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Institution

Vignan University

EducationGuntur, Andhra Pradesh, India
About: Vignan University is a education organization based out in Guntur, Andhra Pradesh, India. It is known for research contribution in the topics: Control theory & CMOS. The organization has 1138 authors who have published 1381 publications receiving 7798 citations.


Papers
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Journal ArticleDOI
TL;DR: A novel and efficient metal free, redox-neutral method for the synthesis of secondary thiocarbamates by cross-coupling of readily available thiophenol and isocyanides has been developed.
Abstract: A novel and efficient metal free, redox-neutral method for the synthesis of secondary thiocarbamates by cross-coupling of readily available thiophenol and isocyanides has been developed. The present methodology exhibits a broad substrate scope with good to excellent yields without an additive/extra oxidant under mild reaction conditions catalyzed by inexpensive iodine as the catalyst.

15 citations

Journal ArticleDOI
TL;DR: In this paper, a series of copper (loadings 5−20 ¾wt.%) supported on calcined Mg9Al2.7-Ga2.3-HT catalysts were prepared by a wetness impregnation method and their catalytic performance was investigated for the production of 1 2-propanediol from glycerol in a vapor phase.

15 citations

Journal ArticleDOI
TL;DR: In this article, a new approach to the preparation of hexakis(4-aminophenoxy)cyclotriphosphazene (HACTP) based polyimide (PI) matrices is proposed, for improved thermal and flame retardant properties.

15 citations

Journal ArticleDOI
TL;DR: Whole genome sequencing of α-cyanobacteria in the cyanobium clade would certainly facilitate the understanding of synonymous codon usage patterns and factors contributing to its diversification in presumed ancestors of photosynthetic endosymbionts of P. chromatophora.
Abstract: Comparative study of synonymous codon usage variations and factors influencing its diversification in α - cyanobacterial descendant Paulinella chromatophora and β - cyanobacterium Synechococcus elongatus PCC6301 has not been reported so far In the present study, we investigated various factors associated with synonymous codon usage in the genomes of P chromatophora and S elongatus PCC6301 and findings were discussed Mutational pressure was identified as the major force behind codon usage variation in both genomes However, correspondence analysis revealed that intensity of mutational pressure was higher in S elongatus than in P chromatophora Living habitats were also found to determine synonymous codon usage variations across the genomes of P chromatophora and S elongatus Whole genome sequencing of α-cyanobacteria in the cyanobium clade would certainly facilitate the understanding of synonymous codon usage patterns and factors contributing its diversification in presumed ancestors of photosynthetic endosymbionts of P chromatophora

15 citations

Journal ArticleDOI
TL;DR: In this article, a finite element method (FEM) simulation was used to obtain the results close to the actual conditions, showing that the concentration of creep strain at the interface of the solder/chip is in its maximum value.
Abstract: This paper demonstrates to what extent the number of thermal cycles affects the mechanical properties as well as the thermal conductivity of a porous solder joint in an insulated-gate bipolar transistor discrete. The blind mode voids were used for a finite-element method (FEM) simulation to obtain the results close to the actual conditions. The FEM results indicate that the concentration of creep strain at the interface of the solder/chip is in its maximum value, and it slightly decreases along with the depth of the solder layer. FEM also reveals that the boundaries of voids act as critical regions for strain concentration. An upward in the number of thermal cycles also leads to the void growth and coalescence process. The enhancement of void volume from 0 to 15 cycles is about 4% volume of the solder layer. Moreover, scanning electron microscope micrographs approve the FEM results and show the void growth and the damage accumulation during thermal cycling. The thermal analyses indicate that the increase in thermal cycles (creep strain) leads to a significant rise in thermal impedance. This event can be due to the increase in the void volume of the solder layer leading to the decrease in the effective area of heat path.

15 citations


Authors
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Performance
Metrics
No. of papers from the Institution in previous years
YearPapers
202322
202231
2021352
2020254
2019250
2018159