A critical review of traditional and emerging techniques and fluids for electronics cooling
TL;DR: In this paper, a critical review of traditional and emerging cooling methods as well as coolants for electronics is provided, summarizing traditional coolants, heat transfer properties and performances of potential new coolants such as nanofluids are also reviewed and analyzed.
Abstract: Continued miniaturization and demand for high-end performance of electronic devices and appliances have led to dramatic increase in their heat flux generation. Consequently, conventional coolants and cooling approaches are increasingly falling short in meeting the ever-increasing cooling needs and challenges of those high heat generating electronic devices. This study provides a critical review of traditional and emerging cooling methods as well as coolants for electronics. In addition to summarizing traditional coolants, heat transfer properties and performances of potential new coolants such as nanofluids are also reviewed and analyzed. With superior thermal properties and numerous benefits nanofluids show great promises in fulfilling the cooling demands of high heat generating electronic devices. It is believed that applications of such novel coolants in emerging techniques like micro-channels and micro-heat pipes can revolutionize cooling technologies for electronics in the future.
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TL;DR: In this article, the authors present a critical review of heat transfer applications of nanofluids, including radiators, circular tube heat exchangers, plate heat exchanger, shell and tube heat exchange, and heat sinks.
Abstract: This paper presents a critical review of heat transfer applications of nanofluids. The effects of nanoparticle concentration, size, shape, and nanofluid flow rate on Nusselt number, heat transfer coefficient, thermal conductivity, thermal resistance, friction factor and pressure drop from numerous studies reported recently are presented. Effects of various geometric parameters on heat transfer enhancement of system using nanofluids have also been reviewed. Heat transfer devices covered in this paper include radiators, circular tube heat exchangers, plate heat exchangers, shell and tube heat exchangers and heat sinks. Various correlations used for experimental validation or developed in reviewed studies are also compiled, compared and analyzed. The pros and cons associated to the applications of nanofluids in heat transfer devices are presented in details to determine the future direction of research in this arena.
388 citations
TL;DR: In this article, the authors reviewed the use of nanofluids in electronics cooling considering several aspects such as liquid block type, numerical approach, nanoparticle material, energy consumption, and second law of thermodynamics.
221 citations
TL;DR: In this paper, the importance of different forces in nanofluid flows that exist in particulate flows such as drag, lift (Magnus and Saffman), Brownian, thermophoretic, Van der Waals, electrostatic double layer forces are considered.
165 citations
TL;DR: In this article, the authors investigated the performance of pin-fin configurations with and without phase change materials (PCMs) for heat transfer in electronic integrated circuits and found that triangular pin-fins are the most effective configuration for heat-transfer.
154 citations
TL;DR: In this article, the application of a new generation of heat transfer fluids, nanofluids, to electronic devices is analyzed, which could be one of the key elements that could give an important impulse to further miniaturization of electronic devices and at the same time increase their energy efficiency.
149 citations
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01 Jan 1998
TL;DR: Integrated circuits will lead to such wonders as home computers or at least terminals connected to a central computer, automatic controls for automobiles, and personal portable communications equipment as mentioned in this paper. But the biggest potential lies in the production of large systems.
Abstract: The future of integrated electronics is the future of electronics itself. The advantages of integration will bring about a proliferation of electronics, pushing this science into many new areas. Integrated circuits will lead to such wonders as home computers—or at least terminals connected to a central computer—automatic controls for automobiles, and personal portable communications equipment. The electronic wristwatch needs only a display to be feasible today. But the biggest potential lies in the production of large systems. In telephone communications, integrated circuits in digital filters will separate channels on multiplex equipment. Integrated circuits will also switch telephone circuits and perform data processing. Computers will be more powerful, and will be organized in completely different ways. For example, memories built of integrated electronics may be distributed throughout the machine instead of being concentrated in a central unit. In addition, the improved reliability made possible by integrated circuits will allow the construction of larger processing units. Machines similar to those in existence today will be built at lower costs and with faster turnaround.
