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Journal ArticleDOI

A Monolithic, 500 degrees C Operational Amplifier in 4H-SiC Bipolar Technology

16 May 2014-IEEE Electron Device Letters (IEEE)-Vol. 35, Iss: 7, pp 693-695
TL;DR: In this article, a monolithic bipolar operational amplifier (opamp) fabricated in 4H-SiC technology is presented, which is used in an inverting negative feedback amplifier configuration.
Abstract: A monolithic bipolar operational amplifier (opamp) fabricated in 4H-SiC technology is presented. The opamp has been used in an inverting negative feedback amplifier configuration. Wide temperature ...

Summary (1 min read)

I. INTRODUCTION

  • ILICON Carbide (SiC) technology is a promising candidate for circuits operating in harsh environments with extreme ambient temperature up to 600°C, well beyond the present temperature limit of Silicon on Insulator (SOI) technology [1, 2] .
  • CMOS ICs have been demonstrated to operate up to 400°C to date [9] whereas JFET and bipolar devices suggest better reliability and stability by eliminating gate oxide and relying on p-n junctions [10, 11] .
  • In [8] an integrated opamp in SiC JFET was fabricated and characterized up to 576°C; however, BJTs have higher speed and better linearity and driving capability compared to JFETs.
  • Although The Swedish Foundation for Strategic Research is acknowledged for funding.
  • Fig. 1 (a) shows the cross section of the NPN transistor with the thickness and doping of the six epitaxial layers.

II. OPAMP DESIGN

  • The main purpose of designing and fabricating this opamp is to demonstrate the feasibility of bipolar SiC analog circuit operating in a wide temperature range.
  • In the proposed opamp the input stage is a differential amplifier with resistive loads (R C1,2 ).
  • In addition, a buffer has been used between the first and second stage to decrease the loading effect on the first stage.
  • Owing to the low output impedance of this topology the circuit is capable of driving low resistances.
  • To acquire sufficient gain accuracy, a high open loop gain is desired.

III. EXPERIMENTAL RESULTS

  • The fabricated opamp was characterized in the range 25°C to 500°C using on wafer measurements in a high temperature probe station.
  • It is sufficient to preserve a relatively constant closed-loop gain over the wide temperature range.
  • The load sees lower resistance in the positive going edge, which results in the higher positive slew rate.
  • Power supply rejection ratio (PSRR) for the positive and negative lines are measured separately.
  • Very little linearity degradation has been identified at 500°C.

IV. CONCLUSION

  • A monolithic 4H-SiC bipolar two-stage opamp has been fabricated and characterized.
  • Successful operation of the opamp with stable gain has been demonstrated over a wide temperature range from 25°C up to 500°C.

