A 22nm high performance and low-power CMOS technology featuring fully-depleted tri-gate transistors, self-aligned contacts and high density MIM capacitors
12 Jun 2012-pp 131-132
TL;DR: In this paper, a 22nm generation logic technology is described incorporating fully-depleted tri-gate transistors for the first time, which provides steep sub-threshold slopes (∼70mV/dec) and very low DIBL ( ∼50m V/V).
Abstract: A 22nm generation logic technology is described incorporating fully-depleted tri-gate transistors for the first time. These transistors feature a 3rd-generation high-k + metal-gate technology and a 5th generation of channel strain techniques resulting in the highest drive currents yet reported for NMOS and PMOS. The use of tri-gate transistors provides steep subthreshold slopes (∼70mV/dec) and very low DIBL (∼50mV/V). Self-aligned contacts are implemented to eliminate restrictive contact to gate registration requirements. Interconnects feature 9 metal layers with ultra-low-k dielectrics throughout the interconnect stack. High density MIM capacitors using a hafnium based high-k dielectric are provided. The technology is in high volume manufacturing.
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TL;DR: The opportunities, progress and challenges of integrating atomically thin materials with silicon-based nanosystems are reviewed, and the prospects for computational and non-computational applications are considered.
Abstract: The development of silicon semiconductor technology has produced breakthroughs in electronics—from the microprocessor in the late 1960s to early 1970s, to automation, computers and smartphones—by downscaling the physical size of devices and wires to the nanometre regime. Now, graphene and related two-dimensional (2D) materials offer prospects of unprecedented advances in device performance at the atomic limit, and a synergistic combination of 2D materials with silicon chips promises a heterogeneous platform to deliver massively enhanced potential based on silicon technology. Integration is achieved via three-dimensional monolithic construction of multifunctional high-rise 2D silicon chips, enabling enhanced performance by exploiting the vertical direction and the functional diversification of the silicon platform for applications in opto-electronics and sensing. Here we review the opportunities, progress and challenges of integrating atomically thin materials with silicon-based nanosystems, and also consider the prospects for computational and non-computational applications. Progress in integrating atomically thin two-dimensional materials with silicon-based technology is reviewed, together with the associated opportunities and challenges, and a roadmap for future applications is presented.
804 citations
TL;DR: Transistor architectures such as extremely thin silicon-on-insulator and FinFET (and related architecture such as TriGate, Omega-FET, Pi-Gate), as well as nanowire device architectures, are compared and contrasted.
Abstract: This review paper explores considerations for ultimate CMOS transistor scaling Transistor architectures such as extremely thin silicon-on-insulator and FinFET (and related architectures such as TriGate, Omega-FET, Pi-Gate), as well as nanowire device architectures, are compared and contrasted Key technology challenges (such as advanced gate stacks, mobility, resistance, and capacitance) shared by all of the architectures will be discussed in relation to recent research results
558 citations
Cites background or methods from "A 22nm high performance and low-pow..."
...have been implemented successfully into manufacturing on the 22-nm node [2]....
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...5× dimensional scale factor in SRAM cell area each generation [2]....
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07 Jun 2013
TL;DR: Structural and operational principles of multiple logic devices under study within the NRI to carry the development of integrated circuits beyond the complementary metal-oxide-semiconductor (CMOS) roadmap are described, and theories used for benchmarking these devices are overviewed.
Abstract: Multiple logic devices are presently under study within the Nanoelectronic Research Initiative (NRI) to carry the development of integrated circuits beyond the complementary metal-oxide-semiconductor (CMOS) roadmap. Structure and operational principles of these devices are described. Theories used for benchmarking these devices are overviewed, and a general methodology is described for consistent estimates of the circuit area, switching time, and energy. The results of the comparison of the NRI logic devices using these benchmarks are presented.
450 citations
IBM1
TL;DR: Terence Hook has been with IBM since 1980 and has worked on technology integration and device design for bipolar, BiCMOS, and CMOS technologies from 2 μm to 5 nm and beyond.
364 citations
16 Mar 2014
TL;DR: The Fully Integrated Voltage Regulators (FIVR) as discussed by the authors are highly configurable, allowing them to power a wide range of products from 3W fanless tablets to 300W servers.
Abstract: Intel's® 4th generation Core™ microprocessors are powered by Fully Integrated Voltage Regulators (FIVR). These 140 MHz multi-phase buck regulators are integrated into the 22nm processor die, and feature up to 80 MHz unity gain bandwidth, non-magnetic package trace inductors and on-die MIM capacitors. FIVRs are highly configurable, allowing them to power a wide range of products from 3W fanless tablets to 300W servers. FIVR helps enable 50% or more battery life improvements for mobile products and more than doubles the peak power available for burst workloads.
347 citations
Cites background from "A 22nm high performance and low-pow..."
...Decoupling for the input rail is provided by a combination of ceramic package capacitors and on-die MIM capacitors [6]....
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