Raytheon

About: Raytheon is a company organization based out in Waltham, Massachusetts, United States. It is known for research contribution in the topics: Signal & Antenna (radio). The organization has 15290 authors who have published 18973 publications receiving 300052 citations.

Error-Correcting Codes and Self-Checking Circuits

Abstract: Error-control coding techniques, implemented by means of self-checking circuits, will improve system reliability.

Microstrip Propagation on Magnetic Substrates - Part I: Design Theory

Abstract: Formulas and graphs are presented for the effective relative permeability and the filling factors of magnetic substrates in microstrip. Both the propagation and the magnetic loss filling factors are included. In the calculation of these quantities, use was made of the filling factors for dielectric substrates obtained from Wheeler's analysis and a duality relationship between magnetic and dielectric substrates derived in this paper.

Track association and track fusion with nondeterministic target dynamics

Abstract: Representative track fusion algorithms and track association metrics are quantitatively compared using a simple linear-Gaussian-Poisson model, under various degrees of nondeterministicity of the target dynamics, i.e., process noises, and of the initial condition uncertainty. Track fusion algorithms are compared using an analytical method, while track association metrics are evaluated by Monte Carlo simulations.

Heat spreader system for cooling heat generating components

Abstract: An isothermal equilibrium system takes point sources of heat generated by the operation of heat generating components and spreads the heat throughout the system where the heat may be dissipated. An atomizer for atomizing a liquid coolant, is positioned inside a sealed housing. The atomized liquid coolant is distributed as a thin film over the surface of the heat generating components and the wall of the sealed housing. Heat is transferred from the surface of the heat generating components by vaporization of at least a portion of the thin film of liquid coolant. The coolant vapor condenses on the housing and other cool surfaces and returns to the liquid state. The system heat is then removed from the outer surfaces of the housing using conventional heat transfer mechanisms including free or forced air convection and/or circulation of liquid coolant over the exterior of the housing. If additional cooling is desired, heat exchanger tubes may be included inside the sealed housing. An input liquid or gaseous coolant is circulated through the exchanger tubes. Heat is transferred to the coolant and then conducted away from the heat generating component housing.