STMicroelectronics

About: STMicroelectronics is a company organization based out in Geneva, Switzerland. It is known for research contribution in the topics: Signal & Transistor. The organization has 17172 authors who have published 29543 publications receiving 300766 citations. The organization is also known as: SGS-Thomson & STM.

A Bipolar-Selected Phase Change Memory Featuring Multi-Level Cell Storage

Abstract: In this paper, a 90-nm 128-Mcell non-volatile memory based on phase-change Ge2-Sb2-TeB alloy is presented. Memory cells are bipolar selected, and are based on a /xtrench architecture. Experimental investigation on multi-level cell (MLC) storage is addressed exploiting the chip MLC capability. To this end, a programming algorithm suitable for 2 bit/cell storage achieving tightly placed inner states (in terms of cell current or resistance) is proposed. Measurements showed the possibility of placing the required distinct cell current distributions, thus demonstrating the feasibility of the MLC phase-change memory (PCM) storage concept. Endurance tests were also carried out. Cumulative distribu tions after 2-bit/cell programming before cycling and after 100 k program cycles followed by 1 h/150 degC bake are presented. Experimental results on MLC endurance are also provided from a 180-nm 8-Mb PCM demonstrator with the same mutrench cell structure.

Low-field amorphous state resistance and threshold voltage drift in chalcogenide materials

Abstract: A detailed investigation of the time evolution for the low-field resistance R/sub off/ and the threshold voltage V/sub th/ in chalcogenide-based phase-change memory devices is presented. It is observed that both R/sub off/ and V/sub th/ increase and become stable with time and temperature, thus improving the cell readout window. Relying on a microscopic model, the drift of R/sub off/ and V/sub th/ is linked to the dynamic of the intrinsic traps typical of amorphous chalcogenides, thus providing for the first time a unified framework for the comprehension of chalcogenide materials transient behavior.

The end of CMOS scaling: toward the introduction of new materials and structural changes to improve MOSFET performance

Abstract: The rapid cadence of metal-oxide semiconductor field-effect transistor (MOSFET) scaling, as seen in the new 2003 International Technology Roadmap for Semiconductors ITRS), is accelerating introduction of new technologies to extend complementary MOS (CMOS) down to, and perhaps beyond, the 22-nm node This acceleration simultaneously requires the industry to intensify research on two highly challenging thrusts: one is scaling CMOS into an increasingly difficult manufacturing domain well below the 90-nm node for high performance (HP), low operating power (LOP), and low standby power (LSTP) applications, and the other is an exciting opportunity to invent fundamentally new approaches to information and signal processing to sustain functional scaling beyond the domain of CMOS This article is focused on scaling CMOS to its fundamental limits, determined by manufacturing, physics, and costs using new materials and nonclassical structures This paper provides a brief introduction to each of the new nonclassical CMOS structures This is followed by a presentation of one scenario for introduction of new structural changes to the MOSFET to scale CMOS to the end of the ITRS A brief review of electrostatic scaling of a MOSFET necessary to manage short channel effects (SCEs) at the most advanced technology nodes is also provided

Plasma wave detection of terahertz radiation by silicon field effects transistors: Responsivity and noise equivalent power

Abstract: Si metal oxide semiconductor field effect transistors (MOSFETs) with the gate lengths of 120–300nm have been studied as room temperature plasma wave detectors of 0.7THz electromagnetic radiation. In agreement with the plasma wave detection theory, the response was found to depend on the gate length and the gate bias. The obtained values of responsivity (⩽200V∕W) and noise equivalent power (⩾10−10W∕Hz0.5) demonstrate the potential of Si MOSFETs as sensitive detectors of terahertz radiation.

Broadband terahertz imaging with highly sensitive silicon CMOS detectors

Abstract: This paper investigates terahertz detectors fabricated in a low-cost 130 nm silicon CMOS technology. We show that the detectors consisting of a nMOS field effect transistor as rectifying element and an integrated bow-tie coupling antenna achieve a record responsivity above 5 kV/W and a noise equivalent power below 10 pW/Hz(0.5) in the important atmospheric window around 300 GHz and at room temperature. We demonstrate furthermore that the same detectors are efficient for imaging in a very wide frequency range from ~0.27 THz up to 1.05 THz. These results pave the way towards high sensitivity focal plane arrays in silicon for terahertz imaging.