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Journal ArticleDOI

A Critical Analysis of Crack Propagation Laws

01 Dec 1963-Journal of Basic Engineering (American Society of Mechanical Engineers Digital Collection)-Vol. 85, Iss: 4, pp 528-533
About: This article is published in Journal of Basic Engineering.The article was published on 1963-12-01. It has received 5772 citations till now. The article focuses on the topics: Crack growth resistance curve & Crack closure.
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01 Jan 1971
TL;DR: A concise, self-contained introduction to solid polymers, the mechanics of their behavior and molecular and structural interpretations can be found in this article, which provides extended coverage of recent developments in rubber elasticity, relaxation transitions, non-linear viscoelastic behavior, anisotropic mechanical behavior, yield behavior of polymers and other fields.
Abstract: A concise, self-contained introduction to solid polymers, the mechanics of their behavior and molecular and structural interpretations. This updated edition provides extended coverage of recent developments in rubber elasticity, relaxation transitions, non-linear viscoelastic behavior, anisotropic mechanical behavior, yield behavior of polymers, breaking phenomena, and other fields.

2,335 citations

Journal ArticleDOI
Yaguo Lei1, Naipeng Li1, Liang Guo1, Ningbo Li1, Tao Yan1, Jing Lin1 
TL;DR: A review on machinery prognostics following its whole program, i.e., from data acquisition to RUL prediction, which provides discussions on current situation, upcoming challenges as well as possible future trends for researchers in this field.

1,116 citations


Cites background from "A Critical Analysis of Crack Propag..."

  • ...It was first proposed in [176] to describe the crack growth....

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Journal ArticleDOI
TL;DR: In this paper, the authors study cracks either in piezoelectrics, or on interfaces between the materials such as metal electrodes or polymer matrices, and derive the macroscopic field regarding the crack tip as a physically structureless point.
Abstract: We Study cracks either in piezoelectrics, or on interfaces between piezoelectrics and other materials such as metal electrodes or polymer matrices. The projected applications include ferroelectric actuators operating statically or cyclically, over the major portion of the samples, in the linear regime of the constitutive curve, but the elevated field around defects causes the materials to undergo hysteresis locally. The fracture mechanics viewpoint is adopted—that is, except for a region localized at the crack tip, the materials are taken to be linearly piezoelectric. The problem thus breaks into two subproblems: (i) determining the macroscopic field regarding the crack tip as a physically structureless point, and (ii) considering the hysteresis and other irreversible processes near the crack tip at a relevant microscopic level. The first Subproblem, which prompts a phenomenological fracture theory, receives a thorough investigation in this paper. Griffith's energy accounting is extended to include energy change due to both deformation and polarization. Four modes of square root singularities are identified at the tip of a crack in a homogeneous piezoelectric. A new type of singularity is discovered around interface crack tips. Specifically, the singularities in general form two pairs: r1/2±ieand r1/2±ie, where e. and k are real numbers depending on the constitutive constants. Also solved is a class of boundary value problems involving many cracks on the interface between half-spaces. Fracture mechanics are established for ferroelectric ceramics under smallscale hysteresis conditions, which facilitates the experimental study of fracture resistance and fatigue crack growth under combined mechanical and electrical loading. Both poled and unpoled fcrroelectrie ceramics are discussed.

1,112 citations

Journal ArticleDOI
TL;DR: The state of the art in condition monitoring for power electronics can be found in this paper, where the authors present a review of the current state-of-the-art in power electronics condition monitoring.
Abstract: Condition monitoring (CM) has already been proven to be a cost effective means of enhancing reliability and improving customer service in power equipment, such as transformers and rotating electrical machinery. CM for power semiconductor devices in power electronic converters is at a more embryonic stage; however, as progress is made in understanding semiconductor device failure modes, appropriate sensor technologies, and signal processing techniques, this situation will rapidly improve. This technical review is carried out with the aim of describing the current state of the art in CM research for power electronics. Reliability models for power electronics, including dominant failure mechanisms of devices are described first. This is followed by a description of recently proposed CM techniques. The benefits and limitations of these techniques are then discussed. It is intended that this review will provide the basis for future developments in power electronics CM.

820 citations


Cites background from "A Critical Analysis of Crack Propag..."

  • ...to the amplitude of the stress intensity factor [76], [90]...

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