scispace - formally typeset
Search or ask a question
JournalISSN: 1521-3331

IEEE Transactions on Components and Packaging Technologies 

Institute of Electrical and Electronics Engineers
About: IEEE Transactions on Components and Packaging Technologies is an academic journal. The journal publishes majorly in the area(s): Thermal resistance & Heat transfer. It has an ISSN identifier of 1521-3331. Over the lifetime, 1120 publications have been published receiving 34801 citations.


Papers
More filters
Journal ArticleDOI
Issam Mudawar1
TL;DR: This paper explores the recent research developments in high-heat-flux thermal management and demonstrates that, while different cooling options can be tailored to the specific needs of individual applications, system considerations always play a paramount role in determining the most suitable cooling scheme.
Abstract: This paper explores the recent research developments in high-heat-flux thermal management. Cooling schemes such as pool boiling, detachable heat sinks, channel flow boiling, microchannel and mini-channel heat sinks, jet-impingement, and sprays, are discussed and compared relative to heat dissipation potential, reliability, and packaging concerns. It is demonstrated that, while different cooling options can be tailored to the specific needs of individual applications, system considerations always play a paramount role in determining the most suitable cooling scheme. It is also shown that extensive fundamental electronic cooling knowledge has been amassed over the past two decades. Yet there is now a growing need for hardware innovations rather than perturbations to those fundamental studies. An example of these innovations is the cooling of military avionics, where research findings from the electronic cooling literature have made possible the development of a new generation of cooling hardware which promise order of magnitude increases in heat dissipation compared to today's cutting edge avionics cooling schemes.

824 citations

Journal ArticleDOI
TL;DR: In this article, the authors present a complete dynamic model of a lithium ion battery that is suitable for virtual prototyping of portable battery-powered systems, based on publicly available data such as the manufacturers' data sheets.
Abstract: Presents here a complete dynamic model of a lithium ion battery that is suitable for virtual-prototyping of portable battery-powered systems. The model accounts for nonlinear equilibrium potentials, rate- and temperature-dependencies, thermal effects and response to transient power demand. The model is based on publicly available data such as the manufacturers' data sheets. The Sony US18650 is used as an example. The model output agrees both with manufacturer's data and with experimental results. The model can be easily modified to fit data from different batteries and can be extended for wide dynamic ranges of different temperatures and current rates.

784 citations

Journal ArticleDOI
TL;DR: In this article, the performance of a battery-ultracapacitor hybrid power source under pulsed load conditions is analyzed using simplified models, and the authors show that peak power can be greatly enhanced, internal losses can be considerably reduced, and that discharge life of the battery is extended.
Abstract: The performance of a battery-ultracapacitor hybrid power source under pulsed load conditions is analytically described using simplified models. We show that peak power can be greatly enhanced, internal losses can be considerably reduced, and that discharge life of the battery is extended. Greatest benefits are seen when the load pulse rate is higher than the system eigenfrequency and when the pulse duty is small. Actual benefits are substantial; adding a 23 F ultracapacitor bank (3 /spl times/ 7 PC10 ultracapacitors) in parallel with a typical Li-ion battery of 7.2 V and 1.35 A hr capacity can boost the peak power capacity by 5 times and reduce the power loss by 74%, while minimally impacting system volume and weight, for pulsed loads of 5 A, 1 Hz repetition rate, and 10% duty.

487 citations

Journal ArticleDOI
TL;DR: The thermal challenges in next-generation electronic systems, as identified through panel presentations and ensuing discussions at the workshop, Thermal Challenges in Next Generation Electronic Systems, held in Santa Fe, NM, January 7-10, 2007, are summarized in this article.
Abstract: Thermal challenges in next-generation electronic systems, as identified through panel presentations and ensuing discussions at the workshop, Thermal Challenges in Next Generation Electronic Systems, held in Santa Fe, NM, January 7-10, 2007, are summarized in this paper. Diverse topics are covered, including electrothermal and multiphysics codesign of electronics, new and nanostructured materials, high heat flux thermal management, site-specific thermal management, thermal design of next-generation data centers, thermal challenges for military, automotive, and harsh environment electronic systems, progress and challenges in software tools, and advances in measurement and characterization. Barriers to further progress in each area that require the attention of the research community are identified.

368 citations

Journal ArticleDOI
TL;DR: In this article, a phase sensitive transient thermo-reflectance technique was used to measure the thermal conductance of the two interfaces on each side of a vertically aligned carbon nanotube array as well as the CNT array itself.
Abstract: Carbon nanotube (CNT) arrays are being considered as thermal interface materials (TIMs). Using a phase sensitive transient thermo-reflectance technique, we measure the thermal conductance of the two interfaces on each side of a vertically aligned CNT array as well as the CNT array itself. We show that the physically bonded interface by van der Waals adhesion has a conductance ~105W/m2K and is the dominant resistance. We also demonstrate that by bonding the free-end CNT tips to a target surface with the help of a thin layer of indium weld, the conductance can be increased to ~106W/m2K making it attractive as a TIM

349 citations

Network Information
Related Journals (5)
Journal of Micromechanics and Microengineering
7K papers, 231.2K citations
80% related
Journal of Electronic Materials
15.3K papers, 222.5K citations
77% related
Sensors and Actuators A-physical
13.3K papers, 414.7K citations
76% related
International Journal of Heat and Mass Transfer
29.3K papers, 1M citations
75% related
Journal of Heat Transfer-transactions of The Asme
9.9K papers, 329.2K citations
75% related
Performance
Metrics
No. of papers from the Journal in previous years
YearPapers
20141
20121
201093
2009107
2008103
2007108