A New Fluid-Chip Co-Design for Digital Microfluidic Biochips Considering Cost Drivers and Design Convergence
Citations
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Cites background from "A New Fluid-Chip Co-Design for Digi..."
...Like traditional DMFBs, through analyzing the activation sequences, a compatibility graph (Gcom) for a group of electrodes can be acquired [9], [15], where an edge denotes the compatibility between the electrode pairs....
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...NP-hard [15], [25], [26]) is aimed to assure a higher quality solution of the fluid level, control level, and overall codesign....
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...If the associated goals for fluid- and control-level tasks are viewed in isolation, a “good” result from a phase may guide to an “unsatisfactory” outcome for the succeeding phases [15]–[17]....
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...wiring in a microfluidic platform [8], [15], [16]....
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References
23 citations
"A New Fluid-Chip Co-Design for Digi..." refers background in this paper
...able sized droplets on a chip [7], [8], [9]....
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22 citations
20 citations
"A New Fluid-Chip Co-Design for Digi..." refers methods in this paper
...[21] first proposed a co-design method-...
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...While the first design scheme (which follows the basic idea of [21]) assumes a dedi-...
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...To show the effectiveness of the proposed co-design, we consider three state-of-the-art design methods for DMFBs among which one is an integrated fluid-chip co-design [21], one is a PCB layer wire routing [23], and the other one is the traditional design process....
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18 citations
"A New Fluid-Chip Co-Design for Digi..." refers background or methods or result in this paper
...Moreover, we have taken the measures of the pin count and layer count for a Naive method as presented in [23]....
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...Table 4 shows the results of pin count and layer count obtained in [23] and our proposed method....
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...[23] proposed a PCB constrained wire routing model for DMFBs....
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...In [23], to obtain the wire routing followed by layer allocation, two methods were introduced, which are Layered Negotiated Congestion (LNC) and Layer Minimized Negotiated Congestion (LMNC)....
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...We further compare our work with another design flow presented in [23] that offers chip-level solutions....
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11 citations
"A New Fluid-Chip Co-Design for Digi..." refers background in this paper
...However, in 2013, [22] first considered the issue of multi-layer printed circuit board (or PCB) during wire routing, while in 2017, McDaniel et al....
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