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This is the accepted version of a paper published in IEEE Electron Device Letters. This paper has been
peer-reviewed but does not include the final publisher proof-corrections or journal pagination.
Citation for the original published paper (version of record):
Hedayati, R., Lanni, L., Rodriguez, S., Malm, B G., Rusu, A. et al. (2014)
A Monolithic, 500 degrees C Operational Amplifier in 4H-SiC Bipolar Technology.
IEEE Electron Device Letters, 35(7): 693-695
http://dx.doi.org/10.1109/LED.2014.2322335
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1
Abstract A monolithic bipolar operational amplifier (opamp)
fabricated in 4H-SiC technology is presented. The opamp has
been used in an inverting negative feedback amplifier
configuration. Wide temperature operation of the amplifier is
demonstrated from 25°C to 500°C. The measured closed loop
gain is around 40 dB for all temperatures whereas the 3dB
bandwidth increases from 270 kHz at 25°C to 410 kHz at 500°C.
The opamp achieves 1.46 V/µs slew rate and 0.25% Total
Harmonic Distortion (THD). This is the first report on high
temperature operation of a fully integrated SiC bipolar opamp
which demonstrates the feasibility of this technology for high
temperature analog integrated circuits (ICs).
Index Terms— Bipolar integrated circuits (ICs), High
temperature ICs, Negative feedback, Operational amplifiers.
I. INTRODUCTION
ILICON Carbide (SiC) technology is a promising
candidate for circuits operating in harsh environments with
extreme ambient temperature up to 600°C, well beyond the
present temperature limit of Silicon on Insulator (SOI)
technology [1, 2]. High temperature operation of GaN analog
and digital ICs have been reported up to 375°C to date [3, 4].
The key advantages of SiC are its wide bandgap (3.2eV for
4H-SiC), and high critical electric field (2.2 MV/cm) [5]
enabling operation at high temperature in applications
including Venus exploration, oil and gas drilling, aviation, and
automotive industries.
Operational amplifiers are widely used in analog and mixed
signal systems. High temperature opamps have been
demonstrated using SiC MOSFETs and JFETs [6-8]. SiC
MOSFET ICs suffer from reliability issues of the gate oxide at
elevated temperatures. CMOS ICs have been demonstrated to
operate up to 400°C to date [9] whereas JFET and bipolar
devices suggest better reliability and stability by eliminating
gate oxide and relying on p-n junctions [10, 11]. In [7] an
opamp based on discrete SiC JFET devices was fabricated and
characterized only at room temperature. In [8] an integrated
opamp in SiC JFET was fabricated and characterized up to
576°C; however, BJTs have higher speed and better linearity
and driving capability compared to JFETs.
This paper reports on performance of a monolithic two-
stage opamp with negative feedback, fabricated in a 4H-SiC
bipolar technology, over a wide temperature range. Although
The Swedish Foundation for Strategic Research is acknowledged for
funding. The authors are with the KTH Royal Institute of Technology, School
of ICT, Kista SE-16440, Sweden (email: rahelehh@kth.se)
only NPN transistors with resistive loads were used, open loop
gain of the opamp is still high enough and achieves stable
closed loop gain with less than 0.5 dB gain reduction from
25°C to 500°C.
The integrated opamp has been fabricated on 4-inch SiC
wafers with 6 epi layers. Emitter, base, and collector mesas
were plasma etched. Only NPN transistors (area 0.01 mm
2
)
and one metal layer for interconnects were available and used.
However, a recent report [12] reveals the potential use of PNP
transistors in future work. More details about the processing
are presented in [13].
Fig.1 (a) shows the cross section of the NPN transistor with
the thickness and doping of the six epitaxial layers. The
measured forward current gain (ß) versus collector current at
V
BC
= 0 V is illustrated Fig.1 (b) in which the maximum ß is
reduced from 38 at 25°C to 15 at 500°C. The Spice Gummel
Poon (SGP) model based on extracted parameters at 25°C and
225°C from [14] are used to simulate the circuit using
Cadence Spectre. As indicated in Fig.1 (b) with the dashed
lines, transistors of the opamp are biased at different operating
points between 0.4 mA for the input pair and 14 mA for the
output stage exhibiting ß ranging from 22 to 36 at room
temperature.
II. O
PAMP DESIGN
The main purpose of designing and fabricating this opamp
is to demonstrate the feasibility of bipolar SiC analog circuit
operating in a wide temperature range. The opamp circuit with
±7.5 V dual supply is illustrated in Fig.2 (a). It is composed of
two gain stages, buffers, a level shifter and an output stage.
In the proposed opamp the input stage is a differential
amplifier with resistive loads (R
C1,2
). A single ended
differential pair is used as the second stage. In addition, a
buffer has been used between the first and second stage to
decrease the loading effect on the first stage. A symmetrical
layout of the differential input is attempted to improve the
matching, thus reducing the input offset voltage. In the next
stage, a level shifter composed of a transistor, Q
7
, a resistor,
R
3
, and a current source, Q
17
is used to shift the output dc level
to zero. An output stage formed by Q
9
and Q
10
is chosen as the
last stage. Owing to the low output impedance of this topology
the circuit is capable of driving low resistances. In addition,
large swing between
󰇛
V

V

󰇜
and
󰇛
V

V

󰇜
is
provided at the output.
Accordingly, the low frequency open loop gain of the
A Monolithic, 500°C Operational Amplifier in
4H-SiC Bipolar Technology
Raheleh Hedayati, Luigia Lanni, Saul Rodriguez, Member, IEEE, B. Gunnar Malm, Senior Member,
IEEE, Ana Rusu, Member, IEEE, and Carl-Mikael Zetterling, Senior Member, IEEE
S

