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Journal ArticleDOI

1.2 kV/25 A Normally off P-N Junction/AlGaN/GaN HEMTs With Nanosecond Switching Characteristics and Robust Overvoltage Capability

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TLDR
In this article, a 1.2 kV/25 V GaN high-electron mobility transistor (PNJ-HEMT) with a reverse p-n junction in the gate stack design was demonstrated.
Abstract
With a reverse p-n junction in the gate stack design, this work demonstrates a 1.2 kV/25 A normally off p-n junction/AlGaN/GaN high-electron mobility transistor (PNJ-HEMT). Benefiting from the robust gate terminal, the PNJ-HEMT exhibits a large gate breakdown voltage of 18.2 V and a positive threshold voltage of 1.7 V, enabling a wide gate-bias window. Thereafter, with an applicable V GS of 10 V, the transient switching characteristics in nanosecond timescale (11.7-ns rise time and 10.5-ns fall time) and notable immunity to dynamic R on degradation, as well as record-high dynamic breakdown voltage (1.62 kV) under transient overvoltage have been demonstrated. In particular, rugged reliability is validated after over 1-million times dynamic breakdown with a 1.5-kV peak overvoltage. To the best of our knowledge, this is the first demonstration of high- V GS (10 V) GaN HEMT's circuit-level operating capability with considerable reliability, and has well exceeded the V GS limit of 5–7 V in conventional p -GaN gate-terminal devices, thus possessing great potentials in high-power, high-frequency, and high-reliability applications.

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Citations
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Journal ArticleDOI

Power device breakdown mechanism and characterization: review and perspective

TL;DR: In this paper , a survey of avalanche and non-avalanche breakdown mechanisms in wide bandgap and ultra-wide bandgap (UWBG) power devices is presented, followed by the distinction between the static and dynamic BV.
Journal ArticleDOI

Near-Ideal Subthreshold Swing in InAlN/GaN Schottky Gate High Electron Mobility Transistor Using Carbon-Doped GaN Buffer

TL;DR: In this article , a comparative study of the sub-threshold swing in InAlN/GaN-based high electron mobility transistor (HEMT) with and without carbon doping in the buffer layer is presented.
Journal ArticleDOI

A 2.2kV Organic Semiconductor- Based Lateral Power Device

TL;DR: In this paper , a lateral drift region OFET (LDR-OFET) is proposed to achieve high breakdown voltage, achieving 2200V breakdown voltage on a spin-coated 50nm thick semiconductor layer.
Proceedings ArticleDOI

On the physics link between time-dependent gate breakdown and electroluminescence in Schottky-type p-GaN gate HEMTs

TL;DR: In this article , Schottky-type p-GaN gate HEMTs with semi-transparent gate electrodes were fabricated and a two-stage degradation process was identified and analyzed.

On the physics link between time-dependent gate breakdown and electroluminescence in Schottky-type p-GaN gate HEMTs

TL;DR: In this article , Schottky-type p-GaN gate HEMTs with semi-transparent gate electrodes were fabricated and a two-stage degradation process was identified and analyzed.
References
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Journal ArticleDOI

GaN-on-Si Power Technology: Devices and Applications

TL;DR: Several device technologies for realizing normally off operation that is highly desirable for power switching applications are presented and the examples of circuit applications that can greatly benefit from the superior performance of GaN power devices are demonstrated.
Journal ArticleDOI

Maximizing the Performance of 650-V p-GaN Gate HEMTs: Dynamic RON Characterization and Circuit Design Considerations

TL;DR: Optimal gate drive conditions are proposed to provide sufficient gate over-drive to minimize the impact of the $V_{{\rm{TH}}}$ under switching operations.
Journal ArticleDOI

Dynamic on -State Resistance Test and Evaluation of GaN Power Devices Under Hard- and Soft-Switching Conditions by Double and Multiple Pulses

TL;DR: In this paper, a dynamic R DSON test board integrating both hard-and soft-switching test circuits is built, and two types of commercial GaN devices are tested and compared under hard and soft switching conditions by doublepulse and multipulse test modes, respectively.
Journal ArticleDOI

Frequency- and Temperature-Dependent Gate Reliability of Schottky-Type ${p}$ -GaN Gate HEMTs

TL;DR: In this article, the authors carried out a systematic investigation on gate degradation and the physical mechanism of the Schottky-type GAN gate HEMTs under positive gate voltage stress and found that the time-dependent gate degradation exhibits weak relevance with frequencies ranging from 10 to 100 kHz under dynamic gate stress.
Journal ArticleDOI

Surge-Energy and Overvoltage Ruggedness of P-Gate GaN HEMTs

TL;DR: In this article, a commercial p-gate GaN high-electron-mobility transistor (HEMT) with Ohmic-and Schottky-type gate contacts is studied.
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