A Comprehensive Survey on Microgrippers Design: Operational Strategy

Review of Electrothermal Actuators and Applications

Abstract: This paper presents a review of electrothermal micro-actuators and applications. Electrothermal micro-actuators have been a significant research interest over the last two decades, and many different designs and applications have been investigated. The electrothermal actuation method offers several advantages when compared with the other types of actuation approaches based on electrostatic and piezoelectric principles. The electrothermal method offers flexibility in the choice of materials, low-cost fabrication, and large displacement capabilities. The three main configurations of electrothermal actuators are discussed: hot-and-cold-arm, chevron, and bimorph types as well as a few other unconventional actuation approaches. Within each type, trends are outlined from the basic concept and design modifications to applications which have been investigated in order to enhance the performance or to overcome the limitations of the previous designs. It provides a grasp of the actuation methodology, design, and fabrication, and the related performance and applications in cell manipulation, micro assembly, and mechanical testing of nanomaterials, Radio Frequency (RF) switches, and optical Micro-Electro-Mechanical Systems (MEMS).

Survey on Recent Designs of Compliant Micro-/Nano-Positioning Stages

Abstract: Micromanipulation is a hot topic due to its enabling role in various research fields. In order to perform a high precision operation at a small scale, compliant mechanisms have been proposed and applied for decades. In microscale manipulation, micro-/nano-positioning is the most fundamental operation because a precision positioning is the premise of subsequent operations. This paper is concentrated on reviewing the state-of-the-art research on complaint micro-/nano-positioning stage design in recent years. It involves the major processes and components for designing a compliant positioning stage, e.g., actuator selection, stroke amplifier design, connecting scheme of the multi-DOF stage and structure optimization. The review provides a reference to design a compliant micro-/nano-positioning stage for pertinent applications.

New MEMS Tweezers for the Viscoelastic Characterization of Soft Materials at the Microscale

Abstract: As many studies show, there is a relation between the tissue’s mechanical characteristics and some specific diseases. Knowing this relationship would help early diagnosis or microsurgery. In this paper, a new method for measuring the viscoelastic properties of soft materials at the microscale is proposed. This approach is based on the adoption of a microsystem whose mechanical structure can be reduced to a compliant four bar linkage where the connecting rod is substituted by the tissue sample. A procedure to identify both stiffness and damping coefficients of the tissue is then applied to the developed hardware. Particularly, stiffness is calculated solving the static equations of the mechanism in a desired configuration, while the damping coefficient is inferred from the dynamic equations, which are written under the hypothesis that the sample tissue is excited by a variable compression force characterized by a suitable wave form. The whole procedure is implemented by making use of a control system.

Operational characterization of CSFH MEMS Technology based hinges

Abstract: Progress in MEMS technology continuously stimulates new developments in the mechanical structure of micro systems, such as, for example, the concept of so-called CSFH (conjugate surfaces flexural hinge), which makes it possible, simultaneously, to minimize the internal stresses and to increase motion range and robustness. Such a hinge may be actuated by means of a rotary comb-drive, provided that a proper set of simulations and tests are capable to assess its feasibility. In this paper, a CSFH has been analyzed with both theoretical and finite element (FEM) methods, in order to obtain the relation between voltage and generated torque. The FEM model considers also the fringe effect on the comb drive finger. Electromechanical couple–field analysis is performed by means of both direct and load transfer methods. Experimental tests have been also performed on a CSFH embedded in a MEMS prototype, which has been fabricated starting from a SOI wafer and using D–RIE (deep reactive ion etching). Results showed that CSFH performs better than linear flexure hinges in terms of larger rotations and less stress for given applied voltage.

Linear System Theory and Design

Abstract: From the Publisher: An extensive revision of the author's highly successful text, this third edition of Linear System Theory and Design has been made more accessible to students from all related backgrounds. After introducing the fundamental properties of linear systems, the text discusses design using state equations and transfer functions. The two main objectives of the text are to: use simple and efficient methods to develop results and design procedures; enable students to employ the results to carry out design. Striking a balance between theory and applications, Linear System Theory and Design, 3/e, is ideal for use in advanced undergraduate/first-year graduate courses in linear systems and multivariable system design in electrical, mechanical, chemical, and aeronautical engineering departments. It assumes a working knowledge of linear algebra and the Laplace transform and an elementary knowledge of differential equations.

Hybrid position/force control of manipulators

Abstract: A new conceptually simple approach to controlling compliant motions of a robot manipulator is presented. The 'hybrid' technique described combines force and torque information with positional data to satisfy simultaneous position and force trajectory constraints specified in a convenient task related coordinate system. Analysis, simulation, and experiments are used to evaluate the controller's ability to execute trajectories using feedback from a force sensing wrist and from position sensors found in the manipulator joints. The results show that the method achieves stable, accurate control of force and position trajectories for a variety of test conditions.

