A Comprehensive Survey on Microgrippers Design: Operational Strategy
01 Jul 2017-Journal of Mechanical Design (American Society of Mechanical Engineers Digital Collection)-Vol. 139, Iss: 7, pp 070801
About: This article is published in Journal of Mechanical Design.The article was published on 2017-07-01. It has received 66 citations till now.
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TL;DR: In this article, a micropositioning system actuated by three piezoelectric stacks to control its displacements on XYZ axes is presented, which can be integrated into a micro gripper to generate a complete manipulation system.
Abstract: This article presents the design and implementation of a micropositioning system actuated by three piezoelectric stacks to control its displacements on XYZ axes. The use of conventional piezoelectric buzzers allows us to reduce fabrication costs. The working or mobile platform is the base for objects that will be manipulated, for example, in automated assembling. The micropositioner can be integrated into a microgripper to generate a complete manipulation system. For micropositioner fabrication, at first, Polylactic Acid (PLA) was chosen as the structural material, but after simulation and some experimental tests performed with a micropositioner made of Acrylonitrile Butadiene Styrene (ABS), it showed larger displacement (approx. 20%) due to its lower stiffness. A third test was performed with a positioner made with Polyethylene Terephthalate Glycol (PETG), obtaining an intermediate performance. The originality of this work resides in the geometrical arrangement based on thermoplastic polymer compliance mechanisms, as well as in the use of additive manufacturing to fabricate it. An experimental setup was developed to carry out experimental tests. ANSYS™ was used for simulation.
6 citations
Cites background from "A Comprehensive Survey on Microgrip..."
...Effectiveness and efficiency in micromanipulating rely on some crucial characteristics such as, for example, high force–to–volume ratio, actuation precision, and micropositioning accuracy [9]....
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...Their characteristics are high resolution, force, and operating frequency, fast response time, long lifetime, resistance, compact, high stability, immunity to electromagnetic interference, stiffness, and large bandwidth [15], no wear and tear [9], etc....
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TL;DR: In this article, an electrothermal actuation assembly fabricated from a carefully patterned multilayer thin-film stack is epoxy bonded to a 1 mm2 Au-coated micromirror fabricated from an SOI wafer.
Abstract: Micro-electromechanical system (MEMS) micromirrors have been in development for many years, but the ability to steer beams to angles larger than 20° remains a challenging endeavor. This paper details a MEMS micromirror device capable of achieving large motion for both tip/tilt angles and piston motion. The device consists of an electrothermal actuation assembly fabricated from a carefully patterned multilayer thin-film stack (SiO2/Al/SiO2) that is epoxy bonded to a 1 mm2 Au coated micromirror fabricated from an SOI wafer. The actuation assembly consists of four identical actuators, each comprised of a series of beams that use the inherent residual stresses and coefficient of thermal expansion (CTE) mismatches of the selected thin films to enable the large, upward, out-of-plane deflections necessary for large-angle beamsteering. Finite element simulations were performed (COMSOL v5.5) to capture initial elevations and tip/tilt motion displacements and achieved 85%, making it suitable for optical phased array beam control applications.
5 citations
TL;DR: A novel approach for the identification of the stiffness and damping coefficients of biosamples is introduced and the feasibility of the method that enables the ability to perform simultaneously two tasks: sample manipulation and parameters identification is confirmed.
Abstract: The mechanical characterization of biological samples is a fundamental issue in biology and related fields, such as tissue and cell mechanics, regenerative medicine and diagnosis of diseases. In this paper, a novel approach for the identification of the stiffness and damping coefficients of biosamples is introduced. According to the proposed method, a MEMS-based microgripper in operational condition is used as a measurement tool. The mechanical model describing the dynamics of the gripper-sample system considers the pseudo-rigid body model for the microgripper, and the Kelvin–Voigt constitutive law of viscoelasticity for the sample. Then, two algorithms based on recursive least square (RLS) methods are implemented for the estimation of the mechanical coefficients, that are the forgetting factor based RLS and the normalised gradient based RLS algorithms. Numerical simulations are performed to verify the effectiveness of the proposed approach. Results confirm the feasibility of the method that enables the ability to perform simultaneously two tasks: sample manipulation and parameters identification.