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2
opamp is given by


∙

∙

󰇛
,
∙

󰇜
∙

, (1)
where gm
,
is the transconductance of Q
,
and


,
󰇛
,

,
󰇛
,

,
∙
󰇜󰇜 is the effective load of the
single ended amplifier. Equation (1) implies that the open loop
gain is temperature dependent. The simulated open-loop gain
decreases from 79 dB at 25°C to 68 dB at 225°C respectively.
Provided that there is enough loop gain in the negative
feedback configuration this dependency can be mitigated.
Precise gain with high linearity can be achieved, using
negative feedback. The opamp has been used in a negative
feedback configuration which is illustrated in Fig.2 (b). The
closed loop gain (A
CL
) is expressed as







≅
. (2)
To acquire sufficient gain accuracy, a high open loop gain is
desired. In this process, the integrated resistors, with ratio of
R
2
/R
1
=100, are implemented in the highly doped collector
epitaxial layer resulting in

100. An integrated
capacitor (C
3
) of 6 pF parallel to R
2
was used to improve the
stability. In addition, lag compensation is realized by an
integrated 4 pF capacitor, C
2
, which rolls-off half of the
contribution of the first stage at high frequencies.
III. E
XPERIMENTAL RESULTS
The fabricated opamp was characterized in the range 25°C to
500°C using on wafer measurements in a high temperature
probe station. Although no reliability testing has been
performed, no performance degradation was seen during the
two hours measurements at 500°C. Fig.3 shows the
microphotograph of the opamp in closed-loop configuration.
The Miller compensation method has been used to stabilize
the closed loop opamp. An integrated 30 pF Miller capacitor
(C
1
) was implemented for compensation; however, in the
measurement 30 pF did not provide stability thus an extra 330
pF off-chip capacitor (C
ext
) was also required to stabilize the
opamp. This method results in much smaller bandwidth by
imposing a dominant low frequency pole at the input of the
second stage.
The critical parameters of opamp have been measured.
Fig.4 shows the frequency response of the closed-loop opamp
with RL= 500 connected to the output at different
temperatures. The achieved DC gain and gain bandwidth
(GBW) at room temperature are 39.86 dB and 5.92 MHz,
respectively. Increasing temperature up to 500°C results in a
slight gain and GBW reduction to 39.46 dB and 4.36 MHz,
respectively. However, the 3dB bandwidth increases from 270
kHz at room temperature to 410 kHz at 500°C. As the
temperature increases up to approximately 200°C, the value of
the integrated resistors decreases. In particular, the reduction
of R
bias
results in larger currents available at the output of the
current mirrors. The increase of biasing currents and reduction
of resistor values have two visible effects on the performance
of the amplifier. First, the cutoff frequency (f
t
) of the
transistors increases, which in addition to smaller RC
constants enable the amplifier to achieve larger bandwidth
(BW). Second, the slew rate (SR) increases at higher
temperatures. Although the extrapolated results from (2) show
that the open-loop gain of the opamp decreases from 76.3 dB
at room temperature to 64 dB at 500°C, it is sufficient to
preserve a relatively constant closed-loop gain over the wide
temperature range.
The measured dynamic range of the opamp at different
temperatures is shown in Fig.5 (a). The amplifier is working in
the linear region. With 7.5V dual supply voltage, the output
swing is 10 V at room temperature. Increasing temperature
results in slightly larger output swing due to negative
temperature coefficient of V
BE
i.e. -2 mV/°C. The opamp
achieves 10.6 V output swing at 500°C.
To measure the slew rate, a 33 pF capacitor (C
L
) in parallel
with a 500 resistor (R
L
) are connected externally as load.
Slew rate can be estimated as SR max󰇛

󰇜



. Since
the compensation capacitor,


360, is about
eleven times larger than the load capacitor, the output node is
not slew limiting. Fig.5 (b) shows the slew limiting of the step
response at the output of the opamp. All the external
components (R
L
, C
L
, and C
ext
) are kept at room temperature.
The positive and negative slew rates are1.46

and 1.25

respectively at room temperature. The load sees lower
resistance in the positive going edge, which results in the
higher positive slew rate. However, due to larger currents and
faster discharge at elevated temperatures a higher negative SR
of 2.16

has been identified at 500°C.
Power supply rejection ratio (PSRR) for the positive and
negative lines are measured separately. For this purpose, an
AC signal is injected to the corresponding power line, while
the input is grounded. The measured positive and negative
PSRR at 1kHz decreases from -88.8dB and -77.6 dB at 25°C
to -68.5 dB and -67.5 dB at 500°C.
Total Harmonic Distortion (THD) of the fabricated opamp
is derived from 󰇛

