Showing papers in "Microsystem Technologies-micro-and Nanosystems-information Storage and Processing Systems in 2008"

Interlayer cooling potential in vertically integrated packages

Abstract: The heat-removal capability of area-interconnect-compatible interlayer cooling in vertically integrated, high-performance chip stacks was characterized with de-ionized water as coolant. Correlation-based predictions and computational fluid dynamic modeling of cross-flow heat-removal structures show that the coolant temperature increase due to sensible heat absorption limits the cooling performance at hydraulic diameters ≤200 μm. An experimental investigation with uniform and double-side heat flux at Reynolds numbers ≤1,000 and heat transfer areas of 1 cm2 was carried out to identify the most efficient interlayer heat-removal structure. The following structures were tested: parallel plate, microchannel, pin fin, and their combinations with pins using in-line and staggered configurations with round and drop-like shapes at pitches ranging from 50 to 200 μm and fluid structure heights of 100–200 μm. A hydrodynamic flow regime transition responsible for a local junction temperature minimum was observed for pin fin in-line structures. The experimental data was extrapolated to predict maximal heat flux in chip stacks having a 4-cm2 heat transfer area. The performance of interlayer cooling strongly depends on this parameter, and drops from >200 W/cm2 at 1 cm2 and >50 μm interconnect pitch to <100 W/cm2 at 4 cm2. From experimental data, friction factor and Nusselt number correlations were derived for pin fin in-line and staggered structures.

Soft X-ray lithography of high aspect ratio SU8 submicron structures

Abstract: SU8 submicron structures with an aspect ratio of more than 50 are made by soft X-ray lithography using modified spectra of the synchrotron radiation at the ANKA LITHO-1 beamline, which includes a chromium mirror. The X-ray spectrum is additional shaped by a beam stop and a filter to a narrow band in order to reduce the influence of diffraction and photoelectrons. The exposure determination is based on the measured threshold doses for used SU-8 resist layers as well as on the calculated diffractive distribution of an absorbed power. Post-exposure bake of the resist is performed at low temperature and low pressure to avoid changes of the structural size because of shrinkage due to temperature changes and to eliminate a “skin” layer at the top of the resist. SU8 structures with lateral dimensions of 1 μm and heights from 50 to 80 μm have been fabricated defect free with the optimized process.

Exploring the applicability of gradient elasticity to certain micro/nano reliability problems

Abstract: It has long been assessed that continuum mechanics can be used successfully to address a variety of mechanical problems at both macroscopic and microscopic scales. The term “micromechanics”, in particular, has been used in considering elasticity, plasticity, damage, and fracture mechanics problems at the micron scale involving metallic, ceramic and polymeric materials, as well as their composites. Applications to automobile, aerospace, and concrete industries, as well as to chemical and microelectronic technologies have already been documented. The recent developments in the field of nanotechnology have prompted a substantial literature in nanomechanics. While this term was first introduced by the author in the early 90’s to advance a generalized continuum mechanics framework for applications at the nanoscale, it is mainly used today in considering “hybrid” ab-initio/molecular dynamics/finite element simulations, usually based on elasticity theory, to interpret the mechanical response of nano-objects (nanotubes, nanowires, nanoaggregates) and extract information on nano-configurations (dislocation cores, crack tips, interfaces). The modest goal of this article is to show that continuum elasticity can indeed be extended to describe a variety of problems at the micro/nano regime. The resultant micro/nanoelasticity theory includes long-range or nonlocal material point interactions and surface effects in the form of (phenomenological) higher-order stress/strain gradients. Coupled thermo-diffuso-chemo-mechanical processes can also be considered within such a higher-order theory. Size effects on micro/nano holes and micro/nano cracks can conveniently be modeled, and some standard strength of materials formulas routinely used for micro/nano beams can be improved, with potential applications to MEMS/NEMS devices and micro/nano reliability components.

