Showing papers in "Microelectronics Reliability in 1972"

TL;DR: In this article, the effect of component size on convective heat transfer from small devices (with surface areas between 2·00 and 0·01 sq cm) was investigated analytically and experimentally.

TL;DR: In this paper, a method of fabrication and electrical properties of titanium thin-film resistors is described, where the TiN x and Al films are deposited over the entire substrate and this is followed by the sequential generation of the patterns for the conductive and the resistive films by the usual photolithographic technique.

TL;DR: In this article, a lumped approximation to the RC network has been examined and generalized expressions for the open circuit voltage transfer function valid for n-lumped sections were derived for the cases of n = 2 to seven sections.

TL;DR: In this paper, an approach to reliability is outlined and an extensive list of defects and failure mechanisms is given together with the enhancement stresses that will cause the failures to manifest themselves, where the authors adopt the failure physics approach.

TL;DR: In this paper, the variations of junction breakdown voltage, device gain factor and the channel threshold voltage as a function of avalanche charge for a variety of commercially available devices are shown, showing how the length of channel having the original threshold voltage becomes shorter and the regions near the source and drain electrodes in a p-channel device assume an increasingly positive threshold voltage with increasing avalanche charge.

TL;DR: In this article, a method for manufacturing capacitors in which the insulation is made from a mixture of rutilium (TiO 2 ) and glass powders is discussed, and the dependence of electric permittivity and losses on the content of TiO 2 in the dielectric, are tested.

TL;DR: The optimum reliability route has been obtained with the use of functional equation technique of dynamic programming with a numerical example worked out to illustrate the method.

TL;DR: This paper describes how the glossary of reliability terms, issued by the International Electrotechnical Commission (IEC) in Publication 271 and by the British Standards Institution (BSI) in BS 4200 and Draft for Development 12, can be integrated with the concept of quality as newly defined in the third edition of the Glossary of Terms used in Quality Control.

TL;DR: In this paper, the Laplace transform of various state probabilities of a complex system consisting of two classes of components L1 and L2 has been considered, where the repair of failed components of both the classes is carried under three different repair disciplines viz., head of line, preemptive resume and preemptive repeat.

TL;DR: In this paper, a simple method of avoiding the undesirable effect of non-zero output impedance of the amplifier results in a rejection filter characteristic, instead of a low-pass characteristic.

TL;DR: Using epitaxial resistances and collector collector coupling between the bistable elements, a 256-bit static shift register has been integrated on a chip of 5·6 mm2 as discussed by the authors.

TL;DR: In this paper, a probability metric for a single four-state relay is introduced by way of a simple random walk on four lattice points in the plane, which yields Markov transition probabilities.

TL;DR: This article outlines some of the concepts, ideas and implementations of reliability in system design; however, there are many more topics not covered.

TL;DR: In this article, the authors proposed a technique to evaluate the maximum allowable cost of a test, given certain inefficiencies of the test, where the test accepts all good items and rejects all defective items.

TL;DR: In this article, the problem of finding the correct location of the source of variation in an optimized series of tests is addressed, and an optimized test procedure is proposed to give a high confidence that the proposed solution is effective, leading to a minimum cost high confidence modification to correct "first time" errors located in new designs.

TL;DR: A mathematical model useful as a basis for the computation of circuit drift reliability or yield is developed and an important concepts connected with the notion of drift reliability of electronic circuits are discussed.

TL;DR: In this paper, a mathematical equation has been formulated which correlates floating potential under humid conditions to the initial floating potential, applied collector reverse bias and leakage path resistances, and the effect of 100% relative humidity at 40°C on this potential has been studied graphically.

TL;DR: In this article, the Laplace-Stieltjes transform has been used to evaluate the first time to system failure (FTSF) and the Mean Time to System Failure (MTSF).

TL;DR: In this article, the authors discuss the organization and functions of a typical quality assurance and quality control department in a semiconductor company, describes the types of tests applied to measure the quality of the product, and explains the basis of the sampling procedure which is applicable to all types of products.

TL;DR: The achievements and failures of some digital telemetry schemes running for over 5 years shows what can be achieved, and also what must be achieved if future systems are to be successful.

TL;DR: In this paper, an original mathematical formulation of the basic problems of reliability tests of component parts and systems is presented, which provides a better insight into the different types of reliability testing, the techniques of realization and the methods of evaluation of the results of the tests being involved.