A Comprehensive Survey on Microgrippers Design: Operational Strategy
01 Jul 2017-Journal of Mechanical Design (American Society of Mechanical Engineers Digital Collection)-Vol. 139, Iss: 7, pp 070801
About: This article is published in Journal of Mechanical Design.The article was published on 2017-07-01. It has received 66 citations till now.
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76 citations
TL;DR: A review of electrothermal micro-actuators and applications is presented in this paper, where the three main configurations of electro-thermal actuators are discussed: hot-and-cold-arm, chevron, and bimorph.
Abstract: This paper presents a review of electrothermal micro-actuators and applications. Electrothermal micro-actuators have been a significant research interest over the last two decades, and many different designs and applications have been investigated. The electrothermal actuation method offers several advantages when compared with the other types of actuation approaches based on electrostatic and piezoelectric principles. The electrothermal method offers flexibility in the choice of materials, low-cost fabrication, and large displacement capabilities. The three main configurations of electrothermal actuators are discussed: hot-and-cold-arm, chevron, and bimorph types as well as a few other unconventional actuation approaches. Within each type, trends are outlined from the basic concept and design modifications to applications which have been investigated in order to enhance the performance or to overcome the limitations of the previous designs. It provides a grasp of the actuation methodology, design, and fabrication, and the related performance and applications in cell manipulation, micro assembly, and mechanical testing of nanomaterials, Radio Frequency (RF) switches, and optical Micro-Electro-Mechanical Systems (MEMS).
66 citations
TL;DR: This paper is concentrated on reviewing the state-of-the-art research on complaint micro-/nano-positioning stage design in recent years and involves the major processes and components for designing a compliant positioning stage, e.g., actuator selection, stroke amplifier design, connecting scheme of the multi-DOF stage and structure optimization.
Abstract: Micromanipulation is a hot topic due to its enabling role in various research fields. In order to perform a high precision operation at a small scale, compliant mechanisms have been proposed and applied for decades. In microscale manipulation, micro-/nano-positioning is the most fundamental operation because a precision positioning is the premise of subsequent operations. This paper is concentrated on reviewing the state-of-the-art research on complaint micro-/nano-positioning stage design in recent years. It involves the major processes and components for designing a compliant positioning stage, e.g., actuator selection, stroke amplifier design, connecting scheme of the multi-DOF stage and structure optimization. The review provides a reference to design a compliant micro-/nano-positioning stage for pertinent applications.
59 citations
TL;DR: A CSFH has been analyzed with both theoretical and finite element methods, in order to obtain the relation between voltage and generated torque, and showed that CSFH performs better than linear flexure hinges in terms of larger rotations and less stress for given applied voltage.
Abstract: Progress in MEMS technology continuously stimulates new developments in the mechanical structure of micro systems, such as, for example, the concept of so-called CSFH (conjugate surfaces flexural hinge), which makes it possible, simultaneously, to minimize the internal stresses and to increase motion range and robustness. Such a hinge may be actuated by means of a rotary comb-drive, provided that a proper set of simulations and tests are capable to assess its feasibility. In this paper, a CSFH has been analyzed with both theoretical and finite element (FEM) methods, in order to obtain the relation between voltage and generated torque. The FEM model considers also the fringe effect on the comb drive finger. Electromechanical couple–field analysis is performed by means of both direct and load transfer methods. Experimental tests have been also performed on a CSFH embedded in a MEMS prototype, which has been fabricated starting from a SOI wafer and using D–RIE (deep reactive ion etching). Results showed that CSFH performs better than linear flexure hinges in terms of larger rotations and less stress for given applied voltage.
32 citations
TL;DR: In this article, the authors reviewed the recent advances on performance indices, classification, structural composition, optimization and modeling method, and control of PEACM and provided a guideline on further development of the micro gripper.
Abstract: The piezoelectric-actuated compliant microgripper (PEACM) plays an essential role in the application fields such as biomedical engineering, microelectronics, and optical engineering. As compared with other categories of grippers, PEACM exhibits the advantages of high accuracy of displacement, large power to weight ratio, low energy consumption, and fast response speed. This paper reviews the recent advances on performance indices, classification, structural composition, optimization and modeling method, and control of PEACM. First, the gripper's performance indices and classifications are elaborated, which is beneficial to determine the design goal. Then, the compliant mechanisms adopted in the microgripper design are discussed, including the flexible hinge, displacement amplifier, and guiding mechanism. In addition, the optimization and modeling methods of the microgripper are presented. Popular types of position/force sensors and different displacement/force control strategies employed in the microgripper are surveyed. Moreover, the prospect on future development trend of the PEACM is discussed. The paper provides the reader with an overview of the recent advances on PEACM design and also a guideline on further development of the microgripper.
32 citations
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Abstract: Piezoresistive sensors are among the earliest micromachined silicon devices. The need for smaller, less expensive, higher performance sensors helped drive early micromachining technology, a precursor to microsystems or microelectromechanical systems (MEMS). The effect of stress on doped silicon and germanium has been known since the work of Smith at Bell Laboratories in 1954. Since then, researchers have extensively reported on microscale, piezoresistive strain gauges, pressure sensors, accelerometers, and cantilever force/displacement sensors, including many commercially successful devices. In this paper, we review the history of piezoresistance, its physics and related fabrication techniques. We also discuss electrical noise in piezoresistors, device examples and design considerations, and alternative materials. This paper provides a comprehensive overview of integrated piezoresistor technology with an introduction to the physics of piezoresistivity, process and material selection and design guidance useful to researchers and device engineers.
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611 citations
TL;DR: A comprehensive review of micromachined piezoelectric transducers can be found in this paper, where the authors present a critical assessment of the future trends and promise of this technology.
Abstract: Over the past two decades, several advances have been made in micromachined sensors and actuators. As the field of microelectromechanical systems (MEMS) has advanced, a clear need for the integration of materials other than silicon and its compounds into micromachined transducers has emerged. Piezoelectric materials are high energy density materials that scale very favorably upon miniaturization and that has led to an ever-growing interest in piezoelectric films for MEMS applications. At this time, piezoelectric aluminum-nitride-based film bulk acoustic resonators (FBAR) have already been successfully commercialized. Future innovations and improvements in inertial sensors for navigation, high-frequency crystal oscillators and filters for wireless applications, microactuators for RF applications, chip-scale chemical analysis systems and countless other applications hinge upon the successful miniaturization of components and integration of piezoelectrics and metals into these systems. In this article, a comprehensive review of micromachined piezoelectric transducer technology will be presented. Piezoelectric materials in bulk and thin film forms will be reviewed and fabrication techniques for the integration of these materials for microsensor applications will be presented. Recent advances in various piezoelectric microsensors will be presented through specific examples. This review will conclude with a critical assessment of the future trends and promise of this technology.
498 citations