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Showing papers in "Microelectronics Reliability in 1973"


Journal ArticleDOI
E. Baker1
TL;DR: In this paper, the authors examined liquid immersion techniques for cooling minute heat sources and found that nucleate boiling may introduce mechanical stresses, contamination and physical design problems, and two alternatives to boiling (forced convection and bubble induced mixing) were also investigated which reduced or bypassed some of these problems.

47 citations


Journal ArticleDOI
TL;DR: A minimization technique is introduced to simplify this expression, which will have a lesser number of terms than obtained by any existing method, which helps a design engineer to evaluate the system reliability speedily.

45 citations



Journal ArticleDOI

28 citations


Journal ArticleDOI
TL;DR: This paper presents a technique of reliability optimization of a series system subject to multiple linear constraints by using zero-one programming, which reduces computer memory and computational time required by this method.

27 citations


Journal ArticleDOI
TL;DR: In this article, a simple formulation and a simple solution technique are used to arrive at an approximate solution, and then an exact solution using a search method is obtained using the same approach.

15 citations



Journal ArticleDOI
TL;DR: In this paper, a method of fabricating distributed RC networks for producing frequency selective circuits in IC form is proposed, where an MOS capacitor with compatible nichrome thin-film resistor is used.

9 citations


Journal ArticleDOI
TL;DR: In this article, a general reliability model for the stress vs strength problem has been discussed by considering the stress to follow normal distribution and the strength to follow the gamma distribution and a numerical estimate of the reliability under different values of the distribution parameters (for both the strength and stress distributions) has been presented.

8 citations


Journal ArticleDOI
TL;DR: In this article, the operational behaviour of a complex system having N components in class L 1 connected in series and m identical components in Class L 2 in parallel redundancy has been investigated, where the repair of the failed components in L 1 and L 2 is carried out under the preemptive resumption repair discipline.

8 citations


Journal ArticleDOI
TL;DR: A new formula for the failure frequency using cut set approach, wherein the numerical values can be directly obtained overcomes the drawback of Buzacott's method and is suitable for computer application.


Journal ArticleDOI
TL;DR: In this paper, a method of reliability optimization of a system subject to multiple constraints with integer coefficients is described, where the coefficients are generally integers; in case they are not, they can be converted into integer form by simple manipulation.

Journal ArticleDOI
TL;DR: This paper reviewed new attitudes and methods in reliability engineering, showing inter alia, the growing scepticism about, and sophistication of, reliability prediction The emphasis on reliability physics and reliability improvement programs is discussed, as well as recent work on accelerated testing, component screening and reliability testing of integrated circuits by means of a standard component.

Journal ArticleDOI
TL;DR: A simple and new method is provided for allocating redundancies to various stages of a system, to maximize the system reliability under some given constraints.

Journal ArticleDOI
TL;DR: In this article, it was shown that reactively sputtered chrome may be useful as thin-film thermistors, although not suitable for resistor fabrication, and the results were obtained on a commercially available system.

Journal ArticleDOI
TL;DR: In this article, a fast method for redundancy allocation for a series system is described, which makes use of some of the special features of the problem and reduces it to the solution of a set of inequalities.

Journal ArticleDOI
TL;DR: In this article, a preselection irradiation procedure with subsequent heat treatment was performed in order to reveal maverick behaviour of individual specimens within the qualification lot of the Project Symphonie satellite.


Journal ArticleDOI
TL;DR: In this paper, the authors studied the breakdown voltage drift in the emitter-base (e − b ) junction of planar transistors and showed that the walkout can be decreased by annealing at 350-500°C or by immersing in liquid nitrogen.

Journal ArticleDOI
TL;DR: In this article, the authors report some test results which indicate the factors which must be specified if the information obtained on laboratory test samples is to be used to predict the stability of resistors in operational thick-film circuits.

Journal ArticleDOI
TL;DR: In this article, the reliability analysis of a system consisting of n identical units (connected in parallel) subject to exponential failure distribution has been studied and an explicit expression for the mean time to system failure has been obtained.


Journal ArticleDOI
TL;DR: In this paper, overstress testing is one way of examining failure mechanisms and some of these mechanisms are mentioned, of which electromigration is highlighted, in order to highlight the importance of electromigration in the design of large systems.

Journal ArticleDOI
TL;DR: In this paper, a comparison of passive LC ladder filters with gyrator and leapfrog realizations was made and the two main features examined were sensitivity and noise, and it was found that although the sensitivities of the three realizations are very similar, their noise properties differ.

Journal ArticleDOI
N.K. Kashyap1
TL;DR: In this article, the stochastic behaviour of an intermittently working system with three classes of components with imperfect switching over devices has been investigated, incorporating the concept of reduced efficiency, and the Laplace transforms of various state probabilities have been derived from these the steady state solutions have been obtained.

Journal ArticleDOI
TL;DR: In this article, the behaviour of a complex system, composed of two classes of components L 1 and L 2, has been investigated under the "head-of-line repair discipline" and Laplace transforms of the various state probabilities have been obtained.


Journal ArticleDOI
TL;DR: In this article, the results of 2 yr's work evaluating suitable conductive and insulating resins for the attachment of semiconductor dice are described. And detailed results of tests are shown for the materials finally selected.