Institution
Varian Associates
About: Varian Associates is a based out in . It is known for research contribution in the topics: Beam (structure) & Amplifier. The organization has 2160 authors who have published 2591 publications receiving 46002 citations.
Topics: Beam (structure), Amplifier, Wafer, Cathode, Resonance
Papers published on a yearly basis
Papers
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07 Sep 1989
TL;DR: In this paper, a broadband interconnection between a microstrip and a coplanar waveguide is provided without use of via holes by using anisotropic etching to form a sloped surface between connection points.
Abstract: A broadband interconnection between a microstrip and a coplanar waveguide is provided without use of via holes by using anisotropic etching to form a sloped surface between connection points. The sloped surface is then metallized to provide the interconnection.
32 citations
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TL;DR: In this paper, various aspects of the organometallic VPE growth of GaAs and AlGaAs are discussed, including basic growth parameters, thickness and compositional uniformity, and doping characteristics.
32 citations
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TL;DR: Titanium silicide thin films, sputter deposited from a composite silicide target, have been rapidly sintered in ∼10 s to produce extremely uniform highly conductive layers (≲ Ω/sq +mn; 1 percent over a 4-in wafer) with film stress comparable to furnace-annealed films as discussed by the authors.
Abstract: Titanium silicide thin films, sputter deposited from a composite silicide target, have been rapidly sintered in ∼10 s to produce extremely uniform highly conductive layers (≲ Ω/sq \plusmn; 1 percent over a 4-in wafer) with film stress comparable to furnace-annealed films. Such films are suitable for VLSI applications. In addition, silicide formation and activation of ion-implanted species in adjacent Si regions can be accomplished in the same rapid processing step without significant dopant redistribution.
32 citations
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19 Sep 1983TL;DR: In this paper, an x-y table, a stage assembly movable along the z-axis for holding the wafer, coupled with a plurality of fluid-containing bellows coupled between the table and the stage assembly, and a hydraulic controller operated by a linear stepper motor for varying the fluid volume in each of the bellows in response to an actuator control signal.
Abstract: Apparatus for positioning a semiconductor wafer with respect to a localized vacuum envelope so as to maintain a prescribed gap between the tip of the vacuum envelope and the wafer includes an x-y table, a stage assembly movable along the z-axis for holding the wafer and a z-axis actuator assembly. The z-axis actuator assembly includes a plurality of fluid-containing bellows coupled between the x-y table and the stage assembly and a hydraulic controller operated by a linear stepper motor for varying the fluid volume in each of the bellows in response to an actuator control signal so as to move the stage assembly along the z-axis. The z-axis actuator assembly can further include a flexible disk positioned in the plane of x-y movement and coupled between the x-y table and the stage assembly for preventing lateral and rotational movement of the stage assembly relative to the x-y table. The positioning apparatus is suitable for use in an electron beam lithography system.
32 citations
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TL;DR: In this article, a double mismatch technique was used to grow a monolithic cascade solar cell, where changes of lattice constant occur not only between the substrate and lower cell, but also between the lower and upper cells.
31 citations
Authors
Showing all 2160 results
Name | H-index | Papers | Citations |
---|---|---|---|
Richard R. Ernst | 96 | 352 | 53100 |
Fred E. Regnier | 88 | 412 | 25169 |
Norbert Schuff | 88 | 280 | 25442 |
James S. Hyde | 79 | 412 | 35755 |
Carl Djerassi | 77 | 1523 | 37630 |
Ray Freeman | 73 | 269 | 22872 |
Robert Kaptein | 72 | 436 | 24275 |
Minghwei Hong | 58 | 515 | 14309 |
Jesse L. Beauchamp | 55 | 275 | 10971 |
Herbert Kroemer | 52 | 237 | 9936 |
Hans J. Jakobsen | 49 | 274 | 8401 |
James N. Eckstein | 42 | 168 | 6634 |
Ivan Bozovic | 31 | 128 | 5060 |
John Glushka | 31 | 76 | 3004 |
Gary Virshup | 24 | 113 | 2374 |