Development of a novel type of microrobot for biomedical application

Abstract: This paper proposes a new type of microrobot that can move along a narrow area such as blood vessels which has great potential for application in microsurgery. Also, the development of a wireless microrobot that can be manipulated inside a pipe by adjusting an external magnetic field has been discussed. The model microrobot utilizes an electromagnetic actuator as the servo actuator to realize movement in biomedical applications. The structure, motion mechanism, and evaluation characteristic of motion of the microrobot have been discussed, and the directional control can be realized via the frequency of the input current. The moving experiments have been carried out in branching points in the horizontal direction, and the moving speed of the robot has been measured in vertical direction by changing frequency. Based on the results, the microrobot has a rapid response, and it can clear out dirt which is adhering to the inner wall of pipe. This microrobot will play an important role in both industrial and medical applications such as microsurgery.

Stress engineering and mechanical properties of SU-8-layers for mechanical applications

Abstract: SU-8 is an essential material for manufacturing micromechanical components with high demands in aspect ratio and toughness in the area of micro-system technologies. For reproducible production of SU-8 components, e.g. polymeric AFM-cantilevers and chip carriers, a characterization sequence for the material in its raw state and in all subsequent processing steps was developed. Included in these tests were differential scanning calorimetry of the unprocessed resist, in situ monitoring of the solid content during soft bake, measurement of the stress behaviour during and after post-exposure bake as well as determination of micro-hardness and Young’s modulus at different baking and exposure conditions. The results are promising with respect to definition of a novel procedure for reproducible preparation of micromechanical components from SU-8.

Thermally activated solvent bonding of polymers

Abstract: We present a thermally activated solvent bonding technique for the formation of embedded microstructures in polymer. It is based on the temperature dependent solubility of polymer in a liquid that is not a solvent at room temperature. With thermal activation, the liquid is transformed into a solvent of the polymer, creating a bonding capability through segmental or chain interdiffusion at the bonding interface. The technique has advantages over the more commonly used thermal bonding due to its much lower operation temperature (30°C lower than the material’s T g), lower load, as well as shorter time. Lap shear test indicated bonding shear strength of up to 2.9 MPa. Leak test based on the bubble emission technique showed that the bonded microfluidic device can withstand at least six bars (87 psi) of internal pressure (gauge) in the microchannel. This technique can be applied to other systems of polymer and solvent.

Fabrication of large area diffraction grating using LIGA process

Abstract: X-ray imaging is a very important technology in the fields of medical, biological, inspection, material science, etc. However, it is not enough to get the clear X-ray imaging with low absorbance. We have produced a diffraction gratings for obtaining high resolution X-ray phase imaging, such as X-ray Talbot interferometer. In this X-ray Talbot interferometer, diffraction gratings were required to have a fine, high accuracy, high aspect ratio structure. Then, we succeeded to fabricate a high aspect ratio diffraction grating with a pitch of 8 μm and small area using a deep X-ray lithography technique. We discuss that the diffraction gratings having a narrow pitch and an large effective area to obtain imaging size of practical use in medical application. If the pitch of diffraction gratings were narrow, it is expected high resolution imaging for X-ray Talbot interferometer. We succeeded and fabricated the diffraction grating with pitch of 5.3 μm, Au height of 28 μm and an effective area of 60 × 60 mm2.