. . . 
󰇜/
with fundamental
frequency of 9.9 kHz. Considering the first nine harmonics of
the output spectrum from spectrum analyzer, THD of 0.25%
and 0.3% are achieved at 25°C and 500°C respectively. Very
little linearity degradation has been identified at 500°C. The
opamp is operational with similar performance for the supply
range between 5.5 V and 13.5 V and consumes 7 mA and
104 mA respectively.
Table I summarizes the measured performance of the
opamp in inverting configuration. Finally, a comparison of
high temperature opamps is provided in Table II. Higher gain
bandwidth was achieved compared to [8] due to inherently
higher speed of bipolar devices.
IV. C
ONCLUSION
A monolithic 4H-SiC bipolar two-stage opamp has been
fabricated and characterized. Successful operation of the
opamp with stable gain has been demonstrated over a wide
temperature range from 25°C up to 500°C. Stable closed-loop
gain with 0.4 dB gain reduction from 25°C to 500°C was
achieved.

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3
R
EFERENCES
[1] L. Toygur, A. C. Patil, J. Guo, et al., “A 300°C, SOI transimpedance
amplifier with application to capacitive temperature sensing.” IEEE
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Capacitors Realized in a Silicon-on-Insulator CMOS Technology.” J.
Microelectron. Electron. Packag., vol. 10, pp. 150-154, 2013.
[3] A. M. H. Kwan, X. Liu, and K. J. Chen, “Integrated gate-protected
HEMTs and mixed-signal functional blocks for GaN smart power ICs,”
IEEE International Electron Devices Meeting (IEDM), pp. 7–3, 2012.
[4] Y. Cai, et al., “High-temperature operation of AlGaN/GaN HEMTs
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Device Lett., vol. 28, pp. 328–331, 2007.
[5] C.-M. Zetterling, Process Technology for Silicon Carbide Devices.
London, UK: IET, 2002.
[6] Z. Stum, et al., “300
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C Silicon Carbide Integrated Circuits,” Mater. Sci.
Forum, vol. 679–680, pp. 730–733, 2011.
[7] A. Maralani and M. S. Mazzola, “The design of an operational amplifier
using silicon carbide JFETs,” IEEE Trans. On Circuits Syst., vol. 59,
pp. 255–265, 2012.
[8] A. C. Patil, et al., “Fully-monolithic, 600°C differential amplifiers in
6H-SiC JFET IC technology.” IEEE CICC, pp. 73-76, 2009.
[9] R. A. R. Young, et al., “High temperature digital and analogue
integrated circuits in silicon carbide,” Materials Science Forum, vol.
740, pp. 1065–1068, 2013.
[10] L. Lanni, B. G. Malm, M. Ostling, and C.-M. Zetterling, “500 Bipolar
Integrated OR/NOR Gate in 4H-SiC,” IEEE Electron Device Lett., vol.
34, pp. 1091–1093, 2013.
[11] P. G. Neudeck, et al., “Stable Electrical Operation of 6H-SiC JFETs and
ICs for Thousands of Hours at 500,” IEEE, Electron Device Lett. vol.
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Fig.1. (a) Cross section view of SiC NPN transistor and its microphotograph
(b) Measured ß versus I
C
of NPN transistor from 25°C to 500°C.
Fig.2. (a) Operational amplifier schematic (b) Opamp in closed loop
configuration.
Fig.3. Microphotograph of the Op-Amp with integrated feedback resistor
(Total area ~ 3.75 mm
2
)
Fig.4. Measured frequency response of the closed loop opamp by applying a
sinusoidal voltage with V
P-P
= 30 mV at the input from 25°C to 500°C.
Fig.5. (a) Output swing from 25°C to 500°C (b) Step response of the opamp
TABLE
I
M
EASURED
P
ERFORMANCE OF
T
HE
I
NVERTING
O
PAMP
Parameter 25°C 500°C
DC closed loop gain (dB) (R
L
= 500 ) 39.86 39.46
3dB-bandwidth (kHz) 270 410
Unity gain frequency (MHz) 5.92 4.36
Positive/Negative Slew Rate (V/µs) 1.46/1.25 1.46/2.16
Output swing (V) 10 10.6
Positive/Negative PSRR (dB) @ 1 kHz -88.8/-77.6 -68.5/-67.5
Total Harmonic Distortion -52dB/0.25% -50dB/0.3%
Input referred offset (mV) 0.24 0.79
Output resistance () 1.7 7
Input resistance () 101 138
Input referred noise (n
V
/
Hz)
835 -
Current consumption (mA) @ ±7.5 V 16 21
TABLE
II
C
OMPARISON OF
H
IGH
T
EMPERATURE
O
PAMPS IN
S
ILICON
C
ARBIDE
Technology Temperature A
OL
(dB)
Gain-Bandwidth
GBW(kHz)
4H-SiC MOSFET [6] 300°C 57 -
6H-SiC MOSFET [15] 300°C 53 269
6H-SiC JFET [8] 576°C 69 1400
4H-SiC bipolar (this work) 500°C 64 4360
(a)
(b)
C
1
C
2
C
3
Input stage with
resistive load
Second stage
(a)
(b)
R
1
R
1
R
2
C
1
C
1
Citations
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TL;DR: In this paper, short-term demonstrations of packaged 4H-SiC junction field effect transistor (JFET) logic integrated circuits (ICs) at temperatures exceeding 800 °C in air are reported, including a 26-transistor 11-stage ring oscillator that functioned at 961 °C ambient temperature.
Abstract: Short-term demonstrations of packaged 4H-SiC junction field-effect transistor (JFET) logic integrated circuits (ICs) at temperatures exceeding 800 °C in air are reported, including a 26-transistor 11-stage ring oscillator that functioned at 961 °C ambient temperature believed unprecedented for electrical operation of a semiconductor IC. The expanded temperature range should assist temperature acceleration testing/qualification of such ICs intended for long-term use in applications near 500 °C ambient, and perhaps spawn new applications. Ceramic package assembly leakage currents inhibited the determination of some intrinsic SiC device/circuit performance properties at these extreme temperatures, so it is conceivable that even higher operating temperatures might be obtained from SiC JFET ICs by employing packaging and circuit design intended/optimized for T $\ge800$ °C.

