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Fig. 7 Thermal resistance as a function of power for the solid copper spreader and the vapor chamber
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Journal Article
•
DOI
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A Method for Thermal Performance Characterization of Ultrathin Vapor Chambers Cooled by Natural Convection
[...]
Gaurav Patankar
1
,
Simone Mancin
1
,
Justin A. Weibel
1
,
Suresh V. Garimella
1
,
Mark MacDonald
2
- Show less
+1 more
•
Institutions (2)
Purdue University
1
,
Intel
2
01 Mar 2016
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Journal of Electronic Packaging