Showing papers in "Microelectronics Reliability in 2020"

TL;DR: This work extended the capabilities of an open-source VHDL GPGPU model (FlexGrip) and developed a new version named FlexGripPlus to study and analyze the effects of SEUs in a GPG PU in a much more detailed manner, demonstrating the correlation between the number of execution units in aGPGPU and the system reliability.

TL;DR: A comprehensive review of the reliability of the DNN accelerators is presented and the widely assumed claim that DNNs are inherently tolerant to faults is reviewed, to benefit researchers in the areas of deep learning, DNN acceleration, and reliability of this efficient paradigm.

TL;DR: This paper proposes a performance degradation evaluation model by estimating the battery actual capacity in dynamic operating conditions and uses a battery digital twin model modelled by the long short-term memory (LSTM) algorithm to reflect the battery performance degradation.

TL;DR: In this article, the main results of research in the field of solder joints defect inspection approaches and clarifies the principle of the methods as well as the corresponding advantages and disadvantages are discussed.

TL;DR: The reliable nature of TG9T is indicated by the narrower spread in read stability, write ability, read delay and read current, as well as the lowest VDD,min among all SRAM bitcells used for comparison.

TL;DR: In this paper, the authors discussed the physics of failure of die-attach joints in IGBTs based on the evolution of micro-defects in materials under accelerated aging through experiments and Finite element (FE) simulations.

TL;DR: In this paper, the thermal-mechanical reliability of flip chip on board (FCOB) with copper pillar solder joint is investigated by increasing the temperature and time of the thermal compression bonding (TCB) process.

TL;DR: In this article, a multistep characterisation method was proposed to map out the dependency of moisture diffusion parameters of a polymeric material over a range of temperature and humidity conditions in a limited amount of time.

TL;DR: In this paper, the authors investigate the behavior of β-Ga2O3 Schottky diodes in the condition of forward current surge to explore their electro-thermal ruggedness and the related thermal management.

TL;DR: In this paper, multi-walled carbon nanotubes (MWCNTs) reinforced composite solder joints were synthesized and the effects of MWCNTs addition on the microstructure evolution and hardness of the Sn-5Sb solder alloy during various thermal aging conditions were investigated.

TL;DR: In this article, the effect of aging time and stress amplitude on the reliability of SAC305 solder joints is investigated using accelerated shear fatigue tests, and the results indicate a reduction in fatigue life and an increase in inelastic work and plastic strain when the cyclic stress amplitude is increased.

TL;DR: In this paper, an improved lifetime prediction method was proposed for metalized film capacitors (MFCs) by considering the influence of harmonics and degradation process on MFCs.

TL;DR: This paper proposes to update online the drift parameter of Wiener process, which is used to model the trend of the health indices and the results obtained by the most used updating methods are analyzed and compared in order to highlight the influence of the model updating on prognosis performance.

TL;DR: In this article, the fabrication of high-performance metaloxide-semiconductor field effect transistors (MOSFETs) on Si-doped homoepitaxial layers on β-Ga2O3 substrates is demonstrated.

TL;DR: In this paper, the effects of variable micromorphology on the corrosion and mechanical properties of Sn-3.0Ag-0.5Cu (SAC305) solder alloy were investigated.

TL;DR: In this article, the effects of storage conditions and soft failures caused by the vibrations to solder joints of a printed circuit board (PCB) are analyzed with the help of vibration testing and finite element analysis techniques.

TL;DR: In this article, a perovskite-based synaptic memristor with Glass/indium tin oxide (ITO)/SnO2/CH3NH3PbI3/Au structure for SPICE simulation in neuromorphic applications is presented.

TL;DR: In this article, the effect of gamma irradiation on the electrical transport characteristics of Schottky contacts and AlGaN/GaN hetero-structures has been reported, and the contacts have been electrically characterized using currentvoltage (I-V) analysis and the transfer length method.

TL;DR: In this article, an extension to high C-rates of State of Health (SoH) diagnostic methods based on Incremental Capacity (IC) peak tracking is proposed, and a set of eleven NCA Lithium-ion batteries who went under different ageing protocol is used.

TL;DR: In this article, a comprehensive finite element approach was introduced to model the moisture induced delamination in a stacked die package during solder reflow, which could reduce the users' effort in dealing with the multipleloading boundary conditions in the fracture mechanics finite element simulation.

TL;DR: In this article, the effect of Co content on the microstructure, spreadability, conductivity and corrosion resistance of lead-free solder was studied, and it was shown that with the addition of Co, a small amount of CoSn phase formed in Sn-0.7Cu-xCo solders, and the morphology of Cosn2 phase changes from small blocks to flake like, short rod-like, and then to massive bulk shape.

TL;DR: In this paper, a cyclic loading in the form of four-point bending is applied and the mechanical fatigue life is measured for five groups of wafer level chip scale packaging (WLCSP) structures with different displacement amplitudes at a constant temperature of 125°C.

TL;DR: The developed forecasting methodology highlights the importance of the historical degradation data in the modeling and estimation stages and the main goal is to increase the reliability of the Prognostics and Health Management (PHM).

TL;DR: The fatigue theory and multi-field coupled numerical analysis theory were summarized in detail and a numerical analysis method for thermal-vibration coupling of TSV copper (TSV-Cu) was proposed, showing that the effects of different load forms and parameter conditions on the fatigue life of TSv-Cu are significantly different.

TL;DR: This work proposes a mixed-effects model based on the Wiener process to capture the two-phase degradation pattern and develops an offline reliability assessment method using run-to-failure data from a population of products, and an online RUL prediction method for an operational product.

TL;DR: In this paper, the impact of positive bias temperature instability (PBTI) on the device performance is evaluated at the single-defect level using time-dependent defect spectroscopy (TDDS).

TL;DR: In this paper, surface states (Nss), series resistance (Rs), and interlayer effects on the electrical characteristics of the Al/Cu:TiO2/n-Si metal oxide semiconductor (MOS) capacitors, both capacitance (C) and conductance (G) values were measured for frequency ranges of 10-kHz-1-MHz and ±5-V voltage ranges.

TL;DR: A thorough comparison among VGG, AlexNet, and ResNet indicates that LVF and KVF are determined by CNN network architecture, because layers of these networks, particularly convolutional layers, are implemented with the Im2col kernel, the most vulnerable and invoked in these CNN networks.

TL;DR: A novel machine learning technique that is effective to deal with the time-sequence data, i.e. recurrent neural networks (RNN) using long short-term memory (LSTM) units, is introduced to predict the RUL of IGBTs and compared with two conventional methods.

TL;DR: In this paper, the authors investigated the reliability of an organic light-emitting diode (OLED) and proposed a SPICE compatible electrical model for automotive exterior lighting applications, which smoothly provides the forward and reverse current-voltage relation and also dynamic capacitive behavior of OLED.