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Abstract: This paper is an important step toward the development of complex integrated circuit (IC) control electronics that have to attend to high-temperature environment power applications. We present in premiere a prototype set of essential mixed-signal ICs on SiC capable of controlling power switches and a lateral power MESFET able to operate at high temperatures, all embedded on the same chip. Also, we report for the first time the functionality of standard Si-CMOS topologies on SiC for the master–slave data flip-flop (FF) and data-reset FF digital building blocks designed with MESFETs. Concretely, we present the complete development of SiC-MESFET IC circuitry, able to integrate gate drivers for SiC power devices. This development is based on the mature and stable Tungsten–Schottky interface technology used for the fabrication of stable SiC Schottky diodes for the European Space Agency Mission BepiColombo.

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Cites background from "A Monolithic, 500 degrees C Operati..."

  • ...two-stage opamp [10] and up to 300 ◦C of a SiC-IC linear voltage regulator fabricated on 4H-SiC NMOS technology [11]....

    [...]

Journal ArticleDOI
TL;DR: In this paper, fabrication and testing of integrated circuits (ICs) with two levels of interconnect that consistently achieve greater than 1000 h of stable electrical operation at 500 °C in air ambient.
Abstract: This letter reports fabrication and testing of integrated circuits (ICs) with two levels of interconnect that consistently achieve greater than 1000 h of stable electrical operation at 500 °C in air ambient. These ICs are based on 4H-SiC junction field-effect transistor technology that integrates hafnium ohmic contacts with TaSi2 interconnects and SiO2 and Si3N4 dielectric layers over $\sim 1$ - $\mu \text{m}$ scale vertical topology. Following initial burn-in, important circuit parameters remain stable within 15% for more than 1000 h of 500 °C operational testing. These results advance the technology foundation for realizing long-term durable 500 °C ICs with increased functional capability for sensing and control combustion engine, planetary, deep-well drilling, and other harsh-environment applications.