Ultra-low-power components for an RFID Tag with physical and chemical sensors

Abstract: In this work the development and optimization of the main components for a multisensing flexible Tag with RFID communication capabilities and integrated physical and chemical sensors for logistic datalogging applications will be reported. For this specific scenario, several constraints must be considered: power consumption must be limited for long-term operation, reliable ISO compliant RFID communication must be implemented, and special encapsulation issues must be faced for reliable sensor integration. In this work, the developments on application specific electronic interfaces and on ultra-low-power Metal OXdide semiconductor (MOX) gas sensors will be reported. The electronics for sensor control and readout as well as for RFID communication are based on an ultra-low-power MSP430 microcontroller from Texas Instruments together with a custom RFID front-end based on analog circuitry and a CPLD digital device, and are designed to guarantee a passive ISO15693 compliant RFID communication in a range up to 6 cm. A thin film battery for sensor operation is included, thus data acquisition and storage can be accomplished when no reader field is present. This design allows the user to access both the traceability and sensor information even when the on-board battery is exhausted. The physical sensors for light, temperature and humidity are commercially available devices, while for chemical gas sensing innovative MOX sensors are developed, based on ultra-low-power micromachined hotplate arrays specifically designed for flexible Tag integration purposes. A single MOX sensor requires only 8.9 mW for continuous operation, while temperature modulation and discontinuous sensor operation modes are implemented to further reduce the overall power consumption. The development of the custom control and RFID front-end electronics, together with innovative ultra-low-power MOX sensor arrays with flexible circuit encapsulation techniques will be described.

Design and manufacturing of micro milling tools

Abstract: The actual geometrical design of micro milling tools has been adopted from macro tools, assuming that the effects during the milling process are analogical. Experience has also proved that micro tools respond to influences in a very different way than macro tools do. So it is very important to achieve a comprehensive understanding of the entire process by taking a structural, mechanical and cutting technological approach to micro milling tools in order to be able to optimize them. Oftentimes, structural details such as the rake angle and the twist angle impede further miniaturization and are impossible to achieve with conventional manufacturing techniques. This paper deals with an alternative method to manufacture structural optimized milling tools, namely Electro Discharge Machining (EDM). The present state of research already puts the deficits of the currently available tools on display. Manufacturing tolerances of ±10 μm on a micro tool are insufficient to ensure constant cutting conditions for the commonly used lateral infeed or feed per tooth of a few micrometers. Sometimes, only one cutting edge is engaged, which results in increased wear, increased cutting forces, minor surface quality and a higher risk of milling cutter breakage. That is why a single-edged micro milling tool has been developed. It guarantees clear adjustment of the process parameters, feed per edge and lateral infeed. For that purpose, stability analyses of simple stylus geometries have been conducted by means of FEM simulations. Corresponding to the results of the simulation the geometry of this tool was optimized in several steps. The resulting tool with a diameter down to 30 μm was machined on the EDM-machine (Sarix SX 100) at the wbk—Institute of Production Science. Initial tests have been carried out and showed the ability of these tools to optimize cutting process.

Thermal stability of electrodeposited LIGA Ni–W alloys for high temperature MEMS applications

Abstract: For thermally stable LIGA materials for high temperature MEMS applications LIGA Ni–W layers and micro testing samples with different compositions (15 and 5 at% W) were electrodeposited. In order to investigate the thermal stability the Ni–W layers were annealed at different temperatures (300–700°C) and for different durations (1, 4, 16 h). Their microstructure and micro-hardness were than analysed after annealing and compared with those of as-deposited states. The observed microstructures show, in comparison to pure LIGA nickel, a small grain growth and a relatively stable structure up to 700°C. The micro-hardness values of the LIGA Ni–W layers are higher than those of the pure LIGA nickel. The micro-hardness measurements for high W-content show in addition a low decrease of the hardness values with increase of the annealing duration. Tensile tests were carried out for each composition (5 and 15 at%). Ni–W shows higher strength (UTS) above 750 MPa and 1,000 MPa, respectively and lower ductility than pure nickel.

Submicron polymer structures with X-ray lithography and hot embossing

Abstract: This article describes the process chain for replication of submicron structures with varying aspect ratios (AR) up to 6 in polymethylmethacrylate (PMMA) by hot embossing to show the capability of the entire LIGA process to fabricate structures with these dimensions. Therefore a 4.7 μm thick layer of MicroChem 950k PMMA A11 resist was spin-coated on a 2.3 μm Ti/TiO x membrane. It was patterned with X-ray lithography at the electron storage ring ANKA (2.5 GeV and λ c ≈ 0.4 nm) at a dose of 4 kJ/cm3 using a Si3N4 membrane mask with 2 μm thick gold-absorbers. The samples were developed in GG/BDG and resulted in AR of 6–14. Subsequent nickel plating at 52°C resulted in a 200 μm thick nickel tool of 100 mm diameter, which was used to replicate slit-nozzles and columns in PMMA. Closely packed submicron cavities with AR 6 in the nickel shim were filled to 60% during hot embossing.

