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Figure 5. A various of Greek cross VDP structures on test wafers after Cu nanoparticle paste stencil printing.
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Proceedings Article
•
DOI
•
3D interconnect technology based on low temperature copper nanoparticle sintering
[...]
Baocheng Zhang
1
,
Y.C.P. Carisey
1
,
A. Damian
1
,
R. H. Poelma
1
,
Guoqi Zhang
1
,
H.W. van Zeijl
1
- Show less
+2 more
•
Institutions (1)
Delft University of Technology
1
01 Aug 2016
-