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All figures (11)
Fig. 9 Condenser-side surface temperature difference from the mean, normalized by the device power (profile drawn along the length of the device passing through the center)
Fig. 2 Schematic diagram of the test section (top inset shows the heater block assembly)
Fig. 6 (a) Calibrated numerical model estimates of the heat loss and (b) junction-to-ambient temperature differences, as a function of input power for the copper and aluminum heat spreaders
Fig. 7 Thermal resistance as a function of power for the solid copper spreader and the vapor chamber
Fig. 1 Schematic diagram of vapor chamber operation
Fig. 8 Contours of the condenser-side surface temperature for the (a) vapor chamber and (b) solid copper spreader at device heat inputs of approximately 1 W (left) and 2 W (right). Note the different temperature scales.
Fig. 10 Spreading metric for the prototype vapor chamber relative to the solid copper heat spreader as a function of device heat input
Table 1 Heat-loss calibration data set
Fig. 4 Exploded view of the numerical conduction model domain and boundary conditions
Fig. 3 Photograph of the experimental facility
Fig. 5 Comparison of thermocouple temperatures obtained from experiments against those from the simulations at an electrical heat input of 1 W and ambient temperature of 298.2 K. Each bar is an average temperature from each grouping of thermocouples.
Journal Article
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DOI
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A Method for Thermal Performance Characterization of Ultrathin Vapor Chambers Cooled by Natural Convection
[...]
Gaurav Patankar
1
,
Simone Mancin
1
,
Justin A. Weibel
1
,
Suresh V. Garimella
1
,
Mark MacDonald
2
- Show less
+1 more
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Institutions (2)
Purdue University
1
,
Intel
2
01 Mar 2016
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Journal of Electronic Packaging