Design and implementation of mechanical resonators for optimized inertial electromagnetic microgenerators

Abstract: This work describes the design and implementation of an electromagnetic inertial microgenerator for energy scavenging from ambient vibrations. The structure of the device is based in a mechanical resonator formed by a permanent magnet (inertial mass) mounted on a polymeric membrane, in combination with a fixed micromachined coil. ANSYS simulations are carried out to investigate the influence of the resonator geometry on the resonant frequency and on the parasitic damping, and to analyze the optimum geometry of the coil for optimization of the electromagnetic coupling in the devices. Generator prototypes have been fabricated with a modular manufacturing process in which the electromagnetic converter and the mechanical resonator are manufactured separately, diced and then assembled. The experimental results show the ability of these devices to generate power levels in the range of 50 μW with output voltages in the range of hundreds of mV. The parasitic damping of the resonator structures is estimated from the fitting of the experimental data, and suggests the existence of an intrinsic limitation of the polymers related to spring stiffening effects at large excitation amplitudes. The comparison of the simulations and the experimental results indicate that further optimizations of this parameter and of the coil series resistance would allow increasing the generated power in more than one order of magnitude.

Wafer-level plasma activated bonding: new technology for MEMS fabrication

Abstract: Manufacturing and integration of MEMS devices by wafer bonding often lead to problems generated by thermal properties of materials. These include alignment shifts, substrate warping and thin film stress. By limiting the thermal processing temperatures, thermal expansion differences between materials can be minimized in order to achieve stress-free, aligned substrates without warpage. Achieving wafer level bonding at low temperature employs a little magic and requires new technology development. The cornerstone of low temperature bonding is plasma activation. The plasma is chosen to compliment existing interface conditions and can result in conductive or insulating interfaces. A wide range of materials including semiconductors, glasses, quartz and even plastics respond favorably to plasma activated bonding. The annealing temperatures required to create permanent bonds are typically ranging from room temperature to 400°C for process times ranging from 15–30 min and up to 2–3 h. This new technique enables integration of various materials combinations coming from different production lines.

Mixed metal oxide films as pH sensing materials

Abstract: Due to the demand for accurate, reliable and highly sensitive pH sensors, research is being pursued to find novel materials to achieve this goal. Semiconducting metal oxides, such as TiO, SnO and SnO2 and insulating oxides such as Nb2O5 and Bi2O3, and their mixtures in different proportions are being investigated for this purpose. The films of these materials mixtures are used in conjunction with an interdigitated electrode pattern to produce a conductimetric/capacitive pH sensor. The advantages of this approach include straightforward manufacturing, versatility and cost-effectiveness. It was noted that upon contact with a solution, the electrical parameters of the films, such as resistance etc., change. The correlation of these changes with pH values is the basis for the proposed system development. The ultimate goal is to find materials composition, which would have the highest sensitivity towards the pH level of the solutions. It was found that the materials that produced the highest sensitivity either had a long response time or were unstable over a wide pH range. Those exhibiting lower sensitivities were found to be more stable over a wide pH range. All oxide films tested demonstrated a change in electrical parameters upon contact with buffers of known pH value.

A visual mold with variotherm system for weld line study in micro injection molding

Abstract: In order to study the weld line developing process and its influence on mechanical properties in micro injection molding, a visual mold with variotherm system mold was designed and fabricated. In this mold, a visualization design and a rapid heating/cooling system were integrated, and specimens with different cross section shape and micro dimensions could be molded for weld line study. The building process for the visual and variotherm mold was presented and the experiments were executed. The specimens for weld line study of micro injection molding were produced applying different processing parameters. A problem of flash in molded specimens needs to be solved.