Fundamentals of microfabrication : the science of miniaturization

Abstract: LITHOGRAPHY Introduction Historical Note: Lithography's Origins Photolithography Overview Critical Dimension, Overall Resolution, Line-Width Lithographic Sensitivity and Intrinsic Resist Sensitivity (Photochemical Quantum Efficiency) Resist Profiles Contrast and Experimental Determination of Lithographic Sensitivity Resolution in Photolithography Photolithography Resolution Enhancement Technology Beyond Moore's Law Next Generation Lithographies Emerging Lithography Technologies PATTERN TRANSFER WITH DRY ETCHING TECHNIQUES Introduction Dry Etching: Definitions and Jargon Plasmas or Discharges Physical Etching: Ion Etching or Sputtering and Ion-Beam Milling Plasma Etching (Radical Etching) Physical/Chemical Etching PATTERN TRANSFER WITH ADDITIVE TECHNIQUES Introduction Silicon Growth Doping of Si Oxidation of Silicon Physical Vapor Deposition Chemical Vapor Deposition Silk-Screening or Screen-Printing Sol-Gel Deposition Technique Doctors' Blade or Tape Casting Plasma Spraying Deposition and Arraying Methods of Organic Layers in BIOMEMS Thin versus Thick Film Deposition Selection Criteria for Deposition Method WET BULK MICROMACHINING Introduction Historical Note Silicon Crystallography Silicon As Substrate Silicon As A Mechanical Element In MEMS Wet Isotropic And Anisotropic Etching Alignment Patterns Chemical Etching Models Etching With Bias And/Or Illumination Of The Semiconductor Etch-Stop Techniques Problems With Wet Bulk Micromachining SURFACE MICROMACHINING Introduction Historical Note Mechanical Properties of Thin Films Surface Micromachining Processes Poly-Si Surface Micromachining Modifications Non-Poly-Si Surface Micromachining Modifications Materials Case Studies LIGA AND MICROMOLDING Introduction LIGA-Background LIGA and LIGA-Like Process Steps A COMPARISON OF MINIATURIZATION TECHNIQUES: TOP-DOWN AND BOTTOM-UP MANUFACTURING Introduction Absolute and Relative Tolerance in Manufacturing Historical Note: Human Manufacturing Section I: Top-Down Manufacturing Methods Section II: Bottom-Up Approaches MODELING, BRAINS, PACKAGING, SAMPLE PREPARATION AND NEW MEMS MATERIALS Introduction Modeling Brains In Miniaturization Packaging Substrate Choice SCALING, ACTUATORS, AND POWER IN MINIATURIZED SYSTEMS Introduction Scaling Actuators Fluidics Scaling In Analytical Separation Equipment Other Actuators Integrated Power MINIATURIZATION APPLICATIONS Introduction Definitions and Classification Method Decision Three OVERALL MARKET For MICROMACHINES Introduction Why Use Miniaturization Technology ? From Perception to Realization Overall MEMS Market Size MEMS Market Character MEMS Based on Si Non-Silicon MEMS MEMS versus Traditional Precision Engineering The Times are a'Changing APPENDICES Metrology Techniques WWW Linkpage Etch Rate for Si, SiO2 Summary of Top-Down Miniaturization Tools Listing of names of 20 amino acids & their chemical formulas Genetic code Summary of Materials and Their Properties for Microfabrication References for Detailed Market Information on Miniature Devices MEMS Companies Update Suggested Further Reading Glossary Symbols used in Text INDEX Each chapter also contains sections of examples and problems

Microsystem Design

Abstract: p. 445 There is a minor numerical error in going from Eq. 16.39 to Eq. 16.40. The factor of 2 in the 1/f term was omitted, so the correct numerator for the second term in Eq. 16.40 is 1.44 x 10 -7 . This error has an obvious effect on the calculations that follow, increasing the minimum detectable temperature change to about 2 mK (Eq. 16.44) and, correspondingly, increasing the RMS noise calculated from Eq. 16.49 by sqrt(2).

Piezoresistance Effect in Germanium and Silicon

Abstract: Uniaxial tension causes a change of resistivity in silicon and germanium of both $n$ and $p$ types. The complete tensor piezoresistance has been determined experimentally for these materials and expressed in terms of the pressure coefficient of resistivity and two simple shear coefficients. One of the shear coefficients for each of the materials is exceptionally large and cannot be explained in terms of previously known mechanisms. A possible microscopic mechanism proposed by C. Herring which could account for one large shear constant is discussed. This so called electron transfer effect arises in the structure of the energy bands of these semiconductors, and piezoresistance may therefore give important direct experimental information about this structure.