Institution
Qualcomm
Company•Farnborough, United Kingdom•
About: Qualcomm is a company organization based out in Farnborough, United Kingdom. It is known for research contribution in the topics: Wireless & Signal. The organization has 19408 authors who have published 38405 publications receiving 804693 citations. The organization is also known as: Qualcomm Incorporated & Qualcomm, Inc..
Papers published on a yearly basis
Papers
More filters
•
TL;DR: In this article, the authors compared three large-scale propagation path loss models for use over the entire microwave and millimeter-wave (mmWave) radio spectrum: the alpha-beta-gamma (ABG) model, the close-in (CI) free space reference distance model, and the CI model with a frequency-weighted path loss exponent (CIF).
Abstract: This paper compares three candidate large-scale propagation path loss models for use over the entire microwave and millimeter-wave (mmWave) radio spectrum: the alpha-beta-gamma (ABG) model, the close-in (CI) free space reference distance model, and the CI model with a frequency-weighted path loss exponent (CIF). Each of these models have been recently studied for use in standards bodies such as 3GPP, and for use in the design of fifth generation (5G) wireless systems in urban macrocell, urban microcell, and indoor office and shopping mall scenarios. Here we compare the accuracy and sensitivity of these models using measured data from 30 propagation measurement datasets from 2 GHz to 73 GHz over distances ranging from 4 m to 1238 m. A series of sensitivity analyses of the three models show that the physically-based two-parameter CI model and three-parameter CIF model offer computational simplicity, have very similar goodness of fit (i.e., the shadow fading standard deviation), exhibit more stable model parameter behavior across frequencies and distances, and yield smaller prediction error in sensitivity testing across distances and frequencies, when compared to the four-parameter ABG model. Results show the CI model with a 1 m close-in reference distance is suitable for outdoor environments, while the CIF model is more appropriate for indoor modeling. The CI and CIF models are easily implemented in existing 3GPP models by making a very subtle modification -- by replacing a floating non-physically based constant with a frequency-dependent constant that represents free space path loss in the first meter of propagation.
255 citations
•
19 Feb 2003TL;DR: In this paper, the authors propose techniques to transmit data on a number of transmission channels in a multi-channel communication system using multiple transmission schemes requiring less channel-state information (CSI), which may include a partial-CSI transmission scheme that transmits a single data stream on each transmit antenna selected for use and a beam-forming scheme that allocates all transmit power to a single transmission channel having the best performance.
Abstract: Techniques to transmit data on a number of transmission channels in a multi-channel communication system using multiple transmission schemes requiring less channel-state information (CSI). These schemes may include a partial-CSI transmission scheme that transmits a single data stream on each transmit antenna selected for use and a “beam-forming” transmission scheme that allocates all transmit power to a single transmission channel having the best performance. Each transmission scheme may provide good or near-optimum performance for a specific range of operating conditions (or operating SNRs). These multiple transmission schemes may then be combined in a piece-wise fashion to form a “multi-mode” transmission scheme that covers the full range of operating conditions supported by the MIMO system. The specific transmission scheme to be used for data transmission at any given moment would then be dependent on the specific operating condition experienced by the system at that moment.
255 citations
•
22 Jan 2002TL;DR: In this paper, an integrated chip package structure and method of manufacturing the same is by adhering dies on an organic substrate and forming a thin-film circuit layer on top of the dies and the organic substrate.
Abstract: An integrated chip package structure and method of manufacturing the same is by adhering dies on an organic substrate and forming a thin-film circuit layer on top of the dies and the organic substrate. Wherein the thin-film circuit layer has an external circuitry, which is electrically connected to the metal pads of the dies, that extends to a region outside the active surface of the dies for fanning out the metal pads of the dies. Furthermore, a plurality of active devices and an internal circuitry is located on the active surface of the dies. Signal for the active devices are transmitted through the internal circuitry to the external circuitry and from the external circuitry through the internal circuitry back to other active devices. Moreover, the chip package structure allows multiple dies with different functions to be packaged into an integrated package and electrically connecting the dies by the external circuitry.
255 citations
•
28 Oct 1994TL;DR: In this article, a receiver having a plurality of demodulation elements (204A, 204B, 204C) is considered, and the number of reassignments is controlled so that excessive data is not lost during the reassignment process.
Abstract: In a receiver having a plurality of demodulation elements (204A, 204B, 204C), a method of assigning the plurality of demodulation element to a set of available signals. A first method emphasizes diversity of transmitting devices so that power control is optimal. A second method emphasizes the maximum signal strength available to produce aggregate maximum signal strength. Both methods control the number of reassignments so that excessive data is not lost during the reassignment process. The apparatus comprises the plurality of demodulation elements (204A, 204B, 204C), at least one searcher element (202), and a controller (200).
254 citations
•
17 Oct 2001TL;DR: In this article, a method and apparatus for arbitrating between a first communication device having floor control in a group communication network and a second communication device competing for floor control is presented.
Abstract: A method and apparatus for arbitrating between a first communication device having floor control in a group communication network and a second communication device competing for floor control provides receiving a floor-control request from the second communication device, comparing respective priority levels of the first communication device and the second communication device, and granting floor control to the second communication device if the second communication device has a higher or equal priority level. In one embodiment, the controller receives the request for floor control from a push-to-talk (PTT) device.
254 citations
Authors
Showing all 19413 results
Name | H-index | Papers | Citations |
---|---|---|---|
Jian Yang | 142 | 1818 | 111166 |
Xiaodong Wang | 135 | 1573 | 117552 |
Jeffrey G. Andrews | 110 | 562 | 63334 |
Martin Vetterli | 105 | 761 | 57825 |
Vinod Menon | 101 | 269 | 60241 |
Michael I. Miller | 92 | 599 | 34915 |
David Tse | 92 | 438 | 67248 |
Kannan Ramchandran | 91 | 592 | 34845 |
Michael Luby | 89 | 282 | 34894 |
Max Welling | 89 | 441 | 64602 |
R. Srikant | 84 | 432 | 26439 |
Jiaya Jia | 80 | 294 | 33545 |
Hai Li | 79 | 570 | 33848 |
Simon Haykin | 77 | 454 | 62085 |
Christopher W. Bielawski | 76 | 334 | 32512 |