5 citations
5 citations
TL;DR: An improved single degree of freedom model to describe electrically actuated microbeam-based resonators is obtained by using modified couple stress theory and Nonlinear Galerkin method and results show that this improved model can describe the static behavior more accurately than that of single degreeof freedom model via traditional Galerkins Method.
Abstract: Monostable vibration can eliminate dynamic bifurcation and improve system stability, which is required in many microelectromechanical systems (MEMS) applications, such as microbeam-based and comb-driven resonators. This article aims to theoretically investigate the monostable vibration in size-effected MEMS via a low dimensional model. An improved single degree of freedom model to describe electrically actuated microbeam-based resonators is obtained by using modified couple stress theory and Nonlinear Galerkin method. Static displacement, pull-in voltage, resonant frequency and especially the monostable dynamic behaviors of the resonators are investigated in detail. Through perturbation analysis, an approximate average equation is derived by the application of the method of Multiple Scales. Theoretical expressions about parameter space and maximum amplitude of monostable vibration are then deduced. Results show that this improved model can describe the static behavior more accurately than that of single degree of freedom model via traditional Galerkin Method. This desired monostable large amplitude vibration is significantly affected by the ratio of the gap width to mircobeam thickness. The optimization design results show that reasonable decrease of this ratio can be beneficial to monostable vibration. All these analytical results are verified by numerical results via Differential Quadrature method, which show excellent agreement with each other. This analysis has the potential of improving dynamic performance in MEMS.
5 citations
Additional excerpts
...Microbeam-based structures are widely applied in MEMS, such as microactuator/sensor [1–3], energy harvester [4], microresonator [5–7], gyroscope [8], microgripper [9,10] and so on....
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References
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Book•
07 Jun 1995
TL;DR: Striking a balance between theory and applications, Linear System Theory and Design, 3/e, is ideal for use in advanced undergraduate/first-year graduate courses in linear systems and multivariable system design in electrical, mechanical, chemical, and aeronautical engineering departments.
Abstract: From the Publisher:
An extensive revision of the author's highly successful text, this third edition of Linear System Theory and Design has been made more accessible to students from all related backgrounds. After introducing the fundamental properties of linear systems, the text discusses design using state equations and transfer functions. The two main objectives of the text are to: use simple and efficient methods to develop results and design procedures; enable students to employ the results to carry out design. Striking a balance between theory and applications, Linear System Theory and Design, 3/e, is ideal for use in advanced undergraduate/first-year graduate courses in linear systems and multivariable system design in electrical, mechanical, chemical, and aeronautical engineering departments. It assumes a working knowledge of linear algebra and the Laplace transform and an elementary knowledge of differential equations.
4,017 citations
TL;DR: A new conceptually simple approach to controlling compliant motions of a robot manipulator that combines force and torque information with positional data to satisfy simultaneous position and force trajectory constraints specified in a convenient task related coordinate system is presented.
Abstract: A new conceptually simple approach to controlling compliant motions of a robot manipulator is presented. The 'hybrid' technique described combines force and torque information with positional data to satisfy simultaneous position and force trajectory constraints specified in a convenient task related coordinate system. Analysis, simulation, and experiments are used to evaluate the controller's ability to execute trajectories using feedback from a force sensing wrist and from position sensors found in the manipulator joints. The results show that the method achieves stable, accurate control of force and position trajectories for a variety of test conditions.
2,991 citations
Book•
01 Jan 2002
TL;DR: In this paper, a comparison of top-down and bottom-up manufacturing methods for micro-manufacturing is presented, with a focus on the use of micro-processors.
