Proceedings ArticleDOI
A case study of BGA package for high speed channel with non-ideal ground induced resonance conditions
Vijay Kumar Singh,Raj Kumar Nagpal,Jai Narayan Tripathi +2 more
- pp 69-72
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TLDR
In this article, a BGA package design exhibiting resonance conditions in insertion loss is analyzed, which led to ground path issues caused by return current density congestions, and an improvement in ground return path layout led to elimination of resonance conditions.Abstract:
Proper transmission of high speed signal requires sufficiently high bandwidth of the medium. The reference planes play a vital role in achieving distortion-free signal propagation. In this paper a BGA package design exhibiting resonance conditions in insertion loss is analyzed. Analysis led to ground path issues caused by return current density congestions. Improvement in ground return path layout led to elimination of resonance conditions. Re-designed package is meeting the intended design target for HDMI 2.0 standards.read more
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Journal ArticleDOI
The Impact of the Connection Failure of Ground Solder Balls on Digital Signal Waveform
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The Impact of the Connection Failure of Ground Solder Balls on Digital Signal Waveform
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TL;DR: In this paper , the impact of failed ground solder balls on digital signal waveforms was theoretically modeled and analyzed, and the results were experimentally verified, and a 3-D electromagnetic field model of a digital signal transmission channel with failed ground solderers was developed to analyze the signal transmission in the frequency domain.
References
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Journal ArticleDOI
Simulation of high-speed interconnects
Ramachandra Achar,Michel Nakhla +1 more
TL;DR: In this review paper various high-speed interconnect effects are briefly discussed, recent advances in transmission line macromodeling techniques are presented, and simulation of high- speed interconnects using model-reduction-based algorithms is discussed in detail.
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Advanced Signal Integrity for High-Speed Digital Designs
Stephen H. Hall,Howard L. Heck +1 more
TL;DR: In this paper, the authors leverage theory and techniques from non-related fields such as applied physics, communications, and microwave engineering and apply them to the field of high-speed digital design.
Book
High-Speed Digital System Design: A Handbook of Interconnect Theory and Design Practices
TL;DR: This book provides a much-needed, practical guide to the state of the art of modern digital system design, combining easily accessible explanations with immensely useful problem-solving strategies.
Book
Power Integrity Modeling and Design for Semiconductors and Systems
Madhavan Swaminathan,A.E. Engin +1 more
TL;DR: This book's system-level focus and practical examples will make it indispensable for every student and professional concerned with power integrity, including electrical engineers, system designers, signal integrity engineers, and materials scientists.
Book
Signal and Power Integrity - Simplified
TL;DR: This book brings together up-to-the-minute techniques for finding, fixing, and avoiding signal integrity problems in your design and will be an invaluable resource for getting signal integrity designs right the first time, every time.