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JournalISSN: 0148-6411

IEEE Transactions on Components, Hybrids, and Manufacturing Technology 

Institute of Electrical and Electronics Engineers
About: IEEE Transactions on Components, Hybrids, and Manufacturing Technology is an academic journal. The journal publishes majorly in the area(s): Contact resistance & Electrical contacts. It has an ISSN identifier of 0148-6411. Over the lifetime, 1261 publications have been published receiving 22410 citations.


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Journal ArticleDOI
TL;DR: In this article, a methodology for extracting high-frequency IC interconnect transmission parameters directly from S-parameter measurements has been demonstrated using on-chip test structures, which consists of: (1) building onchip interconnect structures for microwave test, (2) characterizing and subtracting measurement system parasitics, extracting the transmission line impedance and propagation constant (attenuation constant and phase constant) from the calibrated data, and (4) extracting the Telegrapher's Equation transmission parameters (R, L, C, and G).
Abstract: A methodology for extracting high-frequency IC interconnect transmission parameters directly from S-parameter measurements has been demonstrated using on-chip test structures. The methodology consists of: (1) building on-chip interconnect structures for microwave test, (2) characterizing and subtracting measurement system parasitics, (3) extracting the transmission line impedance and propagation constant (attenuation constant and phase constant) from the calibrated data, and (4) extracting the Telegrapher's Equation transmission parameters (R, L, C, and G). Additional on-chip calibration permits subtraction of pad parasitic effects. This methodology is demonstrated over a 45-MHz to 20-GHz frequency range using an example 1-cm-long, 4- mu m-wide IC interconnect built in an advanced BiCMOS technology. Variations in interconnect impedance and capacitance indicate two signal propagation modes. Significant substrate-based loss is measured at microwave frequencies. >

627 citations

Journal ArticleDOI
TL;DR: In this article, the equations governing the fluid dynamics and combined conduction/convection heat transfer in a heat sink are presented in dimensionless form for both laminar and turbulent flow.
Abstract: The equations governing the fluid dynamics and combined conduction/convection heat transfer in a heat sink are presented in dimensionless form for both laminar and turbulent flow. A scheme presented for solving these equations permits the determination of heat sink dimensions that display the lowest thermal resistance between the hottest portion of the heat sink and the incoming fluid. Results from the present method are applied to heat sinks reported by previous investigators to study effects of their restrictions regarding the nature of the flow (laminar or turbulent), the ratio of fin thickness to channel width, or the aspect ratio of the fluid channel. Results indicate that when the pressure drop through the channels is small, laminar solutions yield lower thermal resistance than turbulent solutions. Conversely, when the pressure drop is large, the optimal thermal resistance is found in the turbulent region. With the relaxation of these constraints, configurations and dimensions found using the present procedure produce significant improvement in thermal resistance over those presented by all three previous studies. >

407 citations

Journal ArticleDOI
W. Engelmaier1
TL;DR: In this article, a method is described which provides estimates to first order of the number of either power or envirionmenta1 cyc1es 1eading to so1der joint fai1ure.
Abstract: An ana1ytica1 method is described which provides estimates to first order of the number of either power or envirnnmenta1 cyc1es 1eading to so1der joint fai1ure. Vari0us parameter variations such as so1der joint height, ceramic chip carrier (CCC) size, printed c1rcuit substrate (PCS) materia1, etc. are investigated and discussed and samp1e estimates for a 0.65 x 0.65-in CCC are given.

327 citations

Journal ArticleDOI
H.D. Solomon1
TL;DR: In this paper, a model is presented which describes the influence of plastic strain and cycling frequency and temperature changes on fatigue life, which account for temperature changes, cycling waveshape, and joint geometries.
Abstract: Plastic strain versus fatigue life data are presented for tests run at -- 50, 35, 125, and 150°C. It was found that these data could be correlated by the Coffin-Manson fatigue law, with an exponent of approximately 0.5 for the tests run at -35°C to 125°C. At 150°C the exponent was reduced to 0.37. These results were obtained for plastic strain limited tests. Different results are obtained when total strain limits are employed. This difference is discussed. The influence of cycling frequency and temperature changes are also discussed. A model is presented which describes the influence of plastic strain and cycling frequency. Corrections to the model predicted fatigue life, which account for temperature changes, cycling waveshape, and joint geometries, are also discussed.

310 citations

Journal ArticleDOI
TL;DR: In this paper, a first-level-metal single-conductor IC interconnect model is developed for high-speed and high-density VLSI circuit design, which includes effects such as capacitive fringing and the influence of substrate conductance.
Abstract: A first-level-metal single-conductor IC interconnect model is developed for high-speed and high-density VLSI circuit design. The model shows interconnect circuit parameters that vary with frequency. Existing interconnect models exclude effects such as capacitive fringing and the influence of substrate conductance. The new model represents fine-line as well as wide-line interconnect behavior over a 20-GHz frequency range and includes these effects. The model parameters are compared to scattering parameter measurements as well as numerical simulations based on PISCES-II. Excellent agreement is shown with S-parameter measurements. >

299 citations

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Performance
Metrics
No. of papers from the Journal in previous years
YearPapers
199371
199264
199150
199089
1989112
198881