scispace - formally typeset
Search or ask a question
Institution

STMicroelectronics

CompanyGeneva, Switzerland
About: STMicroelectronics is a company organization based out in Geneva, Switzerland. It is known for research contribution in the topics: Transistor & Signal. The organization has 17172 authors who have published 29543 publications receiving 300766 citations. The organization is also known as: SGS-Thomson & STM.


Papers
More filters
Proceedings ArticleDOI
23 May 2004
TL;DR: Experimental results on sensing time, offset, and sensitivity demonstrated the effectiveness of the proposed topology, designed for phase change memories, however, it is also suitable for use in other non-volatile storage devices such as magnetic RAMs and Flash memories.
Abstract: This paper presents a fully symmetrical sense amplifier topology for advanced non-volatile memories. The proposed structure ensures zero systematic offset, together with adequate rejection of disturbs coming from capacitive coupling with noisy substrate, power supply, and ground. The presented topology has been designed for phase change memories, however, it is also suitable for use in other non-volatile storage devices such as magnetic RAMs and Flash memories. Experimental results on sensing time, offset, and sensitivity demonstrated the effectiveness of the proposed scheme.

69 citations

Proceedings ArticleDOI
18 Aug 2016
TL;DR: In this article, the authors presented the morphological and electrical characterizations of a test vehicle using a dual damascene integration for the hybrid bonding level and analyzed the main parameters to assess the bonding interface quality.
Abstract: 3D Stacked Image sensor is the stacking of a Back-Side Illuminated (BSI) CMOS Image Sensor on a logic die. It enables compact size, higher performances and additional functionalities compared to standard BSI sensors. The highest footprint reduction is obtained with 3D hybrid bonding with metal interconnects between top and bottom tiers. Hybrid bonding process with oxide / copper direct bonding allows the highest scalability of interconnect pitch. In this study we present the morphological and electrical characterizations of a test vehicle. The hybrid bonding of wafers from two different technology nodes is performed using a dual damascene integration for the hybrid bonding level. The main parameters to assess the bonding interface quality are analyzed such as the influence of the pad design, the impact of reworkability and wafer -- to-wafer overlays. The process robustness is studied through reliability tests and electromigration measurements.

69 citations

Patent
21 Dec 1988
TL;DR: In this article, a low-pass filter of the first order made using the switched capacitors technique utilizes advantageously a single switched capacitor and only two switches in contrast to the filters of the prior art which utilize two switched capacistors and four switches.
Abstract: An integrated, low-pass filter of the first order made using the switched capacitors technique utilizes advantageously a single switched capacitor and only two switches in contrast to the filters of the prior art which utilize two switched capacitors and four switches. The filter of the invention requires a smaller integration area and moreover exhibits a greater precision of its DC gain.

69 citations

Journal ArticleDOI
TL;DR: In this article, the effects of the precursor composition and the nature of the additional surfactants on the structure and stability of low-polydispersity copper nanoparticles are characterized by TEM and UV-Vis analysis.
Abstract: Low-polydispersity copper nanoparticles (NPs) are prepared through hydrogenolysis of various organometallic copper precursors in an organic medium at moderate temperature. The effects of the precursor composition and the nature of the additional surfactants on the structure and stability of NPs are characterized by TEM and UV-Vis analysis. The improved air stability of copper NPs originating from amidinate copper and stabilized by an alkylamine compound (hexadecylamine) is evidenced and compared with the effect of a long chain carboxylic acid (oleic acid).

69 citations

Journal ArticleDOI
TL;DR: In this paper, the authors investigated the electrical resistivity of polycrystalline thin polysilicon thin films and found that the phonon contribution to the resistivity was linear in temperature above 300 K.
Abstract: Electrical resistivity in the temperature range of 2–1100 K and Hall‐effect measurements from 10 to 300 K of CoSi2, MoSi2, TaSi2, TiSi2, and WSi2 polycrystalline thin films were studied. Structure, composition, and impurities in these films were investigated by a combination of techniques of Rutherford backscattering spectroscopy, x‐ray diffraction, transmission electron microscopy, and Auger electron spectroscopy. These silicides are metallic, yet there is a remarkable difference in their residual resistivity values and in their temperature dependence of the intrinsic resistivities. For CoSi2, MoSi2, and TiSi2, the phonon contribution to the resistivity was found to be linear in temperature above 300 K. At high temperatures, while a negative deviation from the linearity followed by a quasisaturation was observed for TaSi2, the resistivity data of WSi2 showed a positive deviation from linearity. It is unique that the residual resistivity, ρ(2 K), of the WSi2 films is quite high, yet the temperature depend...

69 citations


Authors

Showing all 17185 results

NameH-indexPapersCitations
Bharat Bhushan116127662506
Albert Polman9744542985
G. Pessina8482830807
Andrea Santangelo8388629019
Paolo Mattavelli7448219926
Daniele Ielmini6836716443
Jean-François Carpentier6245914271
Robert Henderson5844013189
Bruce B. Doris5660412366
Renato Longhi551778644
Aldo Romani5442511513
Paul Muralt5434412694
Enrico Zanoni5370513926
Gaudenzio Meneghesso5170312567
Franco Zappa502749211
Network Information
Related Institutions (5)
Intel
68.8K papers, 1.6M citations

92% related

Motorola
38.2K papers, 968.7K citations

91% related

Samsung
163.6K papers, 2M citations

90% related

NEC
57.6K papers, 835.9K citations

89% related

Toshiba
83.6K papers, 1M citations

89% related

Performance
Metrics
No. of papers from the Institution in previous years
YearPapers
202225
2021560
2020798
2019952
2018948
2017781