Resin micromachining by roller hot embossing

Abstract: The roller hot embossing is an efficient process of manufacture in which patterns are continuously transcribed on film, etc. Recently, the application of the embossing roll to the manufacturing processes of micro parts is paid attention. In this paper, we examined the development of the embossing roll with patterns of micron level and we tried to make the embossing roll mold by using the LIGA process. In this study, instead of producing embossing patterns directly on the roll surface, we fabricated a flexible thin mold with micro-patterns, which was then wrapped onto a cylinder to form an embossing roll, and tested the soft-mold roller hot embossing method. First, by optimizing UV exposure conditions of UV lithography, we prepared a resist pattern of numerous dots with a diameter of 10 μm, a sag height of 8 μm and a pitch of 20 μm. By Ni-electroforming this pattern, a 50 μm-thick thin mold was successfully fabricated. The 50 μm-thick mold was then wrapped onto a cylinder to form an embossing roll. In the roller hot embossing process, the 10 μm-diameter dot shape was successfully replicated on PET sheets.

Hot embossing of microstructures: characterization of friction during demolding

Abstract: Today, hot embossing and injection molding belong to the established plastic molding processes in microengineering. Based on experimental findings, a variety of microstructures have been replicated so far using the above processes. However, with increasing requirements regarding the embossing surface and the simultaneous decrease of the structure size down into the nanorange, increasing know––how is needed to adapt hot embossing to industrial standards. To reach this objective, a German–Canadian cooperation project has been launched to study hot embossing theoretically by a process simulation and experimentally. The present publication shall report about an important aspect––the determination of friction during the demolding of microstructures.

Fabrication of a stainless steel shadow mask using batch mode micro-EDM

Abstract: A metal shadow mask for organic thin-film transistors (OTFTs) has been fabricated by batch mode electro-discharge machining (EDM). Batch mode micro-electro-discharge machining method was applied for productivity improvement. Negative electrode with multiple holes (3 × 3 or 4 × 4) was fabricated using a single tool electrode. With the negative electrode, 3 × 3 and 4 × 4 tool electrode arrays are EDMed; 6 × 6 and 16 × 16 square hole array masks were batch mode EDMed with the fabricated multi-electrodes arrays. With 4 × 4 electrode array, the productivity is improved to five times of that in the case using a single electrode. Source and drain electrodes of OTFTs were successfully patterned on a pentacene active layer through the mask, and the fabricated pentacene TFTs had good output characteristics.

Modeling and characterization of a micromachined artificial hair cell vector hydrophone

Abstract: In the paper, a micromachined artificial vector hydrophone arises from a biological inspiration, the fish hair cell is presented. It is desirable that the application of piezoresistive effects combined with ingenious bionic structure and MEMS technology may improve the low-frequency sensitivity of the vector hydrophone as well as its miniaturization. Modeling processes for realizing the artificial hair cell hydrophone, along with preliminary characterization results in terms of sensitivity, frequency response and directivity patterns are also introduced. The microstructure of the sensor consists of four vertical cantilever beams with attached rigid plastic cylinder in the center of the structure. By locating eight piezoresistors logically formed the Wheatstone bridges; they can detect two components of underwater acoustic signal simultaneously. The prepared vector hydrophone has been measured in the standing wave field finally. The experiment results show that the vector hydrophone has good low-frequency characteristic, the free-field voltage sensitivity is −197.2 dB (0 dB = 1 V/μPa) at 400 Hz with a about 2 dB one-third octave positive slope over the 40–400 Hz bandwidth. The depth of pits of the directivity pattern is about 34.6 dB.

