli | 105 | 761 | 57825 |
Vinod Menon | 101 | 269 | 60241 |
Michael I. Miller | 92 | 599 | 34915 |
David Tse | 92 | 438 | 67248 |
Kannan Ramchandran | 91 | 592 | 34845 |
Michael Luby | 89 | 282 | 34894 |
Max Welling | 89 | 441 | 64602 |
R. Srikant | 84 | 432 | 26439 |
Jiaya Jia | 80 | 294 | 33545 |
Hai Li | 79 | 570 | 33848 |
Simon Haykin | 77 | 454 | 62085 |
Christopher W. Bielawski | 76 | 334 | 32512 |