Abstract: LITHOGRAPHY Introduction Historical Note: Lithography's Origins Photolithography Overview Critical Dimension, Overall Resolution, Line-Width Lithographic Sensitivity and Intrinsic Resist Sensitivity (Photochemical Quantum Efficiency) Resist Profiles Contrast and Experimental Determination of Lithographic Sensitivity Resolution in Photolithography Photolithography Resolution Enhancement Technology Beyond Moore's Law Next Generation Lithographies Emerging Lithography Technologies PATTERN TRANSFER WITH DRY ETCHING TECHNIQUES Introduction Dry Etching: Definitions and Jargon Plasmas or Discharges Physical Etching: Ion Etching or Sputtering and Ion-Beam Milling Plasma Etching (Radical Etching) Physical/Chemical Etching PATTERN TRANSFER WITH ADDITIVE TECHNIQUES Introduction Silicon Growth Doping of Si Oxidation of Silicon Physical Vapor Deposition Chemical Vapor Deposition Silk-Screening or Screen-Printing Sol-Gel Deposition Technique Doctors' Blade or Tape Casting Plasma Spraying Deposition and Arraying Methods of Organic Layers in BIOMEMS Thin versus Thick Film Deposition Selection Criteria for Deposition Method WET BULK MICROMACHINING Introduction Historical Note Silicon Crystallography Silicon As Substrate Silicon As A Mechanical Element In MEMS Wet Isotropic And Anisotropic Etching Alignment Patterns Chemical Etching Models Etching With Bias And/Or Illumination Of The Semiconductor Etch-Stop Techniques Problems With Wet Bulk Micromachining SURFACE MICROMACHINING Introduction Historical Note Mechanical Properties of Thin Films Surface Micromachining Processes Poly-Si Surface Micromachining Modifications Non-Poly-Si Surface Micromachining Modifications Materials Case Studies LIGA AND MICROMOLDING Introduction LIGA-Background LIGA and LIGA-Like Process Steps A COMPARISON OF MINIATURIZATION TECHNIQUES: TOP-DOWN AND BOTTOM-UP MANUFACTURING Introduction Absolute and Relative Tolerance in Manufacturing Historical Note: Human Manufacturing Section I: Top-Down Manufacturing Methods Section II: Bottom-Up Approaches MODELING, BRAINS, PACKAGING, SAMPLE PREPARATION AND NEW MEMS MATERIALS Introduction Modeling Brains In Miniaturization Packaging Substrate Choice SCALING, ACTUATORS, AND POWER IN MINIATURIZED SYSTEMS Introduction Scaling Actuators Fluidics Scaling In Analytical Separation Equipment Other Actuators Integrated Power MINIATURIZATION APPLICATIONS Introduction Definitions and Classification Method Decision Three OVERALL MARKET For MICROMACHINES Introduction Why Use Miniaturization Technology ? From Perception to Realization Overall MEMS Market Size MEMS Market Character MEMS Based on Si Non-Silicon MEMS MEMS versus Traditional Precision Engineering The Times are a'Changing APPENDICES Metrology Techniques WWW Linkpage Etch Rate for Si, SiO2 Summary of Top-Down Miniaturization Tools Listing of names of 20 amino acids & their chemical formulas Genetic code Summary of Materials and Their Properties for Microfabrication References for Detailed Market Information on Miniature Devices MEMS Companies Update Suggested Further Reading Glossary Symbols used in Text INDEX Each chapter also contains sections of examples and problems
1,930 citations
Book•
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01 Jan 2001
TL;DR: In this article, a minor numerical error in going from Eq. 16.39 to eq.16.40 is found, which has an obvious effect on the calculations that follow, increasing the minimum detectable temperature change to about 2 mK.
Abstract: p. 445 There is a minor numerical error in going from Eq. 16.39 to Eq. 16.40. The factor of 2 in the 1/f term was omitted, so the correct numerator for the second term in Eq. 16.40 is 1.44 x 10 -7 . This error has an obvious effect on the calculations that follow, increasing the minimum detectable temperature change to about 2 mK (Eq. 16.44) and, correspondingly, increasing the RMS noise calculated from Eq. 16.49 by sqrt(2).
1,917 citations
TL;DR: In this article, the complete tensor piezoresistance has been determined experimentally for these materials and expressed in terms of the pressure coefficient of resistivity and two simple shear coefficients.
Abstract: Uniaxial tension causes a change of resistivity in silicon and germanium of both $n$ and $p$ types. The complete tensor piezoresistance has been determined experimentally for these materials and expressed in terms of the pressure coefficient of resistivity and two simple shear coefficients. One of the shear coefficients for each of the materials is exceptionally large and cannot be explained in terms of previously known mechanisms. A possible microscopic mechanism proposed by C. Herring which could account for one large shear constant is discussed. This so called electron transfer effect arises in the structure of the energy bands of these semiconductors, and piezoresistance may therefore give important direct experimental information about this structure.
1,779 citations