Samsung

About: Samsung is a company organization based out in Seoul, South Korea. It is known for research contribution in the topics: Layer (electronics) & Signal. The organization has 134067 authors who have published 163691 publications receiving 2057505 citations. The organization is also known as: Samsung Group & Samsung chaebol.

Method and apparatus for image-based photorealistic 3D face modeling

Abstract: An apparatus and method for image-based 3D photorealistic head modeling are provided. The method for creating a 3D photorealistic head model includes: detecting frontal and profile features in input frontal and profile images; generating a 3D head model by fitting a 3D genetic model using the detected facial features; generating a realistic texture from the input frontal and profile images; and mapping the texture onto the 3D head model. In the apparatus and method, data obtained using a relatively cheap device, such as a digital camera, can be processed in an automated manner, and satisfactory results can be obtained even from imperfect input data. In other words, facial features can be extracted in an automated manner, and a robust “human-quality” face analysis algorithm is used.

Ag3Sn plate formation in the solidification of near-ternary eutectic Sn-Ag-Cu

Abstract: Near-ternary eutectic Sn-Ag-Cu alloys are leading lead-free candidate solders for various applications. These alloys yield three phases upon solidification: β-Sn,Ag3Sn, and Cu6Sn5. Large, plate-like, pro-eutectic Ag3Sn structures can grow rapidly within the liquid phase, potentially adversely affecting the mechanical behavior and reducing the fatigue life of solder joints. This article reports on the formation of such plates in Sn-Ag-Cu solder balls and joints and demonstrates how large Ag3Sn plate formation can be minimized.

Beyond 3G: vision, requirements, and enabling technologies

Abstract: This article introduces the vision and requirements for future development of mobile communications systems, and discusses several key enabling technologies such as modulation and multiple access schemes, multiple antenna techniques, and an IP-based network, considered important to realize this vision in real-world systems.

Method of forming a thin wafer stack for a wafer level package

Abstract: A method of forming a stack of thin wafers provides a wafer level stack to greatly reduce process time compared to a method where individually separated chips are stacked after a wafer is sawed. A rigid planar wafer support member stabilizes and planarizes each wafer while it is thin or its thickness is reduced and during subsequent wafer processing. Thinned wafers are stacked and the external support members are removed by applying heat or ultraviolet (UV) light to an expandable adhesive layer between the support members and the thin wafers. The stacked wafers then can be further processed and packaged without thin-wafer warping, cracking or breaking. A wafer level package made in accordance with the invented method also is disclosed.