9,647 citations
Journal Article•
TL;DR: Integrated circuits will lead to such wonders as home computers or at least terminals connected to a central computer, automatic controls for automobiles, and personal portable communications equipment as discussed by the authors. But the biggest potential lies in the production of large systems.
Abstract: The future of integrated electronics is the future of electronics itself. The advantages of integration will bring about a proliferation of electronics, pushing this science into many new areas. Integrated circuits will lead to such wonders as home computers—or at least terminals connected to a central computer—automatic controls for automobiles, and personal portable communications equipment. The electronic wristwatch needs only a display to be feasible today. But the biggest potential lies in the production of large systems. In telephone communications, integrated circuits in digital filters will separate channels on multiplex equipment. Integrated circuits will also switch telephone circuits and perform data processing. Computers will be more powerful, and will be organized in completely different ways. For example, memories built of integrated electronics may be distributed throughout the machine instead of being concentrated in a central unit. In addition, the improved reliability made possible by integrated circuits will allow the construction of larger processing units. Machines similar to those in existence today will be built at lower costs and with faster turnaround.
6,077 citations
TL;DR: In this article, an innovative new class of heat transfer fluids can be engineered by suspending metallic nanoparticles in conventional heat-transfer fluids, which are expected to exhibit high thermal conductivities compared to those of currently used heat transfer fluid, and they represent the best hope for enhancing heat transfer.
Abstract: Low thermal conductivity is a primary limitation in the development of energy-efficient heat transfer fluids that are required in many industrial applications. In this paper we propose that an innovative new class of heat transfer fluids can be engineered by suspending metallic nanoparticles in conventional heat transfer fluids. The resulting {open_quotes}nanofluids{close_quotes} are expected to exhibit high thermal conductivities compared to those of currently used heat transfer fluids, and they represent the best hope for enhancement of heat transfer. The results of a theoretical study of the thermal conductivity of nanofluids with copper nanophase materials are presented, the potential benefits of the fluids are estimated, and it is shown that one of the benefits of nanofluids will be dramatic reductions in heat exchanger pumping power.
4,634 citations
TL;DR: In this paper, a water-cooled integral heat sink for silicon integrated circuits has been designed and tested at a power density of 790 W/cm2, with a maximum substrate temperature rise of 71°C above the input water temperature.
Abstract: The problem of achieving compact, high-performance forced liquid cooling of planar integrated circuits has been investigated. The convective heat-transfer coefficient h between the substrate and the coolant was found to be the primary impediment to achieving low thermal resistance. For laminar flow in confined channels, h scales inversely with channel width, making microscopic channels desirable. The coolant viscosity determines the minimum practical channel width. The use of high-aspect ratio channels to increase surface area will, to an extent, further reduce thermal resistance. Based on these considerations, a new, very compact, water-cooled integral heat sink for silicon integrated circuits has been designed and tested. At a power density of 790 W/cm2, a maximum substrate temperature rise of 71°C above the input water temperature was measured, in good agreement with theory. By allowing such high power densities, the heat sink may greatly enhance the feasibility of ultrahigh-speed VLSI circuits.
4,214 citations
TL;DR: In this paper, it was shown that a "nanofluid" consisting of copper nanometer-sized particles dispersed in ethylene glycol has a much higher effective thermal conductivity than either pure or pure glycol or even polyethylene glycol containing the same volume fraction of dispersed oxide nanoparticles.
Abstract: It is shown that a “nanofluid” consisting of copper nanometer-sized particles dispersed in ethylene glycol has a much higher effective thermal conductivity than either pure ethylene glycol or ethylene glycol containing the same volume fraction of dispersed oxide nanoparticles. The effective thermal conductivity of ethylene glycol is shown to be increased by up to 40% for a nanofluid consisting of ethylene glycol containing approximately 0.3 vol % Cu nanoparticles of mean diameter <10 nm. The results are anomalous based on previous theoretical calculations that had predicted a strong effect of particle shape on effective nanofluid thermal conductivity, but no effect of either particle size or particle thermal conductivity.
3,551 citations