University of Coimbra

About: University of Coimbra is a education organization based out in Coimbra, Portugal. It is known for research contribution in the topics: Population & Mitochondrion. The organization has 14318 authors who have published 43067 publications receiving 994733 citations. The organization is also known as: UC & Universidade dos Estudos Gerais.

Optimization Approach to Depot Location and Trip Selection in One-Way Carsharing Systems

Abstract: In this paper, we present an optimization approach to depot location in one-way carsharing systems where vehicle stock imbalance issues are addressed under three trip selection schemes The approach is based on mixed-integer programming models whose objective is to maximize the profits of a carsharing organization considering all the revenues and costs involved The practical usefulness of the approach is illustrated with a case study involving the municipality of Lisbon, Portugal The results we have obtained from this study provided a clear insight into the impact of depot location and trip selection schemes on the profitability of such systems

Interfacial design of Cu-based composites prepared by powder metallurgy for heat sink applications

Abstract: Thermal aspects are becoming increasingly important for the reliability of the electronic components due to the continuous progress of the electronic industries. Therefore, the effective thermal management is a key issue for packaging of high performance semiconductors. The ideal material working as heat sink and heat spreader should have a CTE of (4–8) × 10−6 K−1 and a high thermal conductivity. Metal matrix composites offer the possibility to tailor the properties of a metal by adding an appropriate reinforcement phase and to meet the demands in thermal management. Copper/SiC and copper/diamond composites have been produced by powder metallurgy. The major challenge in development of Cu/SiC is the control of the interfacial interactions. Silicon carbide is not stable in copper at the temperature needed for the fabrication of Cu/SiC. It is known that the bonding between diamond and copper is very weak in the Cu/diamond composite. Improvements in bonding strength and thermo-physical properties of the composites have been achieved by • a vapour deposited molybdenum coating on SiC powders to control interface reactions, • using atomized Cu(X) alloys with minor additions of carbide formers, e.g. X = Cr, B, to improve the interfacial bonding in Cu-diamond composites.

Search for new high-mass phenomena in the dilepton final state using 36 fb−1 of proton-proton collision data at √s=13 TeV with the ATLAS detector

Abstract: A search is conducted for new resonant and non-resonant high-mass phenomena in dielectron and dimuon fi nal states. The search uses 36 : 1 fb(-1) of proton-proton collision data, collected at root ...