Viable cell handling with high aspect ratio polymer chopstick gripper mounted on a nano precision manipulator

Abstract: This paper presents the development of an optimized contact technique for viable cell manipulation utilizing a high aspect ratio polymer chopstick gripper. The gripper consists of a 2 μm thick metal heater layer and a 60 μm thick SU-8 layer and is fabricated by a typical UV-LIGA process using SiO2 as sacrificial layer. The grippers were completely released, de-tethered and assembled as end-effectors on to a nano precision manipulator to perform cell manipulation. Successful pick-and-place of a suspended normal rat kidney cell in phosphate buffered saline solution was demonstrated. The major cell-damage mechanisms associated with contact techniques were identified and alleviated by optimizing the handling force and operating temperature of the polymer gripper. The viability of cells handled with this optimized contact technique was demonstrated by labeling cells with a fluorescent dye. The developed technique will enable incorporation of simple, viable, and repeatable cell handling capabilities into the generic micromanipulators used in the biological laboratories.

Fabrication and characterization of a passive silicon-based direct methanol fuel cell

Abstract: This paper reports on the fabrication and characterization of a passive silicon microfabricated direct methanol fuel cell (μDMFC). The main characteristics of the device are its capability to work without complex pumping systems, only by capillary pressure, and the fact that its performance is not affected by the device orientation. A simple fabrication process based in deep reactive ion etching (DRIE), allows obtaining a reliable and low-cost final device. The device consists of two silicon microfabricated plates mounted together with a commercial membrane electrode assembly (MEA). The impact of current collector design on microfuel cell performance is explored and current–voltage (I–V) and current–power (I–P) curves of the device at different methanol concentration and orientation are presented. Optimal performance was obtained for methanol concentrations between 3 and 5 M, achieving a maximum power density of 12 mW/cm2. The results obtained in this work demonstrate the feasibility of the device and give a guideline for design and conditions optimization.

Etching behaviour of sputter-deposited aluminium nitride thin films in H 3 PO 4 and KOH solutions

Abstract: Aluminium nitride (AlN) reactively sputter deposited from an aluminium target is an interesting compound material due to its CMOS compatible fabrication process and its piezoelectric properties. For the implementation in micromachined sensors and actuators an appropriate patterning technique is needed to form elements made of AlN. Therefore, the influence of different sputtering conditions on the vertical etch rate of AlN thin films with a typical thickness of 600 nm is investigated in an etch mixture based on phosphoric acid. Under comparable conditions, such as temperature and concentration of the etchant, thin films with a high c-axis orientation are etched substantially slower compared to films with a low degree of (002) orientation. When a high c-axis orientation is present detailed analyses of the etched topographies reveal surface characteristics with a low porosity and hence, low roughness values. From temperature dependant etching experiments an activation energy of 800(± 30) meV is determined showing a reaction-controlled etching regime independent of sputter deposition conditions. For comparison, AlN films synthesized under the same conditions were etched in potassium hydroxide (KOH) at room temperature revealing comparable etching characteristics as a function of deposition parameters. Depending on the degree of (002) orientation the topography of the etched samples show a strong increase in surface roughness with time due to a selective etching behaviour between (002) and residual crystallographic planes.

Design and fabrication of an electrochemically actuated microvalve

Abstract: A microfluidic valve based on electrochemical (ECM) actuation was designed, fabricated using UV-LIGA microfabrication technologies. The valve consists of an ECM actuator, polydimethylsiloxane (PDMS) membrane and a micro chamber. The flow channels and chamber are made of cured SU-8 polymer. The hydrogen gas bubbles were generated in the valve microchamber with Pt black electrodes (coated with platinum nanoparticles) and filled with 1 M of NaCl solution. The nano particles coated on the working electrode helps to boost the surface-to-volume ratio of the electrode for faster reversible electrolysis and faster valve operation. To test the functionality of the microvalve, a simple micropump based on ECM principle was also integrated in the system to deliver a microscopic volume of fluid through the valve. The experimental results have showed that an approximately 300 μm deflection of valve membrane was achieved by applying a bias voltage of −1.5 V across the electrodes. The pressure in the valve chamber was estimated to be about 200 KPa. Experimental results proved that the valve can be easily operated by controlling the electrical signals supplied to the ECM actuators.

