Institution
Qualcomm
Company•Farnborough, United Kingdom•
About: Qualcomm is a company organization based out in Farnborough, United Kingdom. It is known for research contribution in the topics: Wireless & Signal. The organization has 19408 authors who have published 38405 publications receiving 804693 citations. The organization is also known as: Qualcomm Incorporated & Qualcomm, Inc..
Papers published on a yearly basis
Papers
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12 May 2009TL;DR: In this article, the authors propose an avatar selection criteria that enables a processor to automatically select an avatar that reflects the user's current status by correlating sensor data, calendar data and device settings.
Abstract: A cellular or wireless mobile device includes a one or more sensors and a processor configured with software to receive data from the one or more sensors, calendar data and device settings, compare sensor, calendar, device settings data, and an authorization level of a requesting user to avatar selection criteria, and select an avatar based upon the comparison. By correlating sensor data, calendar data and device settings to a user's current status, the avatar selection criteria enables a processor to automatically select an avatar that reflects the user's current status. Others then can be informed of the user's current status by accessing the user's avatar.
187 citations
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16 Oct 2002TL;DR: In this paper, a set of at least three indicators are generated based on processing a portion of a satellite positioning system signal received by a receiver and computing a measurement of a parameter from an interpolation of the set of indicators.
Abstract: Method and apparatuses for receiving and tracking satellite signals in a highly sensitive and accurate receiver. In one aspect of the invention an exemplary method includes generating a set of at least three indicators based on processing a portion of a satellite positioning system signal received by a receiver and computing a measurement of a parameter from an interpolation of the set of indicators. Each of the indicators corresponds to a different predetermined hypothesized value of the parameter and is indicative of a probability, or likelihood, that the parameter of the signal is equal to that corresponding value.
187 citations
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31 Jan 1997TL;DR: A cellular telephone that provides the capability of performing Internet telephone calls without the bulk and expense of Internet telephone computer systems was proposed in this article, using hardware vocoders and communication circuitry already present in the cellular telephone for normal cellular calls.
Abstract: A cellular telephone that provides the capability of performing Internet telephone calls without the bulk and expense of Internet telephone computer systems. The cellular telephone uses hardware vocoders and communication circuitry already present in the cellular telephone for normal cellular calls to provide the additional Internet telephone functionality.
187 citations
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20 Jun 2008TL;DR: Dynamic mobile coupons (DMCs) having a variable commercial value and/or other variable coupon characteristic are provided in this paper, where a DMC can be distributed to a mobile device based on criteria established by a sponsor of the DMC.
Abstract: Dynamic mobile coupons (DMCs) having a variable commercial value and/or other variable coupon characteristic are provided herein. By way of example, a DMC can be distributed to a mobile device based on criteria established by a sponsor of the DMC. A redemption value of the DMC can be variable and dynamically established based at least in part on data associated with a recipient mobile device. Upon redemption of the DMC at a retail entity, the value is fixed and applied to a transaction. Details of the transaction are provided to a remote clearinghouse that performs mediation and indemnification functions to finalize the transaction. As described, the subject disclosure provides a DMC that facilitates a rich and flexible mechanism to generate purchasing incentive for consumers in a mobile environment.
187 citations
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TL;DR: In this paper, a system-in packages, or multichip modules, are described, which can include multi-layer chips and multiple-layer dummy substrates over a carrier.
Abstract: System-in packages, or multichip modules, are described which can include multi-layer chips and multi-layer dummy substrates over a carrier, multiple through vias blindly or completely through the multi-layer chips and completely through the multi-layer dummy substrates, multiple metal plugs in the through vias, and multiple metal interconnects, connected to the metal plugs, between the multi-layer chips. The multi-layer chips can be connected to each other or to an external circuit or structure, such as mother board, ball grid array (BGA) substrate, printed circuit board, metal substrate, glass substrate, or ceramic substrate, through the metal plugs and the metal interconnects.
187 citations
Authors
Showing all 19413 results
Name | H-index | Papers | Citations |
---|---|---|---|
Jian Yang | 142 | 1818 | 111166 |
Xiaodong Wang | 135 | 1573 | 117552 |
Jeffrey G. Andrews | 110 | 562 | 63334 |
Martin Vetterli | 105 | 761 | 57825 |
Vinod Menon | 101 | 269 | 60241 |
Michael I. Miller | 92 | 599 | 34915 |
David Tse | 92 | 438 | 67248 |
Kannan Ramchandran | 91 | 592 | 34845 |
Michael Luby | 89 | 282 | 34894 |
Max Welling | 89 | 441 | 64602 |
R. Srikant | 84 | 432 | 26439 |
Jiaya Jia | 80 | 294 | 33545 |
Hai Li | 79 | 570 | 33848 |
Simon Haykin | 77 | 454 | 62085 |
Christopher W. Bielawski | 76 | 334 | 32512 |