Abstract: Polycrystalline silicon thin films have attracted the attention of semiconductor industries in the past few decades due to their wide applications in thin film transistors, solar cells, display units and sensors (Schropp & Zeman, 1998; Choi et al., 2005; Mahan et al., 2008). Polycrystalline Si thin films are generally fabricated by crystallizing amorphous Si (a-Si) thin films, because these can render larger grains compared to the conventional poly Si film deposition. As a consequence, a variety of methods for lowering the crystallization temperature of a-Si have been developed. Excimer laser annealing is one of the promising ways to achieve large grain size poly Si films at lower substrate temperatures. Its high costs and nonuniform grain size, however, are significant obstacles that prevent its wide use (Parr et al., 2002). The other promising technique is the solid phase crystallization method. But this technique is essentially a high-temperature process and many substrates, including most forms of glass, cannot withstand the thermal processing. In order to achieve lower costs and have a wider range of application, inexpensive materials such as glass and special polymers have to substitute quartz or PyrexTM substrates. In the case of glass substrates, all of the processing steps need to be limited to temperatures below 550 °C. The other known technique is rapid thermal annealing (RTA). In RTA infrared radiation is used as a heating source, and has the advantage of the high heating speed (up to 60 oC/s) that reduces the crystallization time. In RTA radiation is applied in pulses to heat the sample without heating the glass substrate (which is transparent to the infrared radiation). However, the grain size obtained in the crystallization of a-Si is also in the range of a few micrometers.