Bismuth film electrodes for heavy metals determination

Abstract: Bismuth film electrodes (BiFEs) have a potential to replace toxic mercury used most frequently for determination of heavy metals (Cd, Pb, Zn) by anodic stripping voltammetry. We prepared a graphite disc electrode (0.5 mm in diameter) from a pencil-lead rod and developed a nitrogen doped diamond-like carbon (NDLC) microelectrode array consisting of 50,625 microdiscs with 3 μm in diameter and interelectrode distances of 20 μm on a highly conductive silicon substrate as a support for BiFEs. The disc graphite BiFE was used for simultaneous determination of Pb(II), Cd(II) and Zn(II) by square wave voltammetry (SWV) in an aqueous solution. We found the optimum bismuth-to-metal concentration ratio in the solution to be 20. The dependence of the stripping responses on the concentration of target metals was linear in the range from 1 × 10−8 to 1.2 × 10−7 mol/L. Detection limits 2.4 × 10−9 mol/L for Pb(II), 2.9 × 10−9 mol/L for Cd(II) and 1.2 × 10−8 mol/L for Zn(II) were estimated. A bismuth-plated NDLC microelectrode array was used for Pb(II) determination by differential pulse voltammetry (DPV) in an aqueous solution. We found that the stripping current for bismuth-plated NDLC array was linear in the concentration range of Pb(II) from 2 × 10−8 to 1.2 × 10−7 mol/L. The detection limit 2.2 × 10−8 mol/L was estimated from a calibration plot.

Micro actuators on the basis of thin SMA foils

Abstract: Three innovative micro actuator concepts on the basis of the differential SMA principle are presented in this paper: a high adaptive multi-actuator system, which is driven by numerous identical single actuators connected in parallel and in series, a micro gripper for handling and assembling of complex hybrid micro systems and a micro actuator system in medical tools for the percutaneous resection of aortic valves. The SMA material is used in the form of 50 μm thin NiTi foils because of their well-defined properties and high strength. In order to integrate them into micro systems, different manufacturing methods have been applied and improved at the Institute for Microtechnology. Laser cutting and wet chemical etching are used for example to microstructure the actuator elements. Different methods for electrical and mechanical connections of the actuators are employed like soldering by the use of an additional gold layer. A batch fabrication process of SMA actuators is realized by embedding NiTi foil elements into SU-8 structures. To optimize the design of SMA actuator elements according to its application different simulation procedures are used.

Production of two-material micro-assemblies by two-component powder injection molding and sinter-joining

Abstract: In the field of micro-technology the production of metallic and ceramic micro-components by powder injection molding (PIM) has become a more and more established fabrication method. But in order to fulfill the demand for more complex-shaped high-precision micro-components further development work has to be performed. This is especially true if more efficient production routes for multi-component-micro-assemblies consisting of different materials or sub-components are envisaged. To meet these challenges, investigations are performed to realize and to establish two primary shape micro-processes. These are two-component micro-injection molding (2C-MicroPIM) and sinter-joining. The realization of these technologies will lead to a markedly reduction of the efforts for handling, adjustment, and assembling of metallic and ceramic micro-assemblies. Furthermore, an increased integration level and functionality can be yielded. For an effective transfer of scientific results to industrial applications the whole process chain must be considered, from development and construction of the tooling as well as of the components to the quality assurance and determination of the properties of the assemblies after sintering. These primary shape processes shall enable the mutual processing of different materials within the fabrication process, so avoiding separate mounting or assembling steps. Additionally fixed and loose junctions between at least two components shall be realized. The progress in research and development will be demonstrated especially by the implementation of shaft-to-collar connections between micro-gearwheels and corresponding shafts. Regarding two-component micro-injection molding, the tool construction for shaft-to-collar connections will be presented as well as first experimental results on the properties of selected ceramic powders and feedstocks for the special requirements of the 2C-MicroPIM process. With the assembly step being performed outside the injection molding tool before sinter-joining different parts and geometries can be combined quite easily. The presented article gives an overview on the concept and on preliminary testing results for the fabrication of a shaft-to-collar-connection. Additionally, a solution for an automated assembly of a shaft and a toothed wheel outside the injection molding tool is presented.

