Journal of microelectronics and electronic packaging 

About: Journal of microelectronics and electronic packaging is an academic journal published by IMAPS - International Microelectronics Assembly and Packaging Society. The journal publishes majorly in the area(s): Ceramic & Die (integrated circuit). It has an ISSN identifier of 1551-4897. It is also open access. Over the lifetime, 421 publications have been published receiving 2065 citations. The journal is also known as: Microelectronics and electronic packaging.

Broadband Dielectric Characterization of Aluminum Oxide (Al2O3)

Abstract: Applications for low-temperature cofired ceramics (LTCC) and high-temperature cofired ceramics (HTCC) are advancing to higher frequencies. In order to design ceramic microsystems and electronic packages, the electrical properties of materials must be well characterized over a broad frequency range. In this study, the dielectric properties of commercial aluminum oxide (Al2O3) with different glass loadings are characterized using three different measurement techniques: the split-post cavity, terahertz (THz) time-domain spectroscopy, and Fourier transform IR spectroscopy (FTIR). Specifically, the dielectric properties will be characterized from 10 GHz to IR frequencies. A split-post cavity was employed for determination of dielectric properties in the 10 GHz range. A broadband THz spectroscopy technique was used to characterize the specimens using measured time-domain transmission data. The dielectric constant and loss were extracted from the sample's frequency-domain transmission characteristics, providing ...

Redistribution Layers (RDLs) for 2.5D/3D IC Integration

Abstract: Redistribution layer (RDL) is an integral part of 3D IC integration, especially for 2.5D IC integration with a passive interposer. The RDL allows for fans out of the circuitries and allows the lateral communication between the chips attached to the interposer. There are at least two ways to fabricate the RDL, namely (a) polymers to make the passivation and Cu-plating to make the metal layer, and (b) semiconductor back-end-of-line Cu damascene. In this study, the materials and processes of these methods are presented. Emphasis is placed on the Cu damascene method.

Fan-Out Wafer-Level Packaging (FOWLP) of Large Chip with Multiple Redistribution-Layers (RDLs)

Abstract: This study is for fan-out wafer-level packaging with chip-first (die face-up) formation. Chips with Cu contact-pads on the front side and a die attach film on the backside are picked and placed face-up on a temporary-glass-wafer carrier with a thin layer of light-to-heat conversion material. It is followed by compression molding with an epoxy molding compound (EMC) and a post-mold cure on the reconstituted wafer carrier and then backgrinding the molded EMC to expose the Cu contact-pads of the chips. The next step is to build up the redistribution layers (RDLs) from the Cu contact-pads and then mount the solder balls. This is followed by the debonding of the carrier with a laser and then the dicing of the whole reconstituted wafer into individual packages. A 300-mm reconstituted wafer with a package/die ratio = 1.8 and a die-top EMC cap = 100 μm has also been fabricated (a total of 325 test packages on the reconstituted wafer). This test package has three RDLs; the line width/spacing of the first RDL is 5 ...

Prediction of Microelectronics Thermal Behavior in Electronic Equipment: Status, Challenges and Future Requirements

Abstract: Developing virtual perfonnance- and reliability predictive techniques has become essential for the development of (micro)electronic systems. This paper provides an overview of current predictive methodologies, challenges and requirements for the modeling of microelectronics thennal behavior. Critical modeling issues are discussed, from optimizing Integrated Circuit (IC) packaging thennal perfonnance to predicting operational temperature in application environments. A systematic assessment of numerical predictive accuracy for board-mounted electronic component heat transfer is presented. From this evaluation, perspective is given on the current capabilities of Computational Fluids Dynamics (CFD) as a design tool to predict component operational temperature in electronic systems. Potential development areas are discussed for improved analysis.

LTCC-based Fluidic Components for Chemical Applications

Abstract: The material properties of low-temperature co-fired ceramics (LTCCs) enable new application areas beyond the use as basic material for high-density circuits. Therefore, LTCCs are increasingly used for microfluidic applications. A modular LTCC-based microreaction system is presented in this article. One focal point of our work was the development of a connecting system for these ceramic fluidic modules. Importance was attached to solid mechanical design, good temperature resistance of fluidic and electrical connections, and minimized dead volume. In contrast to LTCC-based substrates with only electrical circuits, integration of fluidic components makes great demands, especially on the mechanical processing of the green tapes. Mechanical processing of LTCC was made by laser cutting or laser ablation. Single modules and a complete system are the subject of chemical characterization. LTCC-based mixer structures are characterized using the Villermaux-Dushman method. The functionality of the whole system is shown with an example reaction.