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TL;DR: The critical components, namely SiC power devices and modules, gate drives, and passive components, are introduced and comparatively analyzed regarding composition material, physical structure, and packaging technology, as well as MEMS devices.
Abstract: The significant advance of power electronics in today's market is calling for high-performance power conversion systems and MEMS devices that can operate reliably in harsh environments, such as high working temperature. Silicon-carbide (SiC) power electronic devices are featured by the high junction temperature, low power losses, and excellent thermal stability, and thus are attractive to converters and MEMS devices applied in a high-temperature environment. This paper conducts an overview of high-temperature power electronics, with a focus on high-temperature converters and MEMS devices. The critical components, namely SiC power devices and modules, gate drives, and passive components, are introduced and comparatively analyzed regarding composition material, physical structure, and packaging technology. Then, the research and development directions of SiC-based high-temperature converters in the fields of motor drives, rectifier units, DC-DC converters are discussed, as well as MEMS devices. Finally, the existing technical challenges facing high-temperature power electronics are identified, including gate drives, current measurement, parameters matching between each component, and packaging technology.

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TL;DR: In this paper, the authors demonstrate longer electrical operation of two silicon carbide (4H-SiC) junction field effect transistor (JFET) ring oscillator ICs tested with chips directly exposed (no cooling and no protective chip packaging) to a high-fidelity physical and chemical reproduction of Venus' surface atmosphere.
Abstract: The prolonged operation of semiconductor integrated circuits (ICs) needed for long-duration exploration of the surface of Venus has proven insurmountably challenging to date due to the ∼ 460 °C, ∼ 9.4 MPa caustic environment. Past and planned Venus landers have been limited to a few hours of surface operation, even when IC electronics needed for basic lander operation are protected with heavily cumbersome pressure vessels and cooling measures. Here we demonstrate vastly longer (weeks) electrical operation of two silicon carbide (4H-SiC) junction field effect transistor (JFET) ring oscillator ICs tested with chips directly exposed (no cooling and no protective chip packaging) to a high-fidelity physical and chemical reproduction of Venus’ surface atmosphere. This represents more than 100-fold extension of demonstrated Venus environment electronics durability. With further technology maturation, such SiC IC electronics could drastically improve Venus lander designs and mission concepts, fundamentally enabli...

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References
More filters
MonographDOI
01 Jan 2002
TL;DR: Zetterling, S.M.Ostling and S.J.Pearton as mentioned in this paper, S.Sveinbjornsson, S.-K.Lee, and M.
Abstract: Introduction 1 Advantages of SiC C.-M.Zetterling and M.Ostling 2 Bulk and epitaxial growth of SiC N.Nordell 3 Ion implantation and diffusion in SiC A.Schoner 4 Wet and dry etching of SiC S.J.Pearton 5 Thermally grown and deposited thermoelectrics E.O.Sveinbjornsson and C.-M.Zetterling 6 Schottky and ohmic contacts to SiC C.-M.Zetterling, S.-K.Lee and M.Ostling 7 Devices in SiC C.-M.Zetterling, S.M.Koo and M.Ostling Appendix 1: Other resources Appendix 2: Glossary Index

218 citations


"A Monolithic, 500 degrees C Operati..." refers background in this paper

  • ...The key advantages of SiC are its wide bandgap (3.2 eV for 4H-SiC), and high critical electric field (2.2 MV/cm) [5] enabling operation at high temperature in applications including Venus exploration, oil and gas drilling, aviation, and automotive industries....

    [...]

  • ...2 MV/cm) [5] enabling operation at high temperature in applications including Venus exploration, oil and gas drilling, aviation, and automotive industries....

    [...]

Journal ArticleDOI
TL;DR: In this article, the fabrication and testing of the first semiconductor transistors and small-scale integrated circuits (ICs) to achieve up to 3000 h of stable electrical operation at 500degC in air ambient is reported.
Abstract: The fabrication and testing of the first semiconductor transistors and small-scale integrated circuits (ICs) to achieve up to 3000 h of stable electrical operation at 500degC in air ambient is reported. These devices are based on an epitaxial 6H-SiC junction field-effect transistor process that successfully integrated high-temperature ohmic contacts, dielectric passivation, and ceramic packaging. Important device and circuit parameters exhibited less than 10% of change over the course of the 500degC operational testing. These results establish a new technology foundation for realizing durable 500degC ICs for combustion-engine sensing and control, deep-well drilling, and other harsh-environment applications.

121 citations


"A Monolithic, 500 degrees C Operati..." refers background in this paper

  • ...CMOS ICs have been demonstrated to operate up to 400 °C to date [9] whereas JFET and bipolar devices suggest better reliability and stability by eliminating gate oxide and relying on p-n junctions [10], [11]....

    [...]