Applications of laser transmission processes for the joining of plastics, silicon and glass micro parts

Abstract: Joining processes for microtechnology must fulfil special requirements concerning mechanical and thermal load of the components as well as their alignment accuracy. For these applications laser radiation as an energy source is ideally suited for joining with a minimum of energy load to the parts. In particular, laser transmission joining is used for joining plastics, silicon or glass using the total or partial transmission of the different materials and performing hidden joints inside a component. Since the optical properties of the materials play a decisive role for this joining technology, an optimization of absorbers and material conditions is of crucial importance for high quality joints. Investigations on different absorbent dyes for micro welding of plastics show their applicability, but also the limitations of these materials. For silicon and glass as well as silicon and silicon new fiber lasers with process-adapted wavelengths and strategies have been investigated and qualified as a versatile tool in micro assembly.

Micro injection molding for mass production using LIGA mold inserts

Abstract: Micro molding is one of key technologies for mass production of polymer micro parts and structures with high aspect ratios. The authors developed a commercially available micro injection molding technology for high aspect ratio microstructures (HARMs) with LIGA-made mold inserts and pressurized CO2 gasses. The test inserts made of nickel with the smallest surface details of 5 μm with structural height of 15 μm were fabricated by using LIGA technology. High surface quality in terms of low surface roughness of the mold inserts allowed using for injection molding. Compared to standard inserts no draft, which is required to provide a proper demolding, was formed in the inserts. To meet higher economic efficiency and cost reduction, a fully electrical injection molding machine of higher accuracy has been applied with dissolving CO2 gasses into molten resin. The gasses acts as plasticizer and improves the flowability of the resin. Simultaneously, pressurizing the cavity with the gasses allows high replication to be obtained. Micro injection molding, using polycarbonate as polymer resins, with the aspect ratio of two was achieved in the area of 28 × 55 mm2 at the cycle time of 40 s with CO2 gasses, in contrast to the case of the aspect ratio of 0.1 without the gasses.

Low-stress fabrication of 3D polymer free standing structures using lamination of photosensitive films

Abstract: Free-standing microstructures such as cantilevers, membranes or microchannels are building blocks of microfluidic systems and MEMS. As a complement to silicon, the large family of polymers offers many opportunities for micro and nanotechnologies. Their low temperature processing and the planarizing properties of many resists is a definitive advantage for system integration, paving the way to complete lab-on-chips. In this article, we investigate a fabrication process of polymeric free standing structures based on the lamination of SU-8, a thick epoxy photoresist. Our motivation is the hybrid integration of polymer microfluidic or MEMS components with silicon chips (e.g., integrated circuits or sensors). Compared to rigid substrates used in more conventional SU-8/SU-8 bonding process, the flexible photosensitive films used within this lamination technique allows a more homogeneous and reliable bonding at low pressure and temperature, and a 3D fabrication with an excellent level-to-level alignment. A parametric optimization of the lamination process is presented. The fabrication of a leakage-free 3D microfluidic network is demonstrated by stacking up to five layers. A polyethylene terephtalate layer has been employed to easily release the SU-8 devices. We show that this release layer also significantly decrease the curvature of the substrate by 32% and the related residual stress in a 100 μm SU-8 layer by at least 10%. Finally, we briefly describe the hybrid integration of a silicon sensor in a microfluidic network as a direct application of our lamination process to the fabrication of lab-on-chips.

Characterization of polymer inks for drop-on-demand printing systems

Abstract: This paper presents a detailed study on the properties of different polymer inks based on poly(3,4ethylenedioxythiophene)/polystyrenesulfonate regarding their processability in an experimental piezo driven drop-on-demand (DoD) micro-feeding system. Based on the rheological properties of the used inks and the mechanical properties of the printing system characteristic values are derived which allow to predict the processability of polymer inks in a given printing system. Beside the printability the influence of different polymer inks on the electrical characteristics of printed organic field effect transistors is investigated.