Samsung

About: Samsung is a company organization based out in Seoul, South Korea. It is known for research contribution in the topics: Layer (electronics) & Signal. The organization has 134067 authors who have published 163691 publications receiving 2057505 citations. The organization is also known as: Samsung Group & Samsung chaebol.

Thin film transistor and method of fabricating the same

Abstract: A thin film transistor having an offset or a lightly doped drain (LDD) structure by self alignment and a method of fabricating the same comprises a substrate, a silicon layer disposed on the substrate and including a channel region, a source region and a drain region at both sides of the channel region, and offset regions, each offset regions disposed between the channel region and one of the source and drain regions at both sides of the channel region, a gate insulating layer covering the channel region and the offset regions disposed at both sides of the channel region excluding the source and drain regions, and a gate layer formed on the channel region excluding the offset regions. The thin film transistor has the structure in which an offset or LDD is obtained without an additional mask process.

Apparatus and method for streaming multimedia data

Abstract: A multimedia streaming apparatus and method by which multimedia data is adaptively transmitted according to the conditions of a network are provided. The multimedia streaming apparatus streams multimedia data corresponding to a predetermined QoS level in response to a parsing result of metadata corresponding to multimedia data intended to be provided and information on a network bandwidth measured by a client which receives the multimedia data. Accordingly, adaptive multimedia streaming corresponding to the bandwidth change of the network can be performed without imposing an additional burden on a server.

Enhanced Thermal Conductivity of Polymer Matrix Composite via High Solids Loading of Aluminum Nitride in Epoxy Resin

Abstract: Most semiconductor devices are now packaged in an epoxy polymer composite, which includes silica powder filler for reducing the thermal expansion coefficient. However, increased heat output from near-future semiconductors will require higher thermal conductivity fillers such as aluminum nitride (AlN) powder, instead of silica. Dispersant chemistry is applied, in order to achieve a high volume percentage of AlN powder in epoxy without causing excessive viscosity before the epoxy monomer is crosslinked, thereby increasing the thermal conductivity of the composite. In the preliminary experiment, high solids loading, up to 57 vol%, was achieved with a wide particle size distribution, and the viscosity of that dispersion was 60 000 to 90 000 cps, resulting in easy flow by gravity alone at room temperature. The highest thermal conductivity of the composites measured by the hot-disk method was 3.39 W/mK, which is approximately 15 times higher than pure epoxy. The Agari and Uno model was a good fit to the experimental data. Electronic I–V curves obtained after encapsulation of testing devices indicated that the highly AlN-filled epoxy slip appeared to be feasible for use in the encapsulation of integrated circuit chips.

Schedule management system using interactive robot and method and computer-readable medium thereof

Abstract: An interactive robot may audibly communicate with a user, determine whether reasoning is performed according to a reasoning weight of a schedule if there is a schedule to be recommended by the interactive robot during conversation between the interactive robot and the user, perform reasoning using information collected in a database if reasoning is necessary, and provide schedule information to the user.

Point-to-multipoint in-band mmwave backhaul for 5G networks

Abstract: Cost-effective and scalable wireless backhaul solutions are essential for realizing the 5G vision of providing gigabits per second anywhere. Not only is wireless backhaul essential to support network densification based on small cell deployments, but also for supporting very low latency inter-BS communication to deal with intercell interference. Multiplexing backhaul and access on the same frequency band (in-band wireless backhaul) has obvious cost benefits from the hardware and frequency reuse perspective, but poses significant technology challenges. We consider an in-band solution to meet the backhaul and inter-BS coordination challenges that accompany network densification. Here, we present an analysis to persuade the readers of the feasibility of in-band wireless backhaul, discuss realistic deployment and system assumptions, and present a scheduling scheme for inter- BS communications that can be used as a baseline for further improvement. We show that an inband wireless backhaul for data backhauling and inter-BS coordination is feasible without significantly hurting the cell access capacities.