Journal ArticleDOI
TL;DR: In this article, the authors present the high-temperature performance of AlGaN/GaN HEMT direct-coupled FET logic (DCFL) integrated circuits.
Abstract: This letter presents the high-temperature performance of AlGaN/GaN HEMT direct-coupled FET logic (DCFL) integrated circuits. At 375 degC, enhancement-mode (E-mode) AlGaN/GaN HEMTs which are used as drivers in DCFL circuits exhibit proper E-mode operation with a threshold voltage (VTH) of 0.24 V and a peak current density of 56 mA/mm. The monolithically integrated E/D-mode AlGaN/GaN HEMTs DCFL circuits deliver stable operations at 375 degC: An E/D-HEMT inverter with a drive/load ratio of 10 exhibits 0.1 V for logic-low noise margin (NML) and 0.3 V for logic-high-noise margin (NMH) at a supply voltage (VDD) of 3.0 V; a 17-stage ring oscillator exhibits a maximum oscillation frequency of 66 MHz, corresponding to a minimum propagation delay ( taupd) of 446 ps/stage at VDD of 3.0 V

114 citations


"A Monolithic, 500 degrees C Operati..." refers background in this paper

  • ...High temperature operation of GaN analog and digital ICs have been reported up to 375 °C to date [3], [4]....

    [...]

Journal ArticleDOI
TL;DR: In this article, the performance of low-voltage 4H-SiC n-p-n bipolar transistors and digital integrated circuits based on emitter coupled logic is reported from -40 °C to 500 °C.
Abstract: Successful operation of low-voltage 4H-SiC n-p-n bipolar transistors and digital integrated circuits based on emitter coupled logic is reported from -40 °C to 500 °C. Nonmonotonous temperature dependence (previously predicted by simulations but now measured) was observed for the transistor current gain; in the range -40 °C-300 °C it decreased when the temperature increased, while it increased in the range 300 °C-500 °C. Stable noise margins of ~ 1 V were measured for a 2-input OR/NOR gate operated on -15 V supply voltage from 0 °C to 500 °C for both OR and NOR output.

84 citations

Journal ArticleDOI
TL;DR: In this article, the performance of low-voltage 4H-SiC n-p-n bipolar transistors and digital integrated circuits based on emitter-coupled logic is demonstrated.
Abstract: Operation up to 300 °C of low-voltage 4H-SiC n-p-n bipolar transistors and digital integrated circuits based on emitter-coupled logic is demonstrated. Stable noise margins of about 1 V are reported for a two-input or- nor gate operated on - 15 V supply voltage from 27 °C up to 300 °C. In the same temperature range, an oscillation frequency of about 2 MHz is also reported for a three-stage ring oscillator.

61 citations


"A Monolithic, 500 degrees C Operati..." refers methods in this paper

  • ...The Spice Gummel Poon (SGP) model based on extracted parameters at 25 °C and 225 °C from [14] are used to simulate the circuit...

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Frequently Asked Questions (8)
Q1. What capacitor was used to compensate the opamp?

An integrated 30 pF Miller capacitor (C1) was implemented for compensation; however, in the measurement 30 pF did not provide stability thus an extra 330 pF off-chip capacitor (Cext) was also required to stabilize the opamp. 

In addition, lag compensation is realized by an integrated 4 pF capacitor, C2, which rolls-off half of the contribution of the first stage at high frequencies. 

Since the compensation capacitor, ‖ 360 , is about eleven times larger than the load capacitor, the output node is not slew limiting. 

due to larger currents and faster discharge at elevated temperatures a higher negative SR of 2.16 has been identified at 500°C. 

In the next stage, a level shifter composed of a transistor, Q7, a resistor, R3, and a current source, Q17 is used to shift the output dc level to zero. 

Total Harmonic Distortion (THD) of the fabricated opamp is derived from . . . / with fundamental frequency of 9.9 kHz. Considering the first nine harmonics of the output spectrum from spectrum analyzer, THD of 0.25% and 0.3% are achieved at 25°C and 500°C respectively. 

Although the extrapolated results from (2) show that the open-loop gain of the opamp decreases from 76.3 dB at room temperature to 64 dB at 500°C, it is sufficient to preserve a relatively constant closed-loop gain over the wide temperature range. 

The main purpose of designing and fabricating this opampis to demonstrate the feasibility of bipolar SiC analog circuit operating in a wide temperature range.